ATE261846T1 - Verfahren zum herstellen eines elektronischen etiketts sowie die korrespondierende chipkarte - Google Patents

Verfahren zum herstellen eines elektronischen etiketts sowie die korrespondierende chipkarte

Info

Publication number
ATE261846T1
ATE261846T1 AT00403660T AT00403660T ATE261846T1 AT E261846 T1 ATE261846 T1 AT E261846T1 AT 00403660 T AT00403660 T AT 00403660T AT 00403660 T AT00403660 T AT 00403660T AT E261846 T1 ATE261846 T1 AT E261846T1
Authority
AT
Austria
Prior art keywords
film
label
during
deformation
electronic label
Prior art date
Application number
AT00403660T
Other languages
English (en)
Inventor
Andre Auzou
Weidong Li
Original Assignee
Allibert Equipement
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR9916824A external-priority patent/FR2791035B1/fr
Application filed by Allibert Equipement filed Critical Allibert Equipement
Application granted granted Critical
Publication of ATE261846T1 publication Critical patent/ATE261846T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203One or more of the layers being plastic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04Attaching a series of articles, e.g. small electrical components, to a continuous web
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B9/00Enclosing successive articles, or quantities of material, e.g. liquids or semiliquids, in flat, folded, or tubular webs of flexible sheet material; Subdividing filled flexible tubes to form packages
    • B65B9/02Enclosing successive articles, or quantities of material between opposed webs
    • B65B9/04Enclosing successive articles, or quantities of material between opposed webs one or both webs being formed with pockets for the reception of the articles, or of the quantities of material
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/34Inserts
    • B32B2305/342Chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00Labels, badges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
AT00403660T 1999-12-31 2000-12-22 Verfahren zum herstellen eines elektronischen etiketts sowie die korrespondierende chipkarte ATE261846T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9916824A FR2791035B1 (fr) 1999-03-19 1999-12-31 Procede de conditionnement d'une etiquette electronique, etiquette et piece plastique correspondantes

Publications (1)

Publication Number Publication Date
ATE261846T1 true ATE261846T1 (de) 2004-04-15

Family

ID=9554126

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00403660T ATE261846T1 (de) 1999-12-31 2000-12-22 Verfahren zum herstellen eines elektronischen etiketts sowie die korrespondierende chipkarte

Country Status (4)

Country Link
EP (1) EP1112932B1 (de)
AT (1) ATE261846T1 (de)
DE (1) DE60009022T2 (de)
ES (1) ES2218089T3 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2847364B1 (fr) * 2002-11-15 2005-04-29 Smartware Procede de fabrication de boitier moule comportant des composants contact et/ou sans contact
IT201900019796A1 (it) * 2019-10-25 2021-04-25 A Z Solutions S R L Contenitore per oggetti comprendente un tag elettronico, nonche’ metodo di realizzazione dello stesso

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2548409B1 (fr) * 1983-06-29 1985-11-15 Sligos Procede pour la fabrication de cartes a memoire, installation et cartes a memoire obtenues
DE4040770C2 (de) * 1990-12-19 1999-11-11 Gao Ges Automation Org Datenträger mit integriertem Schaltkreis
EP0649719B1 (de) * 1993-10-26 1997-10-01 Siemens Aktiengesellschaft Verfahren zur Herstellung von Chipkarten mittels Spritzgiessen
FR2716555B1 (fr) * 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
ATE167319T1 (de) * 1994-11-03 1998-06-15 Fela Holding Ag Basis folie für chip karte
GB2294899B (en) * 1994-11-11 1997-08-27 Plessey Telecomm Method of manufacturing a smartcard
US5682731A (en) * 1996-03-15 1997-11-04 Vichem Corporation Tape carrier for electronic and electrical parts

Also Published As

Publication number Publication date
DE60009022T2 (de) 2005-03-10
ES2218089T3 (es) 2004-11-16
DE60009022D1 (de) 2004-04-22
EP1112932B1 (de) 2004-03-17
EP1112932A1 (de) 2001-07-04

Similar Documents

Publication Publication Date Title
US5868890A (en) Process for bonding a cover to a substrate
CA2453582A1 (en) Integrated process for making inflatable article
JPH02102021A (ja) 樹脂成形品の製造方法
SE7709776L (sv) Formad, eftergivlig skiva for fordonsbeklednad
ATE240237T1 (de) Verfahren zum herstellen einer wasserlöslichen verpackung
FR2506670A1 (fr) Procede de fabrication de verre de securite stratifie sans autoclave
GB9906172D0 (en) A process for producing a water soluble package
ATE232782T1 (de) Verfahren und vorrichtung zum heissformen von gegenständen aus thermoplastischem material
CN102376195B (zh) 模内标签与制作方法
TW343178B (en) Process for producing a laminated metal sheet and production facility therefor (1)
ATE261846T1 (de) Verfahren zum herstellen eines elektronischen etiketts sowie die korrespondierende chipkarte
ATE192377T1 (de) Verfahren und vorrichtung zum herstellen von offenen behältern aus schaumfolien
DE59307521D1 (de) Verfahren zur herstellung eines metall-kunststoffolie-verbundes, nach diesem verfahren hergestellter metallkunststoffolie-verbund sowie dessen verwendung zur herstellung von verpackungsbehältern
DE69513495D1 (de) Verfahren zur Herstellung von Behältern wie Flaschen aus thermoplastischer Kunststofffolie sowie Vorrichtung zur Durchführung des Verfahrens
CA2086106C (en) Mold for press molding and process for press molding of thermoplastic resin using the same
DE60131999D1 (de) Verfahren zum herstellen von mehrschichtigen polymerfilmen
ATE156421T1 (de) Verfahren und vorrichtung zum kaschieren von schichten von identifikationskarten u. dgl.
CA2286318A1 (en) Method of manufacturing a molded door skin from a wood composite, door skin produced therefrom, and door manufactured therewith
US4917903A (en) Apparatus for producing decorative seams on films shaped using a drawing method
ATE232160T1 (de) Herstellungsverfahren von thermoplastischen kunststofffolien und herstellungsvorrichtung dafür
EP0938963B1 (de) Verfahren zur Herstellung einer Kassette aus einem Metal-Thermoplast-Metal Laminat
CA2043655A1 (en) Reduction of sag in a flattened web of tubular film
JPH0584769A (ja) 射出成形品の製造方法
CA2091877A1 (en) Tools for cold-forming plastics films, particularly polypropylene films of various thicknesses
JPS6324806B2 (de)

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties