ATE400395T1 - Lötpasten - Google Patents

Lötpasten

Info

Publication number
ATE400395T1
ATE400395T1 AT01998186T AT01998186T ATE400395T1 AT E400395 T1 ATE400395 T1 AT E400395T1 AT 01998186 T AT01998186 T AT 01998186T AT 01998186 T AT01998186 T AT 01998186T AT E400395 T1 ATE400395 T1 AT E400395T1
Authority
AT
Austria
Prior art keywords
solder
activator
powder
lead
exhibit
Prior art date
Application number
AT01998186T
Other languages
English (en)
Inventor
Toshihiko Taguchi
Kunihito Takaura
Setsuko Tadokoro
Masahiko Hirata
Hisahiko Yoshida
Takashi Nagashima
Original Assignee
Senju Metal Industry Co
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co, Matsushita Electric Industrial Co Ltd filed Critical Senju Metal Industry Co
Application granted granted Critical
Publication of ATE400395T1 publication Critical patent/ATE400395T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B23K35/3603—Halide salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)
AT01998186T 2000-11-29 2001-11-29 Lötpasten ATE400395T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000362985 2000-11-29

Publications (1)

Publication Number Publication Date
ATE400395T1 true ATE400395T1 (de) 2008-07-15

Family

ID=18834169

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01998186T ATE400395T1 (de) 2000-11-29 2001-11-29 Lötpasten

Country Status (9)

Country Link
US (1) US6926849B2 (de)
EP (1) EP1348513B1 (de)
JP (1) JP4103591B2 (de)
KR (1) KR100613640B1 (de)
CN (1) CN1247360C (de)
AT (1) ATE400395T1 (de)
DE (1) DE60134781D1 (de)
MY (1) MY138347A (de)
WO (1) WO2002043916A1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1348513B1 (de) * 2000-11-29 2008-07-09 Senju Metal Industry Co., Ltd. Lötpasten
EP1541654B1 (de) * 2002-09-04 2012-02-29 Namics Corporation Leitfähiger klebstoff und ihn enthaltender schaltkreis
JP2004322139A (ja) * 2003-04-24 2004-11-18 Tamura Kaken Co Ltd 回路基板のバンプ形成用ソルダーペースト及びフラックス
US7074627B2 (en) * 2004-06-29 2006-07-11 Freescale Semiconductor, Inc. Lead solder indicator and method
JP2006181635A (ja) * 2004-12-28 2006-07-13 Senju Metal Ind Co Ltd 鉛フリーはんだの黒化防止方法およびソルダペースト
CN100488703C (zh) * 2006-10-13 2009-05-20 华南理工大学 一种铜粉增强的锡锌复合钎料及其制备方法
US9073154B2 (en) 2006-12-12 2015-07-07 Senju Metal Industry Co., Ltd. Flux for lead-free solder and soldering method
CN101347874B (zh) * 2008-08-19 2011-04-06 深圳悍豹科技有限公司 调谐器专用低温节能无铅锡膏
KR100977163B1 (ko) * 2009-03-23 2010-08-20 덕산하이메탈(주) 솔더 접착제와 그 제조 방법 및 이를 포함하는 전자 장치
US8070047B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
US8070044B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Polyamine flux composition and method of soldering
US8070043B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8070046B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
US8070045B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable amine flux composition and method of soldering
CN102198567A (zh) * 2011-05-09 2011-09-28 深圳市同方电子新材料有限公司 基于Sn-Zn的无铅焊锡膏
US8434666B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
US8430293B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable amine, carboxylic acid flux composition and method of soldering
US8434667B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Polyamine, carboxylic acid flux composition and method of soldering
US8430295B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8430294B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Amine, carboxylic acid flux composition and method of soldering
US10158032B2 (en) 2012-10-12 2018-12-18 Heraeus Deutschland GmbH & Co. KG Solar cells produced from high Ohmic wafers and halogen containing paste
CN104737630B (zh) * 2012-10-15 2016-02-03 千住金属工业株式会社 低温焊膏的焊接方法
US9520347B2 (en) 2013-05-03 2016-12-13 Honeywell International Inc. Lead frame construct for lead-free solder connections
KR20160121562A (ko) 2014-02-20 2016-10-19 허니웰 인터내셔날 인코포레이티드 무연 솔더 조성물
CN108296668A (zh) * 2017-12-21 2018-07-20 柳州智臻智能机械有限公司 一种无铅焊料合金及其制备方法
TWI817980B (zh) * 2018-01-16 2023-10-11 日商千住金屬工業股份有限公司 助焊劑及焊膏
JP6903037B2 (ja) * 2018-07-20 2021-07-14 千住金属工業株式会社 ソルダペースト
JP6555402B1 (ja) * 2018-07-27 2019-08-07 千住金属工業株式会社 ソルダペースト
JP6849923B2 (ja) * 2018-07-27 2021-03-31 千住金属工業株式会社 ソルダペースト
JP6676242B1 (ja) * 2019-05-27 2020-04-08 千住金属工業株式会社 ソルダペースト
TWI753469B (zh) 2019-06-27 2022-01-21 日商弘輝股份有限公司 助焊劑及焊膏
JP6845452B1 (ja) * 2020-03-30 2021-03-17 千住金属工業株式会社 はんだ接合不良抑制剤、フラックスおよびソルダペースト
CN113441806A (zh) * 2021-04-27 2021-09-28 中国电子科技集团公司第十四研究所 一种汇流环电刷焊接装置和方法
JP2025167896A (ja) * 2024-04-26 2025-11-07 株式会社弘輝 はんだ用フラックス及びはんだ材料

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5088189A (en) * 1990-08-31 1992-02-18 Federated Fry Metals Electronic manufacturing process
JPH0615483A (ja) * 1992-07-02 1994-01-25 Shikoku Chem Corp はんだ付け用フラックス及びはんだペースト組成物
JPH08155676A (ja) * 1994-12-06 1996-06-18 Murata Mfg Co Ltd フラックス組成物
JP3106910B2 (ja) * 1995-06-20 2000-11-06 松下電器産業株式会社 低融点半田用フラックス
US5851311A (en) * 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
EP0974419A3 (de) * 1998-07-24 2003-10-15 Oatey Company Wasserlösliche Flussmittel und dessen Verwendung
JP3105505B1 (ja) * 1999-11-19 2000-11-06 株式会社ニホンゲンマ はんだ用フラックスおよびソルダペースト
JP4426076B2 (ja) 2000-08-08 2010-03-03 昭和電工株式会社 低温活性ハンダペースト
EP1348513B1 (de) * 2000-11-29 2008-07-09 Senju Metal Industry Co., Ltd. Lötpasten

Also Published As

Publication number Publication date
JPWO2002043916A1 (ja) 2004-04-02
US6926849B2 (en) 2005-08-09
WO2002043916A1 (en) 2002-06-06
CN1247360C (zh) 2006-03-29
US20040069974A1 (en) 2004-04-15
DE60134781D1 (de) 2008-08-21
EP1348513A4 (de) 2007-04-04
EP1348513A1 (de) 2003-10-01
MY138347A (en) 2009-05-29
KR100613640B1 (ko) 2006-08-17
JP4103591B2 (ja) 2008-06-18
CN1478009A (zh) 2004-02-25
KR20030055327A (ko) 2003-07-02
EP1348513B1 (de) 2008-07-09

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties