ATE450895T1 - Bevorzugte methode, elektrische leiterbahnen für die kontrolle eines elektronischen displays herzustellen - Google Patents

Bevorzugte methode, elektrische leiterbahnen für die kontrolle eines elektronischen displays herzustellen

Info

Publication number
ATE450895T1
ATE450895T1 AT00960181T AT00960181T ATE450895T1 AT E450895 T1 ATE450895 T1 AT E450895T1 AT 00960181 T AT00960181 T AT 00960181T AT 00960181 T AT00960181 T AT 00960181T AT E450895 T1 ATE450895 T1 AT E450895T1
Authority
AT
Austria
Prior art keywords
electronic display
thin film
control
preferred method
electrical conductors
Prior art date
Application number
AT00960181T
Other languages
English (en)
Inventor
Gregg Duthaler
Karl Amundson
Paul Drzaic
Peter Kazlas
Jianna Wang
Original Assignee
E Ink Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E Ink Corp filed Critical E Ink Corp
Application granted granted Critical
Publication of ATE450895T1 publication Critical patent/ATE450895T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Machines For Laying And Maintaining Railways (AREA)
  • Escalators And Moving Walkways (AREA)
  • Discharging, Photosensitive Material Shape In Electrophotography (AREA)
AT00960181T 1999-07-21 2000-07-21 Bevorzugte methode, elektrische leiterbahnen für die kontrolle eines elektronischen displays herzustellen ATE450895T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14495299P 1999-07-21 1999-07-21
PCT/US2000/040450 WO2001008242A1 (en) 1999-07-21 2000-07-21 Preferred methods for producing electrical circuit elements used to control an electronic display

Publications (1)

Publication Number Publication Date
ATE450895T1 true ATE450895T1 (de) 2009-12-15

Family

ID=22510909

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00960181T ATE450895T1 (de) 1999-07-21 2000-07-21 Bevorzugte methode, elektrische leiterbahnen für die kontrolle eines elektronischen displays herzustellen

Country Status (7)

Country Link
US (2) US6413790B1 (de)
EP (1) EP1198852B1 (de)
JP (1) JP4948726B2 (de)
AT (1) ATE450895T1 (de)
AU (1) AU7137800A (de)
DE (1) DE60043441D1 (de)
WO (1) WO2001008242A1 (de)

Families Citing this family (410)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7193625B2 (en) * 1999-04-30 2007-03-20 E Ink Corporation Methods for driving electro-optic displays, and apparatus for use therein
US7411719B2 (en) 1995-07-20 2008-08-12 E Ink Corporation Electrophoretic medium and process for the production thereof
US7259744B2 (en) * 1995-07-20 2007-08-21 E Ink Corporation Dielectrophoretic displays
US7327511B2 (en) 2004-03-23 2008-02-05 E Ink Corporation Light modulators
US7079305B2 (en) * 2001-03-19 2006-07-18 E Ink Corporation Electrophoretic medium and process for the production thereof
US7023420B2 (en) 2000-11-29 2006-04-04 E Ink Corporation Electronic display with photo-addressing means
US6866760B2 (en) * 1998-08-27 2005-03-15 E Ink Corporation Electrophoretic medium and process for the production thereof
US6120588A (en) 1996-07-19 2000-09-19 E Ink Corporation Electronically addressable microencapsulated ink and display thereof
US8139050B2 (en) 1995-07-20 2012-03-20 E Ink Corporation Addressing schemes for electronic displays
US7583251B2 (en) * 1995-07-20 2009-09-01 E Ink Corporation Dielectrophoretic displays
US7999787B2 (en) 1995-07-20 2011-08-16 E Ink Corporation Methods for driving electrophoretic displays using dielectrophoretic forces
US7848006B2 (en) 1995-07-20 2010-12-07 E Ink Corporation Electrophoretic displays with controlled amounts of pigment
US7167155B1 (en) 1995-07-20 2007-01-23 E Ink Corporation Color electrophoretic displays
ATE356369T1 (de) * 1996-07-19 2007-03-15 E Ink Corp Elektronisch adressierbare mikroverkapselte tinte
US7247379B2 (en) 1997-08-28 2007-07-24 E Ink Corporation Electrophoretic particles, and processes for the production thereof
US8040594B2 (en) 1997-08-28 2011-10-18 E Ink Corporation Multi-color electrophoretic displays
US7002728B2 (en) 1997-08-28 2006-02-21 E Ink Corporation Electrophoretic particles, and processes for the production thereof
US6704133B2 (en) 1998-03-18 2004-03-09 E-Ink Corporation Electro-optic display overlays and systems for addressing such displays
US7075502B1 (en) 1998-04-10 2006-07-11 E Ink Corporation Full color reflective display with multichromatic sub-pixels
EP1093600B1 (de) 1998-07-08 2004-09-15 E Ink Corporation Verfahren zur verbesserung der farbwiedergabe in elektrophoretischen vorrichtungen, welche mikrokapseln verwenden
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
US6724519B1 (en) * 1998-12-21 2004-04-20 E-Ink Corporation Protective electrodes for electrophoretic displays
US7012600B2 (en) 1999-04-30 2006-03-14 E Ink Corporation Methods for driving bistable electro-optic displays, and apparatus for use therein
US7119772B2 (en) 1999-04-30 2006-10-10 E Ink Corporation Methods for driving bistable electro-optic displays, and apparatus for use therein
US7119759B2 (en) 1999-05-03 2006-10-10 E Ink Corporation Machine-readable displays
US8115729B2 (en) 1999-05-03 2012-02-14 E Ink Corporation Electrophoretic display element with filler particles
US8009348B2 (en) 1999-05-03 2011-08-30 E Ink Corporation Machine-readable displays
US9786194B2 (en) 1999-06-11 2017-10-10 Sydney Hyman Image making medium compositions and images
US6825068B2 (en) 2000-04-18 2004-11-30 E Ink Corporation Process for fabricating thin film transistors
US7893435B2 (en) 2000-04-18 2011-02-22 E Ink Corporation Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough
US6816147B2 (en) 2000-08-17 2004-11-09 E Ink Corporation Bistable electro-optic display, and method for addressing same
US6650044B1 (en) * 2000-10-13 2003-11-18 Lumileds Lighting U.S., Llc Stenciling phosphor layers on light emitting diodes
US20020090980A1 (en) * 2000-12-05 2002-07-11 Wilcox Russell J. Displays for portable electronic apparatus
US6655286B2 (en) * 2001-01-19 2003-12-02 Lucent Technologies Inc. Method for preventing distortions in a flexibly transferred feature pattern
AU2002250304A1 (en) 2001-03-13 2002-09-24 E Ink Corporation Apparatus for displaying drawings
US6663820B2 (en) * 2001-03-14 2003-12-16 The Procter & Gamble Company Method of manufacturing microneedle structures using soft lithography and photolithography
US7679814B2 (en) 2001-04-02 2010-03-16 E Ink Corporation Materials for use in electrophoretic displays
US7230750B2 (en) 2001-05-15 2007-06-12 E Ink Corporation Electrophoretic media and processes for the production thereof
US8390918B2 (en) 2001-04-02 2013-03-05 E Ink Corporation Electrophoretic displays with controlled amounts of pigment
US20050156340A1 (en) * 2004-01-20 2005-07-21 E Ink Corporation Preparation of capsules
EP1666964B1 (de) * 2001-04-02 2018-12-19 E Ink Corporation Elektrophoretisches Medium mit verbesserter Bildstabilität
US6580545B2 (en) * 2001-04-19 2003-06-17 E Ink Corporation Electrochromic-nanoparticle displays
US20090009852A1 (en) * 2001-05-15 2009-01-08 E Ink Corporation Electrophoretic particles and processes for the production thereof
JP4188091B2 (ja) 2001-05-15 2008-11-26 イー インク コーポレイション 電気泳動粒子
WO2002093245A1 (en) * 2001-05-15 2002-11-21 E Ink Corporation Electrophoretic displays containing magnetic particles
US7110163B2 (en) 2001-07-09 2006-09-19 E Ink Corporation Electro-optic display and lamination adhesive for use therein
WO2003007067A1 (en) * 2001-07-09 2003-01-23 E Ink Corporation Electro-optic display and adhesive composition
US7535624B2 (en) 2001-07-09 2009-05-19 E Ink Corporation Electro-optic display and materials for use therein
US6982178B2 (en) * 2002-06-10 2006-01-03 E Ink Corporation Components and methods for use in electro-optic displays
AU2002354672A1 (en) * 2001-07-09 2003-01-29 E Ink Corporation Electro-optical display having a lamination adhesive layer
FR2827377B1 (fr) * 2001-07-13 2003-12-05 Poudres & Explosifs Ste Nale Dispositif d'allumage pour microcharges pyrotechniques
US6967640B2 (en) 2001-07-27 2005-11-22 E Ink Corporation Microencapsulated electrophoretic display with integrated driver
US6819471B2 (en) * 2001-08-16 2004-11-16 E Ink Corporation Light modulation by frustration of total internal reflection
GB2379083A (en) * 2001-08-20 2003-02-26 Seiko Epson Corp Inkjet printing on a substrate using two immiscible liquids
TW511303B (en) * 2001-08-21 2002-11-21 Wen-Jr He A light mixing layer and method
US6825970B2 (en) * 2001-09-14 2004-11-30 E Ink Corporation Methods for addressing electro-optic materials
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US6946676B2 (en) 2001-11-05 2005-09-20 3M Innovative Properties Company Organic thin film transistor with polymeric interface
US8593396B2 (en) 2001-11-20 2013-11-26 E Ink Corporation Methods and apparatus for driving electro-optic displays
US8558783B2 (en) 2001-11-20 2013-10-15 E Ink Corporation Electro-optic displays with reduced remnant voltage
US9412314B2 (en) 2001-11-20 2016-08-09 E Ink Corporation Methods for driving electro-optic displays
US7528822B2 (en) 2001-11-20 2009-05-05 E Ink Corporation Methods for driving electro-optic displays
US7952557B2 (en) 2001-11-20 2011-05-31 E Ink Corporation Methods and apparatus for driving electro-optic displays
US9530363B2 (en) 2001-11-20 2016-12-27 E Ink Corporation Methods and apparatus for driving electro-optic displays
CN102789764B (zh) 2001-11-20 2015-05-27 伊英克公司 驱动双稳态电光显示器的方法
US8125501B2 (en) 2001-11-20 2012-02-28 E Ink Corporation Voltage modulated driver circuits for electro-optic displays
US6885032B2 (en) 2001-11-21 2005-04-26 Visible Tech-Knowledgy, Inc. Display assembly having flexible transistors on a flexible substrate
US6603141B2 (en) * 2001-12-28 2003-08-05 Motorola, Inc. Organic semiconductor and method
US6821348B2 (en) * 2002-02-14 2004-11-23 3M Innovative Properties Company In-line deposition processes for circuit fabrication
US20030151118A1 (en) * 2002-02-14 2003-08-14 3M Innovative Properties Company Aperture masks for circuit fabrication
US6897164B2 (en) * 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication
US6950220B2 (en) * 2002-03-18 2005-09-27 E Ink Corporation Electro-optic displays, and methods for driving same
US7223672B2 (en) * 2002-04-24 2007-05-29 E Ink Corporation Processes for forming backplanes for electro-optic displays
WO2003092077A2 (en) 2002-04-24 2003-11-06 E Ink Corporation Electronic displays
US7190008B2 (en) 2002-04-24 2007-03-13 E Ink Corporation Electro-optic displays, and components for use therein
US6667215B2 (en) 2002-05-02 2003-12-23 3M Innovative Properties Method of making transistors
EP1361619A3 (de) * 2002-05-09 2007-08-15 Konica Corporation Organischer Dünnfilmtransistor, organischer Dünnfilmtransistorträger und dessen Herstellungsmethode
GB2388709A (en) 2002-05-17 2003-11-19 Seiko Epson Corp Circuit fabrication method
US6958848B2 (en) * 2002-05-23 2005-10-25 E Ink Corporation Capsules, materials for use therein and electrophoretic media and displays containing such capsules
US7033959B2 (en) * 2002-05-31 2006-04-25 Nokia Corporation Method for manufacturing organic semiconductor systems
US7583427B2 (en) 2002-06-10 2009-09-01 E Ink Corporation Components and methods for use in electro-optic displays
US7110164B2 (en) 2002-06-10 2006-09-19 E Ink Corporation Electro-optic displays, and processes for the production thereof
US7843621B2 (en) 2002-06-10 2010-11-30 E Ink Corporation Components and testing methods for use in the production of electro-optic displays
US9470950B2 (en) 2002-06-10 2016-10-18 E Ink Corporation Electro-optic displays, and processes for the production thereof
US8049947B2 (en) 2002-06-10 2011-11-01 E Ink Corporation Components and methods for use in electro-optic displays
US8363299B2 (en) 2002-06-10 2013-01-29 E Ink Corporation Electro-optic displays, and processes for the production thereof
US7649674B2 (en) 2002-06-10 2010-01-19 E Ink Corporation Electro-optic display with edge seal
US20080024482A1 (en) 2002-06-13 2008-01-31 E Ink Corporation Methods for driving electro-optic displays
JP4651383B2 (ja) 2002-06-13 2011-03-16 イー インク コーポレイション 電気光学表示装置の駆動の方法
US20110199671A1 (en) * 2002-06-13 2011-08-18 E Ink Corporation Methods for driving electrophoretic displays using dielectrophoretic forces
US7005179B2 (en) * 2002-07-26 2006-02-28 The Regents Of The University Of California Conductive inks for metalization in integrated polymer microsystems
US20040105036A1 (en) * 2002-08-06 2004-06-03 E Ink Corporation Protection of electro-optic displays against thermal effects
US7312916B2 (en) 2002-08-07 2007-12-25 E Ink Corporation Electrophoretic media containing specularly reflective particles
US8071168B2 (en) * 2002-08-26 2011-12-06 Nanoink, Inc. Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
JP4615197B2 (ja) * 2002-08-30 2011-01-19 シャープ株式会社 Ｔｆｔアレイ基板の製造方法および液晶表示装置の製造方法
US7839564B2 (en) 2002-09-03 2010-11-23 E Ink Corporation Components and methods for use in electro-optic displays
CN101109885B (zh) * 2002-09-03 2012-06-13 伊英克公司 电光显示器
AU2003260137A1 (en) * 2002-09-03 2004-03-29 E Ink Corporation Electrophoretic medium with gaseous suspending fluid
US20130063333A1 (en) 2002-10-16 2013-03-14 E Ink Corporation Electrophoretic displays
JP2004152958A (ja) 2002-10-30 2004-05-27 Pioneer Electronic Corp 有機半導体装置
US20040147818A1 (en) * 2002-11-18 2004-07-29 Andrew Levy Portable system for monitoring and processing patient parameters in multiple oprational modes
AU2003298135A1 (en) * 2002-11-29 2004-06-23 Siemens Aktiengesellschaft Diode matrix for controlling displays with organic diodes and production method therefor
JP2006510066A (ja) * 2002-12-16 2006-03-23 イー−インク コーポレイション 電気光学表示装置用バックプレーン
US6922276B2 (en) * 2002-12-23 2005-07-26 E Ink Corporation Flexible electro-optic displays
KR100497096B1 (ko) 2002-12-26 2005-06-28 엘지.필립스 엘시디 주식회사 듀얼패널타입 유기전계발광 소자용 어레이 기판 및 그 제조방법
GB0301089D0 (en) * 2003-01-17 2003-02-19 Plastic Logic Ltd Active layer islands
EP1584114A1 (de) * 2003-01-17 2005-10-12 Diode Solutions, Inc. Display mit einem organischen material
US6987603B2 (en) * 2003-01-31 2006-01-17 E Ink Corporation Construction of electrophoretic displays
JP3772983B2 (ja) * 2003-03-13 2006-05-10 セイコーエプソン株式会社 電子装置の製造方法
US7910175B2 (en) 2003-03-25 2011-03-22 E Ink Corporation Processes for the production of electrophoretic displays
US7339715B2 (en) * 2003-03-25 2008-03-04 E Ink Corporation Processes for the production of electrophoretic displays
EP1616217B1 (de) * 2003-03-27 2010-10-20 E Ink Corporation Elektrooptische baugruppen
US10726798B2 (en) 2003-03-31 2020-07-28 E Ink Corporation Methods for operating electro-optic displays
JP4776532B2 (ja) * 2003-05-02 2011-09-21 イー インク コーポレイション 電気泳動ディスプレイ
EP1639574B1 (de) 2003-06-30 2015-04-22 E Ink Corporation Verfahren zum antreiben elektro-optischer anzeigen
US8174490B2 (en) 2003-06-30 2012-05-08 E Ink Corporation Methods for driving electrophoretic displays
US7393081B2 (en) * 2003-06-30 2008-07-01 Semiconductor Energy Laboratory Co., Ltd. Droplet jetting device and method of manufacturing pattern
US7879696B2 (en) * 2003-07-08 2011-02-01 Kovio, Inc. Compositions and methods for forming a semiconducting and/or silicon-containing film, and structures formed therefrom
US7537799B2 (en) * 2003-07-11 2009-05-26 Hewlett-Packard Development Company, L.P. Methods of forming electrically conductive pathways using palladium aliphatic amine complexes
US7564051B2 (en) * 2003-07-17 2009-07-21 Panasonic Corporation Thin-film transistor including organic semiconductor and inorganic particles, and manufacturing method therefor
US20050122563A1 (en) 2003-07-24 2005-06-09 E Ink Corporation Electro-optic displays
US20070178710A1 (en) * 2003-08-18 2007-08-02 3M Innovative Properties Company Method for sealing thin film transistors
EP1656658A4 (de) 2003-08-19 2009-12-30 E Ink Corp Verfahren zur steuerung von elektrooptischen displays
WO2005029458A1 (en) * 2003-09-19 2005-03-31 E Ink Corporation Methods for reducing edge effects in electro-optic displays
US6969634B2 (en) * 2003-09-24 2005-11-29 Lucent Technologies Inc. Semiconductor layers with roughness patterning
US8319759B2 (en) 2003-10-08 2012-11-27 E Ink Corporation Electrowetting displays
US7420549B2 (en) * 2003-10-08 2008-09-02 E Ink Corporation Electro-wetting displays
US7226819B2 (en) * 2003-10-28 2007-06-05 Semiconductor Energy Laboratory Co., Ltd. Methods for forming wiring and manufacturing thin film transistor and droplet discharging method
KR101166358B1 (ko) * 2003-10-28 2012-07-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 배선 형성 방법, 박막 트랜지스터 제조 방법, 및 액적 토출방법
US7080897B2 (en) * 2003-10-31 2006-07-25 Hewlett-Packard Development Company, L.P. System for delivering material onto a substrate
US8177942B2 (en) 2003-11-05 2012-05-15 E Ink Corporation Electro-optic displays, and materials for use therein
US20110164301A1 (en) 2003-11-05 2011-07-07 E Ink Corporation Electro-optic displays, and materials for use therein
US7551346B2 (en) 2003-11-05 2009-06-23 E Ink Corporation Electro-optic displays, and materials for use therein
US7173752B2 (en) 2003-11-05 2007-02-06 E Ink Corporation Electro-optic displays, and materials for use therein
US7672040B2 (en) 2003-11-05 2010-03-02 E Ink Corporation Electro-optic displays, and materials for use therein
WO2005048314A2 (en) * 2003-11-12 2005-05-26 Silicon Pipe, Inc. Tapered dielectric and conductor structures and applications thereof
JP4415653B2 (ja) 2003-11-19 2010-02-17 セイコーエプソン株式会社 薄膜トランジスタの製造方法
US8928562B2 (en) 2003-11-25 2015-01-06 E Ink Corporation Electro-optic displays, and methods for driving same
US7130234B2 (en) * 2003-12-12 2006-10-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7768405B2 (en) * 2003-12-12 2010-08-03 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
US7036220B2 (en) * 2003-12-18 2006-05-02 The Regents Of The University Of California Pin-deposition of conductive inks for microelectrodes and contact via filling
US7405665B2 (en) * 2003-12-19 2008-07-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, RFID tag and label-like object
JP2005183889A (ja) * 2003-12-24 2005-07-07 Konica Minolta Holdings Inc 薄膜トランジスタシート及びその作製方法、それにより形成された薄膜トランジスタ素子
US7508305B2 (en) * 2003-12-26 2009-03-24 Semiconductor Energy Laboratory Co., Ltd. Packing material, tag, certificate, paper money, and securities
US7206119B2 (en) 2003-12-31 2007-04-17 E Ink Corporation Electro-optic displays, and method for driving same
US7294449B1 (en) 2003-12-31 2007-11-13 Kovio, Inc. Radiation patternable functional materials, methods of their use, and structures formed therefrom
US7075703B2 (en) * 2004-01-16 2006-07-11 E Ink Corporation Process for sealing electro-optic displays
US7462292B2 (en) * 2004-01-27 2008-12-09 Hewlett-Packard Development Company, L.P. Silicon carbide imprint stamp
US7060625B2 (en) * 2004-01-27 2006-06-13 Hewlett-Packard Development Company, L.P. Imprint stamp
JP4100351B2 (ja) * 2004-02-09 2008-06-11 セイコーエプソン株式会社 薄膜トランジスタの製造方法
KR100592503B1 (ko) * 2004-02-10 2006-06-23 진 장 유기 반도체의 선택적 증착을 통한 박막트랜지스터 어레이제조 방법
US7388572B2 (en) 2004-02-27 2008-06-17 E Ink Corporation Backplanes for electro-optic displays
US7492339B2 (en) 2004-03-26 2009-02-17 E Ink Corporation Methods for driving bistable electro-optic displays
US8289250B2 (en) 2004-03-31 2012-10-16 E Ink Corporation Methods for driving electro-optic displays
DE102004018118A1 (de) * 2004-04-08 2005-10-27 Axaron Bioscience Ag Nasschemische Erzeugung strukturierter dünner organischer Filme
US11355027B2 (en) 2004-04-30 2022-06-07 Sydney Hyman Image making medium compositions and images
WO2005109535A2 (en) * 2004-05-06 2005-11-17 Koninklijke Philips Electronics N.V. A method of manufacturing a thermoelectric device
US20050253777A1 (en) * 2004-05-12 2005-11-17 E Ink Corporation Tiled displays and methods for driving same
KR101260981B1 (ko) 2004-06-04 2013-05-10 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US7521292B2 (en) * 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US7300861B2 (en) * 2004-06-24 2007-11-27 Palo Alto Research Center Incorporated Method for interconnecting electronic components using a blend solution to form a conducting layer and an insulating layer
US7351606B2 (en) * 2004-06-24 2008-04-01 Palo Alto Research Center Incorporated Method for forming a bottom gate thin film transistor using a blend solution to form a semiconducting layer and an insulating layer
JP2006019567A (ja) * 2004-07-02 2006-01-19 Seiko Epson Corp シールド線
WO2006015044A1 (en) 2004-07-27 2006-02-09 E Ink Corporation Electro-optic displays
US11250794B2 (en) 2004-07-27 2022-02-15 E Ink Corporation Methods for driving electrophoretic displays using dielectrophoretic forces
US20080136774A1 (en) 2004-07-27 2008-06-12 E Ink Corporation Methods for driving electrophoretic displays using dielectrophoretic forces
US7453445B2 (en) 2004-08-13 2008-11-18 E Ink Corproation Methods for driving electro-optic displays
KR101090250B1 (ko) * 2004-10-15 2011-12-06 삼성전자주식회사 유기 반도체를 이용한 박막 트랜지스터 표시판 및 그 제조방법
US20060088962A1 (en) * 2004-10-22 2006-04-27 Herman Gregory S Method of forming a solution processed transistor having a multilayer dielectric
US7374984B2 (en) * 2004-10-29 2008-05-20 Randy Hoffman Method of forming a thin film component
US20060093732A1 (en) * 2004-10-29 2006-05-04 David Schut Ink-jet printing of coupling agents for trace or circuit deposition templating
KR101186966B1 (ko) * 2004-11-09 2012-10-02 코닌클리케 필립스 일렉트로닉스 엔.브이. 유기 트랜지스터를 제조하기 위한 자체-정렬 공정
CN100470340C (zh) * 2004-12-06 2009-03-18 台湾薄膜电晶体液晶显示器产业协会 薄膜晶体管印刷制程方法
US7125495B2 (en) * 2004-12-20 2006-10-24 Palo Alto Research Center, Inc. Large area electronic device with high and low resolution patterned film features
KR101133759B1 (ko) * 2004-12-28 2012-04-09 삼성전자주식회사 전기 영동 표시 장치 및 그 제조 방법
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
TW200640596A (en) * 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US8334464B2 (en) 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
US7824466B2 (en) * 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
JP2008521065A (ja) 2005-01-26 2008-06-19 イー インク コーポレイション ガス状流体を用いる電気泳動ディスプレイ
KR101219035B1 (ko) * 2005-05-03 2013-01-07 삼성디스플레이 주식회사 유기 박막 트랜지스터 표시판 및 그 제조 방법
JP4602920B2 (ja) * 2005-03-19 2010-12-22 三星モバイルディスプレイ株式會社 有機薄膜トランジスタ、それを備えた平板ディスプレイ装置、及び有機薄膜トランジスタの製造方法
WO2006102649A2 (en) * 2005-03-23 2006-09-28 Agere Systems Inc. A method for manufacturing a device using imprint lithography and direct write technology
KR100683766B1 (ko) * 2005-03-30 2007-02-15 삼성에스디아이 주식회사 평판표시장치 및 그의 제조방법
US7670882B2 (en) * 2005-04-05 2010-03-02 Hewlett-Packard Development Company, L.P. Electronic device fabrication
DE102005017655B4 (de) * 2005-04-15 2008-12-11 Polyic Gmbh & Co. Kg Mehrschichtiger Verbundkörper mit elektronischer Funktion
US7523546B2 (en) * 2005-05-04 2009-04-28 Nokia Corporation Method for manufacturing a composite layer for an electronic device
US8253179B2 (en) 2005-05-13 2012-08-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
US7476603B2 (en) * 2005-06-07 2009-01-13 Hewlett-Packard Development Company, L.P. Printing conductive patterns using LEP
WO2007002452A2 (en) 2005-06-23 2007-01-04 E Ink Corporation Edge seals and processes for electro-optic displays
JP2008545155A (ja) * 2005-06-30 2008-12-11 ポリマー、ビジョン、リミテッド 電界遮蔽体の使用による画素性能の向上
US7687327B2 (en) * 2005-07-08 2010-03-30 Kovio, Inc, Methods for manufacturing RFID tags and structures formed therefrom
JP2009506350A (ja) * 2005-08-12 2009-02-12 ポリマー、ビジョン、リミテッド 半導体インク・ジェット印刷時マスクとしてのフィールド・シールド誘電体
US20070040165A1 (en) * 2005-08-16 2007-02-22 Klaus Dimmler Method of fabricating organic FETs
KR101256713B1 (ko) 2005-10-18 2013-04-19 이 잉크 코포레이션 전기-광학 디스플레이용 컴포넌트
US20080043318A1 (en) 2005-10-18 2008-02-21 E Ink Corporation Color electro-optic displays, and processes for the production thereof
US20070093717A1 (en) * 2005-10-20 2007-04-26 Glucon Inc. Wearable glucometer configurations
US20070093698A1 (en) * 2005-10-20 2007-04-26 Glucon Inc. Apparatus and methods for attaching a device to a body
US20070091417A1 (en) * 2005-10-25 2007-04-26 E Ink Corporation Electrophoretic media and displays with improved binder
US20070090459A1 (en) * 2005-10-26 2007-04-26 Motorola, Inc. Multiple gate printed transistor method and apparatus
TWI269450B (en) * 2005-12-20 2006-12-21 Taiwan Tft Lcd Ass A direct patterned method for manufacturing a metal layer of a semiconductor device
US20070146426A1 (en) * 2005-12-28 2007-06-28 Nelson Brian K All-inkjet printed thin film transistor
CN100505179C (zh) * 2006-01-12 2009-06-24 台湾薄膜电晶体液晶显示器产业协会 半导体元件的金属层直接图案化制作方法
US8390301B2 (en) 2006-03-08 2013-03-05 E Ink Corporation Electro-optic displays, and materials and methods for production thereof
US7733554B2 (en) 2006-03-08 2010-06-08 E Ink Corporation Electro-optic displays, and materials and methods for production thereof
US7843624B2 (en) 2006-03-08 2010-11-30 E Ink Corporation Electro-optic displays, and materials and methods for production thereof
US8610988B2 (en) 2006-03-09 2013-12-17 E Ink Corporation Electro-optic display with edge seal
US7952790B2 (en) 2006-03-22 2011-05-31 E Ink Corporation Electro-optic media produced using ink jet printing
KR101061530B1 (ko) * 2006-04-04 2011-09-01 6엔 실리콘 아이엔씨. 실리콘의 정제 방법
WO2007124128A2 (en) * 2006-04-20 2007-11-01 Liquidia Technologies, Inc. Biological vessel flow control devices and methods
US8105643B2 (en) * 2006-05-31 2012-01-31 Cabot Corporation Process for printing features with smaller dimensions
US7903319B2 (en) 2006-07-11 2011-03-08 E Ink Corporation Electrophoretic medium and display with improved image stability
US8018640B2 (en) 2006-07-13 2011-09-13 E Ink Corporation Particles for use in electrophoretic displays
US20080024429A1 (en) * 2006-07-25 2008-01-31 E Ink Corporation Electrophoretic displays using gaseous fluids
US7492497B2 (en) 2006-08-02 2009-02-17 E Ink Corporation Multi-layer light modulator
KR20080013297A (ko) * 2006-08-08 2008-02-13 삼성전자주식회사 박막 트랜지스터 표시판의 제조 방법
TW200811569A (en) * 2006-08-21 2008-03-01 Prime View Int Co Ltd E-ink display panel
US7709307B2 (en) * 2006-08-24 2010-05-04 Kovio, Inc. Printed non-volatile memory
WO2008030960A2 (en) * 2006-09-06 2008-03-13 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US7986450B2 (en) 2006-09-22 2011-07-26 E Ink Corporation Electro-optic display and materials for use therein
US7477444B2 (en) 2006-09-22 2009-01-13 E Ink Corporation & Air Products And Chemical, Inc. Electro-optic display and materials for use therein
US8222077B2 (en) * 2006-11-07 2012-07-17 Cbrite Inc. Metal-insulator-metal (MIM) devices and their methods of fabrication
US9741901B2 (en) 2006-11-07 2017-08-22 Cbrite Inc. Two-terminal electronic devices and their methods of fabrication
US7898042B2 (en) 2006-11-07 2011-03-01 Cbrite Inc. Two-terminal switching devices and their methods of fabrication
US7649666B2 (en) 2006-12-07 2010-01-19 E Ink Corporation Components and methods for use in electro-optic displays
MY149292A (en) 2007-01-17 2013-08-30 Univ Illinois Optical systems fabricated by printing-based assembly
WO2008091850A2 (en) 2007-01-22 2008-07-31 E Ink Corporation Multi-layer sheet for use in electro-optic displays
US7688497B2 (en) 2007-01-22 2010-03-30 E Ink Corporation Multi-layer sheet for use in electro-optic displays
US7826129B2 (en) 2007-03-06 2010-11-02 E Ink Corporation Materials for use in electrophoretic displays
US20080230773A1 (en) * 2007-03-20 2008-09-25 Nano Terra Inc. Polymer Composition for Preparing Electronic Devices by Microcontact Printing Processes and Products Prepared by the Processes
JP5234523B2 (ja) * 2007-04-13 2013-07-10 株式会社ニコン 表示素子の製造方法、表示素子の製造装置、及び表示素子製造用のシート基板
ES2817249T3 (es) 2007-04-16 2021-04-06 Corium Inc Matrices de microagujas obtenidas mediante disolución y colada que contienen un principio activo
CN101681211A (zh) 2007-05-21 2010-03-24 伊英克公司 用于驱动视频电光显示器的方法
US20080308003A1 (en) * 2007-06-13 2008-12-18 Krol Andrew M UV inkjet resist
US8058195B2 (en) * 2007-06-19 2011-11-15 Cabot Corporation Nanoglass and flame spray processes for producing nanoglass
JP5093482B2 (ja) * 2007-06-26 2012-12-12 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電材料、接続構造体及びその製造方法
US9199441B2 (en) 2007-06-28 2015-12-01 E Ink Corporation Processes for the production of electro-optic displays, and color filters for use therein
WO2009006248A1 (en) 2007-06-29 2009-01-08 E Ink Corporation Electro-optic displays, and materials and methods for production thereof
US7768080B2 (en) * 2007-07-30 2010-08-03 Hewlett-Packard Development Company, L.P. Multilayer dielectric
US8902153B2 (en) 2007-08-03 2014-12-02 E Ink Corporation Electro-optic displays, and processes for their production
WO2009048607A1 (en) 2007-10-10 2009-04-16 Corium International, Inc. Vaccine delivery via microneedle arrays
US20090122389A1 (en) 2007-11-14 2009-05-14 E Ink Corporation Electro-optic assemblies, and adhesives and binders for use therein
US8101231B2 (en) * 2007-12-07 2012-01-24 Cabot Corporation Processes for forming photovoltaic conductive features from multiple inks
US7754542B2 (en) 2007-12-19 2010-07-13 Palo Alto Research Center Incorporated Printed TFT array
US8110450B2 (en) * 2007-12-19 2012-02-07 Palo Alto Research Center Incorporated Printed TFT and TFT array with self-aligned gate
EP2255378B1 (de) 2008-03-05 2015-08-05 The Board of Trustees of the University of Illinois Streckbare und klappbare elektronische anordnungen
US8054526B2 (en) 2008-03-21 2011-11-08 E Ink Corporation Electro-optic displays, and color filters for use therein
US8470701B2 (en) * 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
US8314784B2 (en) 2008-04-11 2012-11-20 E Ink Corporation Methods for driving electro-optic displays
KR101006893B1 (ko) * 2008-04-28 2011-01-12 (주) 파루 유연성 유기박막 트랜지스터 및 그 제조방법
JP2009302136A (ja) * 2008-06-10 2009-12-24 Panasonic Corp 半導体集積回路
US7927976B2 (en) * 2008-07-23 2011-04-19 Semprius, Inc. Reinforced composite stamp for dry transfer printing of semiconductor elements
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
JP5646492B2 (ja) 2008-10-07 2014-12-24 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 伸縮可能な集積回路およびセンサアレイを有する装置
US8506867B2 (en) * 2008-11-19 2013-08-13 Semprius, Inc. Printing semiconductor elements by shear-assisted elastomeric stamp transfer
US8686404B2 (en) 2008-12-08 2014-04-01 The Trustees Of The University Of Pennsylvania Organic semiconductors capable of ambipolar transport
US20100177750A1 (en) * 2009-01-13 2010-07-15 Metrologic Instruments, Inc. Wireless Diplay sensor communication network
US20100177080A1 (en) * 2009-01-13 2010-07-15 Metrologic Instruments, Inc. Electronic-ink signage device employing thermal packaging for outdoor weather applications
US8234507B2 (en) 2009-01-13 2012-07-31 Metrologic Instruments, Inc. Electronic-ink display device employing a power switching mechanism automatically responsive to predefined states of device configuration
US20100177076A1 (en) * 2009-01-13 2010-07-15 Metrologic Instruments, Inc. Edge-lit electronic-ink display device for use in indoor and outdoor environments
US8457013B2 (en) 2009-01-13 2013-06-04 Metrologic Instruments, Inc. Wireless dual-function network device dynamically switching and reconfiguring from a wireless network router state of operation into a wireless network coordinator state of operation in a wireless communication network
TWI484273B (zh) 2009-02-09 2015-05-11 E Ink Corp 電泳粒子
US8098418B2 (en) 2009-03-03 2012-01-17 E. Ink Corporation Electro-optic displays, and color filters for use therein
CN101840996A (zh) * 2009-03-20 2010-09-22 德晶电子(江苏)有限公司 印刷式半导体晶体管及其形成方法
US9221148B2 (en) 2009-04-30 2015-12-29 Rdc Holdings, Llc Method and apparatus for processing sliders for disk drives, and to various processing media for the same
US20110104989A1 (en) * 2009-04-30 2011-05-05 First Principles LLC Dressing bar for embedding abrasive particles into substrates
US8801497B2 (en) 2009-04-30 2014-08-12 Rdc Holdings, Llc Array of abrasive members with resilient support
TWI573185B (zh) 2009-05-12 2017-03-01 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
US8955215B2 (en) 2009-05-28 2015-02-17 Hsio Technologies, Llc High performance surface mount electrical interconnect
WO2011153298A1 (en) 2010-06-03 2011-12-08 Hsio Technologies, Llc Electrical connector insulator housing
US9276336B2 (en) 2009-05-28 2016-03-01 Hsio Technologies, Llc Metalized pad to electrical contact interface
US9536815B2 (en) 2009-05-28 2017-01-03 Hsio Technologies, Llc Semiconductor socket with direct selective metalization
US9318862B2 (en) 2009-06-02 2016-04-19 Hsio Technologies, Llc Method of making an electronic interconnect
WO2012074963A1 (en) 2010-12-01 2012-06-07 Hsio Technologies, Llc High performance surface mount electrical interconnect
US9603249B2 (en) 2009-06-02 2017-03-21 Hsio Technologies, Llc Direct metalization of electrical circuit structures
WO2010141264A1 (en) 2009-06-03 2010-12-09 Hsio Technologies, Llc Compliant wafer level probe assembly
WO2010141313A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit socket diagnostic tool
US9930775B2 (en) 2009-06-02 2018-03-27 Hsio Technologies, Llc Copper pillar full metal via electrical circuit structure
US8525346B2 (en) 2009-06-02 2013-09-03 Hsio Technologies, Llc Compliant conductive nano-particle electrical interconnect
US8618649B2 (en) 2009-06-02 2013-12-31 Hsio Technologies, Llc Compliant printed circuit semiconductor package
US9320133B2 (en) 2009-06-02 2016-04-19 Hsio Technologies, Llc Electrical interconnect IC device socket
US8970031B2 (en) 2009-06-16 2015-03-03 Hsio Technologies, Llc Semiconductor die terminal
WO2010141295A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed flexible circuit
US8987886B2 (en) 2009-06-02 2015-03-24 Hsio Technologies, Llc Copper pillar full metal via electrical circuit structure
WO2010141297A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit wafer level semiconductor package
US9232654B2 (en) 2009-06-02 2016-01-05 Hsio Technologies, Llc High performance electrical circuit structure
WO2010141303A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Resilient conductive electrical interconnect
US9276339B2 (en) 2009-06-02 2016-03-01 Hsio Technologies, Llc Electrical interconnect IC device socket
US9277654B2 (en) 2009-06-02 2016-03-01 Hsio Technologies, Llc Composite polymer-metal electrical contacts
US9184145B2 (en) 2009-06-02 2015-11-10 Hsio Technologies, Llc Semiconductor device package adapter
WO2010141311A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit area array semiconductor device package
WO2010141316A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit wafer probe diagnostic tool
US8988093B2 (en) 2009-06-02 2015-03-24 Hsio Technologies, Llc Bumped semiconductor wafer or die level electrical interconnect
WO2010141266A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit peripheral lead semiconductor package
US8610265B2 (en) 2009-06-02 2013-12-17 Hsio Technologies, Llc Compliant core peripheral lead semiconductor test socket
US9699906B2 (en) 2009-06-02 2017-07-04 Hsio Technologies, Llc Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
US9613841B2 (en) 2009-06-02 2017-04-04 Hsio Technologies, Llc Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
US8789272B2 (en) 2009-06-02 2014-07-29 Hsio Technologies, Llc Method of making a compliant printed circuit peripheral lead semiconductor test socket
US9196980B2 (en) 2009-06-02 2015-11-24 Hsio Technologies, Llc High performance surface mount electrical interconnect with external biased normal force loading
WO2010147782A1 (en) 2009-06-16 2010-12-23 Hsio Technologies, Llc Simulated wirebond semiconductor package
US9320144B2 (en) 2009-06-17 2016-04-19 Hsio Technologies, Llc Method of forming a semiconductor socket
US7910393B2 (en) * 2009-06-17 2011-03-22 Innovalight, Inc. Methods for forming a dual-doped emitter on a silicon substrate with a sub-critical shear thinning nanoparticle fluid
US8984748B2 (en) 2009-06-29 2015-03-24 Hsio Technologies, Llc Singulated semiconductor device separable electrical interconnect
US8981809B2 (en) 2009-06-29 2015-03-17 Hsio Technologies, Llc Compliant printed circuit semiconductor tester interface
US8261660B2 (en) * 2009-07-22 2012-09-11 Semprius, Inc. Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
US8754859B2 (en) 2009-10-28 2014-06-17 E Ink Corporation Electro-optic displays with touch sensors and/or tactile feedback
US8654436B1 (en) 2009-10-30 2014-02-18 E Ink Corporation Particles for use in electrophoretic displays
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
EP2513953B1 (de) 2009-12-16 2017-10-18 The Board of Trustees of the University of Illionis Elektrophysiologie unter verwendung konformer elektronischer vorrichtungen
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
WO2011115643A1 (en) 2010-03-17 2011-09-22 The Board Of Trustees Of The University Of Illinois Implantable biomedical devices on bioresorbable substrates
EP2553522B1 (de) 2010-04-02 2016-03-23 E-Ink Corporation Elektrophoretische medien
CN102834857B (zh) 2010-04-09 2016-03-02 伊英克公司 用于驱动电光显示器的方法
EP2566501B1 (de) 2010-05-04 2019-03-13 Corium International, Inc. Verfahren und vorrichtung zur transdermalen verabreichung von parathormon mithilfe eines mikroprojektions-arrays
TWI484275B (zh) 2010-05-21 2015-05-11 E Ink Corp 光電顯示器及其驅動方法、微型空腔電泳顯示器
US9689897B2 (en) 2010-06-03 2017-06-27 Hsio Technologies, Llc Performance enhanced semiconductor socket
US8758067B2 (en) 2010-06-03 2014-06-24 Hsio Technologies, Llc Selective metalization of electrical connector or socket housing
US9350093B2 (en) 2010-06-03 2016-05-24 Hsio Technologies, Llc Selective metalization of electrical connector or socket housing
US10159154B2 (en) 2010-06-03 2018-12-18 Hsio Technologies, Llc Fusion bonded liquid crystal polymer circuit structure
CN101984506B (zh) * 2010-10-12 2012-07-04 北京大学 二次光刻制备薄膜晶体管的方法
WO2012097163A1 (en) 2011-01-14 2012-07-19 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
JP5779933B2 (ja) * 2011-03-25 2015-09-16 凸版印刷株式会社 薄膜トランジスタ装置およびその製造方法
CN102646592B (zh) * 2011-05-03 2014-12-03 京东方科技集团股份有限公司 薄膜场效应晶体管器件及其制备方法
US9765934B2 (en) 2011-05-16 2017-09-19 The Board Of Trustees Of The University Of Illinois Thermally managed LED arrays assembled by printing
KR102000302B1 (ko) 2011-05-27 2019-07-15 엠씨10, 인크 전자, 광학, 및/또는 기계 장치 및 시스템, 그리고 이를 제조하기 위한 방법
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
JP5957846B2 (ja) 2011-10-13 2016-07-27 ソニー株式会社 駆動用回路基板およびその製造方法並びに表示装置および電子機器
US20130125910A1 (en) 2011-11-18 2013-05-23 Avon Products, Inc. Use of Electrophoretic Microcapsules in a Cosmetic Composition
WO2013089867A2 (en) 2011-12-01 2013-06-20 The Board Of Trustees Of The University Of Illinois Transient devices designed to undergo programmable transformations
US9554484B2 (en) 2012-03-30 2017-01-24 The Board Of Trustees Of The University Of Illinois Appendage mountable electronic devices conformable to surfaces
US10190743B2 (en) 2012-04-20 2019-01-29 E Ink Corporation Illumination systems for reflective displays
US11467466B2 (en) 2012-04-20 2022-10-11 E Ink Corporation Illumination systems for reflective displays
US9761520B2 (en) 2012-07-10 2017-09-12 Hsio Technologies, Llc Method of making an electrical connector having electrodeposited terminals
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
EP2934660B1 (de) 2012-12-21 2019-07-17 Corium, Inc. Mikroarray zur freisetzung therapeutischer wirkstoffe und verfahren zur herstellung davon
US9715155B1 (en) 2013-01-10 2017-07-25 E Ink Corporation Electrode structures for electro-optic displays
US9726957B2 (en) 2013-01-10 2017-08-08 E Ink Corporation Electro-optic display with controlled electrochemical reactions
EP4094799A1 (de) 2013-03-12 2022-11-30 Corium, Inc. Mikroprojektionsapplikatoren
US10384045B2 (en) 2013-03-15 2019-08-20 Corium, Inc. Microarray with polymer-free microstructures, methods of making, and methods of use
WO2014150285A2 (en) 2013-03-15 2014-09-25 Corium International, Inc. Multiple impact microprojection applicators and methods of use
US10384046B2 (en) 2013-03-15 2019-08-20 Corium, Inc. Microarray for delivery of therapeutic agent and methods of use
US10667410B2 (en) 2013-07-11 2020-05-26 Hsio Technologies, Llc Method of making a fusion bonded circuit structure
US10506722B2 (en) 2013-07-11 2019-12-10 Hsio Technologies, Llc Fusion bonded liquid crystal polymer electrical circuit structure
CN109491173B (zh) 2014-01-17 2022-07-12 伊英克公司 具有双相电极层的电光显示器
US10317767B2 (en) 2014-02-07 2019-06-11 E Ink Corporation Electro-optic display backplane structure with drive components and pixel electrodes on opposed surfaces
HK1225848A1 (zh) 2014-02-07 2017-09-15 伊英克公司 电光显示器的背板结构
US10446585B2 (en) 2014-03-17 2019-10-15 E Ink Corporation Multi-layer expanding electrode structures for backplane assemblies
US10252466B2 (en) 2014-07-28 2019-04-09 Massachusetts Institute Of Technology Systems and methods of machine vision assisted additive fabrication
US10624843B2 (en) 2014-09-04 2020-04-21 Corium, Inc. Microstructure array, methods of making, and methods of use
CN113341627B (zh) 2014-11-07 2024-08-20 伊英克公司 电光显示器的应用
US9835925B1 (en) 2015-01-08 2017-12-05 E Ink Corporation Electro-optic displays, and processes for the production thereof
EP3254276A4 (de) 2015-02-04 2018-07-11 E Ink Corporation Elektrooptische anzeigen mit reduzierter restspannung und zugehörige vorrichtung und verfahren
US9755335B2 (en) 2015-03-18 2017-09-05 Hsio Technologies, Llc Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction
KR102419615B1 (ko) * 2015-03-20 2022-07-12 삼성디스플레이 주식회사 표시장치
US10997930B2 (en) 2015-05-27 2021-05-04 E Ink Corporation Methods and circuitry for driving display devices
BR112017025616A2 (en) 2015-06-01 2018-08-07 The Board Of Trustees Of The University Of Illinois alternative approach to uv capture
BR112017025609A2 (pt) 2015-06-01 2018-08-07 The Board Of Trustees Of The University Of Illinois sistemas eletrônicos miniaturizados com potência sem fio e capacidades de comunicação de campo próximo
WO2017004176A1 (en) 2015-06-29 2017-01-05 E Ink Corporation Method for mechanical and electrical connection to display electrodes
US10857093B2 (en) 2015-06-29 2020-12-08 Corium, Inc. Microarray for delivery of therapeutic agent, methods of use, and methods of making
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
US20180361652A1 (en) * 2016-01-12 2018-12-20 Massachusetts Institute Of Technology Techniques for fluid control in additive fabrication and related systems and methods
HK1258890A1 (zh) 2016-05-31 2019-11-22 伊英克公司 用於电光显示器的背板
WO2017214508A1 (en) 2016-06-10 2017-12-14 E Ink Corporation Electro-optic display apparatus
CN109952189A (zh) 2016-11-17 2019-06-28 奥博泰克有限公司 混合式多材料3d打印
US10456984B2 (en) 2016-12-16 2019-10-29 Massachusetts Institute Of Technology Adaptive material deposition for additive manufacturing
DE102017001276B4 (de) * 2017-02-11 2024-12-24 3D Systems Gmbh Verfahren und Vorrichtung zum Herstellen eines dreidimensionalen Formgegenstands mittels schichtweisem Materialauftrag
