ATE266497T1 - Verwendung einer bleifreien lotlegierungspaste zum herstellen von leiterplatten - Google Patents

Verwendung einer bleifreien lotlegierungspaste zum herstellen von leiterplatten

Info

Publication number
ATE266497T1
ATE266497T1 AT00903849T AT00903849T ATE266497T1 AT E266497 T1 ATE266497 T1 AT E266497T1 AT 00903849 T AT00903849 T AT 00903849T AT 00903849 T AT00903849 T AT 00903849T AT E266497 T1 ATE266497 T1 AT E266497T1
Authority
AT
Austria
Prior art keywords
lead
free solder
circuit boards
solder alloy
making circuit
Prior art date
Application number
AT00903849T
Other languages
English (en)
Inventor
Hector Andrew Hamilton Steen
Original Assignee
Multicore Solders Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multicore Solders Ltd filed Critical Multicore Solders Ltd
Application granted granted Critical
Publication of ATE266497T1 publication Critical patent/ATE266497T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
AT00903849T 1999-02-16 2000-02-16 Verwendung einer bleifreien lotlegierungspaste zum herstellen von leiterplatten ATE266497T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9903552.9A GB9903552D0 (en) 1999-02-16 1999-02-16 Reflow peak temperature reduction of solder alloys
PCT/GB2000/000533 WO2000048784A1 (en) 1999-02-16 2000-02-16 Lead-free solder alloy powder paste use in pcb production

Publications (1)

Publication Number Publication Date
ATE266497T1 true ATE266497T1 (de) 2004-05-15

Family

ID=10847900

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00903849T ATE266497T1 (de) 1999-02-16 2000-02-16 Verwendung einer bleifreien lotlegierungspaste zum herstellen von leiterplatten

Country Status (8)

Country Link
US (1) US6648210B1 (de)
EP (1) EP1073539B1 (de)
JP (1) JP2002537120A (de)
AT (1) ATE266497T1 (de)
AU (1) AU2560400A (de)
DE (1) DE60010590T2 (de)
GB (2) GB9903552D0 (de)
WO (1) WO2000048784A1 (de)

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WO2002099146A1 (en) * 2001-06-05 2002-12-12 The Penn State Research Foundation Novel high-temperature laed-free solders
US20040155097A1 (en) * 2003-02-04 2004-08-12 Matsushita Electric Industrial Co., Ltd. Soldering method and method for manufacturing component mounting board
DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
JP3928657B2 (ja) * 2004-03-09 2007-06-13 千住金属工業株式会社 ソルダペースト
GB2413565A (en) * 2004-04-15 2005-11-02 Henkel Loctite Adhesives Ltd Lead-free, bismuth-free solder alloy powders and a method of production thereof
US7074627B2 (en) * 2004-06-29 2006-07-11 Freescale Semiconductor, Inc. Lead solder indicator and method
DE102004034035A1 (de) * 2004-07-13 2006-02-09 W.C. Heraeus Gmbh Bleifreie Lotpasten mit erhöhter Zuverlässigkeit
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
KR100790978B1 (ko) * 2006-01-24 2008-01-02 삼성전자주식회사 저온에서의 접합 방법, 및 이를 이용한 반도체 패키지 실장 방법
KR101406174B1 (ko) * 2007-06-18 2014-06-12 엠케이전자 주식회사 주석, 은 및 비스무스를 함유하는 무연솔더
CN102275043A (zh) * 2010-06-10 2011-12-14 中国科学院金属研究所 一种消除SnBi焊料与铜基底连接界面脆性的方法
DE102011083931A1 (de) 2011-09-30 2013-04-04 Robert Bosch Gmbh Schichtverbund aus einem elektronischen Substrat und einer Schichtanordnung umfassend ein Reaktionslot
TWI442853B (zh) 2011-10-31 2014-06-21 Ibm 在一熱製程中保護一熱敏感元件的方法及保護裝置
CN104203490B (zh) * 2012-03-20 2018-04-24 阿尔发装配解决方案有限公司 焊料预成型件与焊料合金装配方法
JP2013239470A (ja) * 2012-05-11 2013-11-28 Fuji Electric Fa Components & Systems Co Ltd 表面実装基板
RU2528553C2 (ru) * 2013-01-09 2014-09-20 Открытое акционерное общество "Авангард" Способ преобразования матрично расположенных шариковых выводов микросхем из бессвинцового припоя в оловянно-свинцовые околоэвтектического состава и припойная паста для его реализации
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MY205097A (en) 2015-05-05 2024-10-01 Indium Corp High reliability lead-free solder alloys for harsh environment electronics applications
CN113146093A (zh) * 2015-05-05 2021-07-23 铟泰公司 用于严苛环境电子器件应用的高可靠性无铅焊料合金
DE102016112390B4 (de) 2016-07-06 2021-08-12 Infineon Technologies Ag Lötpad und Verfahren zum Verbessern der Lötpadoberfläche
CN108465973A (zh) * 2018-06-25 2018-08-31 深圳市博士达焊锡制品有限公司 一种无铅中温焊锡膏及其制备方法

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Also Published As

Publication number Publication date
DE60010590T2 (de) 2005-05-19
EP1073539A1 (de) 2001-02-07
WO2000048784A1 (en) 2000-08-24
AU2560400A (en) 2000-09-04
GB9903552D0 (en) 1999-04-07
JP2002537120A (ja) 2002-11-05
EP1073539B1 (de) 2004-05-12
US6648210B1 (en) 2003-11-18
GB0026708D0 (en) 2000-12-20
GB2352200A (en) 2001-01-24
GB2352200B (en) 2003-04-09
DE60010590D1 (de) 2004-06-17

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Legal Events

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