ATE261503T1 - Verfahren zur herstellung eines siliziumeinkristalles mittels eines elektrischen potentials - Google Patents
Verfahren zur herstellung eines siliziumeinkristalles mittels eines elektrischen potentialsInfo
- Publication number
- ATE261503T1 ATE261503T1 AT00941581T AT00941581T ATE261503T1 AT E261503 T1 ATE261503 T1 AT E261503T1 AT 00941581 T AT00941581 T AT 00941581T AT 00941581 T AT00941581 T AT 00941581T AT E261503 T1 ATE261503 T1 AT E261503T1
- Authority
- AT
- Austria
- Prior art keywords
- producing
- single crystal
- silicon single
- electrical potential
- silicon
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract 5
- 229910052710 silicon Inorganic materials 0.000 title abstract 5
- 239000010703 silicon Substances 0.000 title abstract 5
- 239000013078 crystal Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/10—Crucibles or containers for supporting the melt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/362,103 US6228165B1 (en) | 1999-07-28 | 1999-07-28 | Method of manufacturing crystal of silicon using an electric potential |
| PCT/US2000/016956 WO2001009411A1 (en) | 1999-07-28 | 2000-06-21 | Method of manufacturing crystal of silicon using an electric potential |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE261503T1 true ATE261503T1 (de) | 2004-03-15 |
Family
ID=23424712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT00941581T ATE261503T1 (de) | 1999-07-28 | 2000-06-21 | Verfahren zur herstellung eines siliziumeinkristalles mittels eines elektrischen potentials |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6228165B1 (de) |
| EP (1) | EP1200649B1 (de) |
| JP (1) | JP2003505335A (de) |
| AT (1) | ATE261503T1 (de) |
| AU (1) | AU5627200A (de) |
| DE (1) | DE60008880T2 (de) |
| DK (1) | DK1200649T3 (de) |
| WO (1) | WO2001009411A1 (de) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6632277B2 (en) | 1999-07-14 | 2003-10-14 | Seh America, Inc. | Optimized silicon wafer gettering for advanced semiconductor devices |
| US6454852B2 (en) | 1999-07-14 | 2002-09-24 | Seh America, Inc. | High efficiency silicon wafer optimized for advanced semiconductor devices |
| US6395085B2 (en) | 1999-07-14 | 2002-05-28 | Seh America, Inc. | Purity silicon wafer for use in advanced semiconductor devices |
| US6228165B1 (en) | 1999-07-28 | 2001-05-08 | Seh America, Inc. | Method of manufacturing crystal of silicon using an electric potential |
| FR2799194B1 (fr) * | 1999-10-05 | 2001-12-14 | Corning Sa | Billes d'un fluorure d'alcalin ou d'alcalino-terreux polycristallin, leur preparation et leur utilisation pour preparer des monocristaux |
| FR2810342B1 (fr) * | 2000-06-20 | 2002-11-29 | Commissariat Energie Atomique | Procede de cristallogenese avec champ magnetique |
| US6514337B2 (en) * | 2001-02-07 | 2003-02-04 | Seh America, Inc. | Method of growing large-diameter dislocation-free<110> crystalline ingots |
| US8124455B2 (en) * | 2005-04-02 | 2012-02-28 | Stats Chippac Ltd. | Wafer strength reinforcement system for ultra thin wafer thinning |
| US7514192B2 (en) * | 2005-12-12 | 2009-04-07 | Xerox Corporation | Photoconductive members |
| JP4788444B2 (ja) * | 2006-04-04 | 2011-10-05 | 株式会社Sumco | シリコン単結晶の製造方法 |
| JP5007596B2 (ja) * | 2007-04-03 | 2012-08-22 | 信越半導体株式会社 | 単結晶の成長方法および単結晶の引き上げ装置 |
| WO2009104532A1 (ja) * | 2008-02-18 | 2009-08-27 | 株式会社Sumco | シリコン単結晶成長方法 |
| JP4983705B2 (ja) | 2008-04-10 | 2012-07-25 | 株式会社Sumco | シリコン単結晶の金属汚染評価方法 |
| JP5169455B2 (ja) * | 2008-05-08 | 2013-03-27 | 信越半導体株式会社 | 単結晶の成長方法および単結晶の引き上げ装置 |
| JP5047227B2 (ja) | 2009-05-27 | 2012-10-10 | ジャパンスーパークォーツ株式会社 | シリコン単結晶の製造方法及びシリコン単結晶引き上げ装置 |
| JP5201083B2 (ja) * | 2009-06-04 | 2013-06-05 | 株式会社Sumco | シリコン単結晶の育成方法及びシリコン半導体基板の製造方法 |
| JP5668717B2 (ja) * | 2012-04-19 | 2015-02-12 | 信越半導体株式会社 | シリコン単結晶の製造方法 |
| US10114039B1 (en) * | 2015-04-24 | 2018-10-30 | Johnstech International Corporation | Selectively geometric shaped contact pin for electronic component testing and method of fabrication |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2842467A (en) * | 1954-04-28 | 1958-07-08 | Ibm | Method of growing semi-conductors |
| DE1047390B (de) | 1957-08-02 | 1958-12-24 | Dr Joachim Lietz | Verfahren zur Verbesserung von handelsueblichem, durch kurzwellige Strahlung verfaerbbarem Quarzglas |
| US4330359A (en) | 1981-02-10 | 1982-05-18 | Lovelace Alan M Administrator | Electromigration process for the purification of molten silicon during crystal growth |
| US4548670A (en) * | 1984-07-20 | 1985-10-22 | Wedtech Corp. | Silicon melting and evaporation method for high purity applications |
| GB8427915D0 (en) | 1984-11-05 | 1984-12-12 | Tsl Thermal Syndicate Plc | Vitreous silica products |
| JPS62275087A (ja) | 1986-05-21 | 1987-11-30 | Kyushu Denshi Kinzoku Kk | 結晶引上炉の湯漏れ検出装置 |
| GB2198966A (en) | 1986-12-09 | 1988-06-29 | Westinghouse Electric Corp | Method of growing silicon dendritic-web crystals |
| US4935046A (en) | 1987-12-03 | 1990-06-19 | Shin-Etsu Handotai Company, Limited | Manufacture of a quartz glass vessel for the growth of single crystal semiconductor |
| JP2546736B2 (ja) | 1990-06-21 | 1996-10-23 | 信越半導体株式会社 | シリコン単結晶引上方法 |
| JP3132094B2 (ja) | 1991-10-22 | 2001-02-05 | 日立金属株式会社 | 単結晶の製造方法および単結晶製造装置 |
| US5803977A (en) | 1992-09-30 | 1998-09-08 | Applied Materials, Inc. | Apparatus for full wafer deposition |
| DE4428743A1 (de) | 1994-08-13 | 1996-02-22 | Georg Prof Dr Mueller | Verfahren und Vorrichtung zur Messung und Steuerung bzw. Regelung der Sauerstoffkonzentration in Siliciumschmelzen |
| JP3824675B2 (ja) | 1995-03-03 | 2006-09-20 | 有限会社デジタル・ウェーブ | 結晶製造装置 |
| JP3598634B2 (ja) | 1996-01-30 | 2004-12-08 | 信越半導体株式会社 | シリコン単結晶の製造方法 |
| EP0798765A3 (de) | 1996-03-28 | 1998-08-05 | Shin-Etsu Handotai Company Limited | Verfahren zur Herstellung einer Halbleiterscheibe mit einer Schicht zur Verhinderung der Verdampfung von Dotierstoffen auf der einen Oberfläche und einer epitaktischen Schicht auf der anderen Oberfläche |
| JP3491463B2 (ja) | 1996-08-19 | 2004-01-26 | 信越半導体株式会社 | シリコン鏡面ウェーハの製造方法およびシリコンウェーハの加工装置 |
| DE19637182A1 (de) | 1996-09-12 | 1998-03-19 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung von Halbleiterscheiben aus Silicium mit geringer Defektdichte |
| JPH1112079A (ja) | 1997-06-19 | 1999-01-19 | Komatsu Electron Metals Co Ltd | 結晶体の引上げ方法およびその引上げ装置 |
| KR100541882B1 (ko) | 1998-05-01 | 2006-01-16 | 왁커 엔에스씨이 코포레이션 | 실리콘 반도체 기판 및 그의 제조 방법 |
| US6077343A (en) * | 1998-06-04 | 2000-06-20 | Shin-Etsu Handotai Co., Ltd. | Silicon single crystal wafer having few defects wherein nitrogen is doped and a method for producing it |
| DE19847101C1 (de) | 1998-10-13 | 2000-05-18 | Wacker Siltronic Halbleitermat | CVD-Reaktor und Verfahren zur Herstellung einer mit einer epitaktischen Schicht versehenen Halbleiterscheibe |
| US6059875A (en) | 1999-01-11 | 2000-05-09 | Seh America, Inc. | Method of effecting nitrogen doping in Czochralski grown silicon crystal |
| US6375749B1 (en) | 1999-07-14 | 2002-04-23 | Seh America, Inc. | Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth |
| US6228165B1 (en) | 1999-07-28 | 2001-05-08 | Seh America, Inc. | Method of manufacturing crystal of silicon using an electric potential |
-
1999
- 1999-07-28 US US09/362,103 patent/US6228165B1/en not_active Expired - Lifetime
-
2000
- 2000-06-21 AT AT00941581T patent/ATE261503T1/de not_active IP Right Cessation
- 2000-06-21 WO PCT/US2000/016956 patent/WO2001009411A1/en not_active Ceased
- 2000-06-21 DE DE60008880T patent/DE60008880T2/de not_active Expired - Fee Related
- 2000-06-21 EP EP00941581A patent/EP1200649B1/de not_active Expired - Lifetime
- 2000-06-21 JP JP2001513663A patent/JP2003505335A/ja active Pending
- 2000-06-21 AU AU56272/00A patent/AU5627200A/en not_active Abandoned
- 2000-06-21 DK DK00941581T patent/DK1200649T3/da active
-
2001
- 2001-01-11 US US09/759,110 patent/US6565651B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE60008880T2 (de) | 2005-03-03 |
| EP1200649B1 (de) | 2004-03-10 |
| US20020020340A1 (en) | 2002-02-21 |
| JP2003505335A (ja) | 2003-02-12 |
| DE60008880D1 (de) | 2004-04-15 |
| WO2001009411A1 (en) | 2001-02-08 |
| DK1200649T3 (da) | 2004-07-12 |
| AU5627200A (en) | 2001-02-19 |
| US6565651B2 (en) | 2003-05-20 |
| US6228165B1 (en) | 2001-05-08 |
| EP1200649A1 (de) | 2002-05-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE261503T1 (de) | Verfahren zur herstellung eines siliziumeinkristalles mittels eines elektrischen potentials | |
| MY135877A (en) | Tungsten doped crucible and method for preparing same | |
| DE69833610D1 (de) | Verfahren und Vorrichtung zur Herstellung von Silicium Einkristallen mit verringerten Kristalldefekten und danach hergestellte Silicium Einkristall und Siliciumwafer | |
| SG106151A1 (en) | Quartz glass crucible for pulling up single silicon crystal and production method therefor | |
| DE69730591D1 (de) | Verfahren zur herstellung von polykristallinem dünnen film, verfahren zur herstellung von oxidsupraleitern und vorrichtung dafür | |
| DE69916177D1 (de) | Verfahren zur Herstellung eines Siliziumkarbid-Einkristalls | |
| ATE450895T1 (de) | Bevorzugte methode, elektrische leiterbahnen für die kontrolle eines elektronischen displays herzustellen | |
| DE69937803D1 (de) | Verfahren zur herstellung eines czochralski silizium wafers ohne sauerstoffniederschlag | |
| DE69802037D1 (de) | Verfahren und Vorrichtung zur Herstellung von einkristallinem Diamant | |
| DE60045463D1 (de) | Verfahren zur Herstellung einer elektrolumineszenten Anzeigevorrichtung | |
| DE69120032D1 (de) | Verfahren zur Feststellung der elektrischen Eigenschaften eines Silizium-Monokristalles | |
| DE60105941D1 (de) | Verfahren und Vorrichtung zur Herstellung von Siliziumkarbidkristallen unter Verwendung von Quellgasen | |
| DE60125689D1 (de) | Verfahren und Vorrichtung zur Herstellung von Siliziumkarbidkristallen unter Verwendung von Quellegasen | |
| DE60129376D1 (de) | Verfahren und Vorrichtung zur Herstellung von Quarzglaskörpern | |
| DE60041429D1 (de) | Verfahren zur herstellung von silicium einkristallen | |
| DE60210264D1 (de) | Verfahren zur herstellung von silizium einkristall mit verbesserter gate-oxid integrität | |
| DE60335616D1 (de) | Verfahren zur herstellung von siliciumeinkristallen, und dadurch hergestellte siliciumeinkristallwafer und siliciumeinkristallstab | |
| DE59901083D1 (de) | VORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG MINDESTENS EINES SiC-EINKRISTALLS | |
| ATE373119T1 (de) | Verfahren und vorrichtung zur kristallzüchtung | |
| DE60013451D1 (de) | Verfahren und vorrichtung zur herstellung von hochqualitativen einkristallen | |
| DE60005985D1 (de) | Verfahren zur herstellung eines silizium-einkristalles mit einem gleichmässigen zeittemperaturverlauf | |
| DE69919952D1 (de) | Verfahren zur herstellung eines silizumeinkristalls und wafer aus siliziumeinkristall | |
| DE60001521D1 (de) | Vorrichtung und Verfahren zur Herstellung von Halbleiterbauelementen | |
| DE50010007D1 (de) | Verfahren zur herstellung von wasserstoffperoxid | |
| DE60142201D1 (de) | Verfahren zur Herstellung von einkristallinem Siliziumkarbid |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
Ref document number: 1200649 Country of ref document: EP |
|
| REN | Ceased due to non-payment of the annual fee |