WO2018160546A1 (en) 2017-02-28 2018-09-07 E Ink Corporation Writeable electrophoretic displays including sensing circuits and styli configured to interact with sensing circuits
EP3602193A4 (de) 2017-03-28 2021-01-06 E Ink Corporation Poröse rückwand für elektrooptische anzeige
WO2018213687A2 (en) 2017-05-19 2018-11-22 E Ink Corporation Foldable electro-optic display including digitization and touch sensing
US11404013B2 (en) 2017-05-30 2022-08-02 E Ink Corporation Electro-optic displays with resistors for discharging remnant charges
EP3631575A4 (de) 2017-05-30 2021-01-13 E Ink Corporation Elektro-optische anzeigen
CA3075408C (en) 2017-10-18 2022-06-28 E Ink Corporation Digital microfluidic devices including dual substrates with thin-film transistors and capacitive sensing
US10824042B1 (en) 2017-10-27 2020-11-03 E Ink Corporation Electro-optic display and composite materials having low thermal sensitivity for use therein
CN111226163B (zh) 2017-11-03 2021-10-22 伊英克公司 用于生产电光显示器的工艺
CN111712759A (zh) 2018-02-15 2020-09-25 伊英克公司 具有t线和像素电极之间的减小的电容耦合的窄边框电光显示器背板的通孔布局
US11175561B1 (en) 2018-04-12 2021-11-16 E Ink Corporation Electrophoretic display media with network electrodes and methods of making and using the same
US11353759B2 (en) 2018-09-17 2022-06-07 Nuclera Nucleics Ltd. Backplanes with hexagonal and triangular electrodes
KR102577837B1 (ko) 2018-10-15 2023-09-12 이 잉크 코포레이션 디지털 미세유체 전달 디바이스
CN118348719A (zh) 2018-11-09 2024-07-16 伊英克公司 电光显示器
WO2020122917A1 (en) 2018-12-13 2020-06-18 E Ink Corporation Illumination systems for reflective displays
US11521565B2 (en) 2018-12-28 2022-12-06 E Ink Corporation Crosstalk reduction for electro-optic displays
KR102647463B1 (ko) 2018-12-30 2024-03-13 이 잉크 코포레이션 전기 광학 디스플레이들
CN112068722A (zh) * 2019-06-11 2020-12-11 Oppo（重庆）智能科技有限公司 电子装置及电子装置的装配方法
CN110211973B (zh) * 2019-06-12 2021-08-27 京东方科技集团股份有限公司 一种显示面板及制作方法
EP4100791A4 (de) 2020-02-07 2024-03-06 E Ink Corporation Elektrophoretische anzeigeschicht mit oberer dünnfilmelektrode
US11513415B2 (en) 2020-06-03 2022-11-29 E Ink Corporation Foldable electrophoretic display module including non-conductive support plate
JP7688154B2 (ja) 2021-04-16 2025-06-03 イー インク コーポレイション 薄型縁シールを伴う電気泳動ディスプレイ
EP4388370A4 (de) 2021-08-18 2025-07-02 E Ink Corp Verfahren zur ansteuerung elektrooptischer anzeigen
TWI847563B (zh) 2022-02-25 2024-07-01 美商電子墨水股份有限公司 具有邊緣密封組件的電光顯示器及其製造方法
US12190730B2 (en) 2022-02-28 2025-01-07 E Ink Corporation Parking space management system
US11830449B2 (en) 2022-03-01 2023-11-28 E Ink Corporation Electro-optic displays
JP7839899B2 (ja) 2022-04-27 2026-04-02 イー インク コーポレイション セグメント化された電極を伴う電気光学ディスプレイスタックおよびそれを作る方法
EP4641295A3 (de) 2023-08-30 2025-11-05 E Ink Corporation Elektrooptische vorrichtung mit elektrophoretischem medium mit einer organischen elektroaktiven verbindung
AU2024372978A1 (en) 2023-10-30 2026-02-26 E Ink Corporation Electro-optic display with an electro-optic material layer having a binder comprising a polymer with a quaternary ammonium group and a method for manufacturing the same
KR20260051093A (ko) 2023-10-31 2026-04-15 이 잉크 코포레이션 내광성 첨가제를 포함하는 컬러 전기 광학 디스플레이
WO2025147410A2 (en) 2024-01-02 2025-07-10 E Ink Corporation Electrophoretic media comprising a cationic charge control agent
US20250224645A1 (en) 2024-01-05 2025-07-10 E Ink Corporation Electrophoretic medium comprising particles having a pigment core and a polymeric shell
US20250224646A1 (en) 2024-01-08 2025-07-10 E Ink Corporation Adhesive Layer Comprising Conductive Filler Particles and a Polymeric Dispersant
WO2025230802A1 (en) 2024-04-30 2025-11-06 E Ink Corporation A variable light transmission device comprising microcells
US20250370306A1 (en) 2024-05-30 2025-12-04 E Ink Corporation Chemically-Resistant Multi-Layered Electro-Optic Device and a Method of Making the Same
US20260003243A1 (en) 2024-06-26 2026-01-01 E Ink Corporation Variable light transmission device comprising microcells
WO2026006117A1 (en) 2024-06-26 2026-01-02 E Ink Corporation A variable light transmission device comprising microcells
WO2026006119A1 (en) 2024-06-26 2026-01-02 E Ink Corporation A variable light transmission device comprising microcells

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59162057A (ja) * 1983-03-03 1984-09-12 Fujitsu Ltd インクジエツトプリントヘツド
JPH02139972A (ja) * 1988-11-21 1990-05-29 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH02259625A (ja) * 1989-03-30 1990-10-22 Victor Co Of Japan Ltd 液晶表示素子
JP3020068B2 (ja) * 1990-06-29 2000-03-15 協立化学産業株式会社 液晶表示装置の製造方法
JP2593995B2 (ja) * 1992-02-28 1997-03-26 株式会社ジーティシー 微細パターンの形成方法
US5552813A (en) * 1992-03-11 1996-09-03 Rohm Co., Ltd. Ink jet head with nozzle arrangement to reduce viscous drag
US6011607A (en) * 1995-02-15 2000-01-04 Semiconductor Energy Laboratory Co., Active matrix display with sealing material
TW449670B (en) * 1996-05-15 2001-08-11 Seiko Epson Corp Method for making thin film device with coating film, liquid crystal panel and electronic device
GB9622177D0 (en) * 1996-10-24 1996-12-18 Xaar Ltd Passivation of ink jet print heads
US5710070A (en) * 1996-11-08 1998-01-20 Chartered Semiconductor Manufacturing Pte Ltd. Application of titanium nitride and tungsten nitride thin film resistor for thermal ink jet technology
US6267905B1 (en) * 1997-07-15 2001-07-31 Silverbrook Research Pty Ltd Method of manufacture of a permanent magnet electromagnetic ink jet printer
US6228668B1 (en) * 1997-07-15 2001-05-08 Silverbrook Research Pty Ltd Method of manufacture of a thermally actuated ink jet printer having a series of thermal actuator units
JP4003273B2 (ja) * 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
US6087196A (en) 1998-01-30 2000-07-11 The Trustees Of Princeton University Fabrication of organic semiconductor devices using ink jet printing
US6384727B1 (en) * 2000-08-02 2002-05-07 Motorola, Inc. Capacitively powered radio frequency identification device

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US6521489B2 (en) 2003-02-18
AU7137800A (en) 2001-02-13
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US20020119584A1 (en) 2002-08-29
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