ATE269632T1 - Element zur elektromagnetischen abschirmung und verfahren zu seiner herstellung - Google Patents
Element zur elektromagnetischen abschirmung und verfahren zu seiner herstellungInfo
- Publication number
- ATE269632T1 ATE269632T1 AT02778172T AT02778172T ATE269632T1 AT E269632 T1 ATE269632 T1 AT E269632T1 AT 02778172 T AT02778172 T AT 02778172T AT 02778172 T AT02778172 T AT 02778172T AT E269632 T1 ATE269632 T1 AT E269632T1
- Authority
- AT
- Austria
- Prior art keywords
- electromagnetic shielding
- producing
- shielding element
- bead
- base station
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000011324 bead Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 230000005293 ferrimagnetic effect Effects 0.000 abstract 1
- 230000005294 ferromagnetic effect Effects 0.000 abstract 1
- 230000005291 magnetic effect Effects 0.000 abstract 1
- 239000011345 viscous material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
- B29C70/62—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres the filler being oriented during moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
- B29L2031/3055—Cars
- B29L2031/3061—Number plates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49067—Specified diverse magnetic materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Telephone Set Structure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE0103597A SE521689C2 (sv) | 2001-10-26 | 2001-10-26 | Element för elektromagnetisk skärmning samt metod för framställning därav |
| PCT/SE2002/001926 WO2003037057A1 (en) | 2001-10-26 | 2002-10-23 | Element for electromagnetic shielding and method for manufacturing thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE269632T1 true ATE269632T1 (de) | 2004-07-15 |
Family
ID=20285805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02778172T ATE269632T1 (de) | 2001-10-26 | 2002-10-23 | Element zur elektromagnetischen abschirmung und verfahren zu seiner herstellung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7161090B2 (de) |
| EP (1) | EP1360885B1 (de) |
| CN (1) | CN1259802C (de) |
| AT (1) | ATE269632T1 (de) |
| DE (2) | DE20280417U1 (de) |
| SE (1) | SE521689C2 (de) |
| WO (1) | WO2003037057A1 (de) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10221100C1 (de) * | 2002-05-03 | 2003-06-05 | Neuhaus Elektronik Gmbh | Elektrisch leitfähige Dichtung sowie Verfahren und Vorrichtung zu deren Herstellung |
| CN1332592C (zh) * | 2004-01-09 | 2007-08-15 | 佛山市顺德区顺达电脑厂有限公司 | 抑制电磁干扰以及在电路板上制作扼流器的方法 |
| PL1701605T3 (pl) * | 2005-03-11 | 2008-07-31 | Mtc Micro Tech Components Gmbh | Taśma uszczelniająca przed promieniowaniem elektromagnetycznym wysokiej częstotliwości |
| DE102006016725B4 (de) * | 2006-04-04 | 2010-07-01 | Rcc Polymertechnik Gmbh | Verfahren zur Herstellung von Elastomer- oder Duromerteilen mit einer Schicht hoher elektrischer Leitfähigkeit |
| US8623265B2 (en) * | 2007-02-06 | 2014-01-07 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and articles thereof |
| US7815998B2 (en) * | 2007-02-06 | 2010-10-19 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and uses thereof |
| US20100240421A1 (en) * | 2009-03-17 | 2010-09-23 | Michael Sekora | Cellular phone cover/case that blocks radiation from reaching the user through the implementation of faraday cage and/or conductive material properties |
| JP2013515840A (ja) * | 2009-12-29 | 2013-05-09 | ロジャース コーポレーション | 導電性ポリマーフォーム、その製造方法および使用 |
| US9545043B1 (en) * | 2010-09-28 | 2017-01-10 | Rockwell Collins, Inc. | Shielding encapsulation for electrical circuitry |
| EP2461657A1 (de) | 2010-12-02 | 2012-06-06 | Siemens Aktiengesellschaft | Elektrische Baugruppe und Verfahren zur Herstellung einer elektrischen Baugruppe |
| US8270929B1 (en) | 2011-09-09 | 2012-09-18 | Contech RF Devices, LLC | RF shielding for mobile devices |
| US8921709B2 (en) | 2013-03-15 | 2014-12-30 | Continental Accessory Corp. | RF shielding for mobile devices |
| US9845142B2 (en) * | 2014-08-15 | 2017-12-19 | The Boeing Company | Conductive thermoplastic ground plane for use in an aircraft |
| KR20230132021A (ko) * | 2022-03-07 | 2023-09-15 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조방법 |
| EP4483494A4 (de) | 2022-03-12 | 2026-01-21 | Tigran Khachatryan | Funktionale rf/emk-abschirmungsfolie und vorrichtung |
| SE546233C2 (en) * | 2022-10-18 | 2024-07-23 | Nolato Silikonteknik Ab | Method for manufacturing a gasket for electromagnetic shielding |
| SE546302C2 (en) * | 2023-01-13 | 2024-10-01 | Nolato Silikonteknik Ab | Multilayer gasket for electromagnetic shielding comprising wave-reflecting and wave-absorbing layers |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2849312A (en) * | 1954-02-01 | 1958-08-26 | Milton J Peterman | Method of aligning magnetic particles in a non-magnetic matrix |
| JPS5826381B2 (ja) | 1979-04-28 | 1983-06-02 | 信越ポリマ−株式会社 | 電磁気シ−ルドガスケットおよびその製造方法 |
| US5006397A (en) * | 1987-02-06 | 1991-04-09 | Key-Tech, Inc. | Printed circuit board |
| US4770685A (en) * | 1987-07-13 | 1988-09-13 | Ford Motor Company | Method of manufacturing a formed glass sheet with paint thereon |
| US4778635A (en) * | 1987-09-18 | 1988-10-18 | American Telephone And Telegraph Company | Method and apparatus for fabricating anisotropically conductive material |
| DE4319965C3 (de) * | 1993-06-14 | 2000-09-14 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung |
| US5443876A (en) * | 1993-12-30 | 1995-08-22 | Minnesota Mining And Manufacturing Company | Electrically conductive structured sheets |
| US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
| US5882720A (en) * | 1996-02-01 | 1999-03-16 | Mpm Corporation | Monitoring deposited pads |
| US6121545A (en) * | 1997-07-11 | 2000-09-19 | Parker-Hannifin Corporation | Low closure force EMI shielding spacer gasket |
-
2001
- 2001-10-26 SE SE0103597A patent/SE521689C2/sv not_active IP Right Cessation
-
2002
- 2002-10-23 WO PCT/SE2002/001926 patent/WO2003037057A1/en not_active Ceased
- 2002-10-23 DE DE20280417U patent/DE20280417U1/de not_active Expired - Lifetime
- 2002-10-23 AT AT02778172T patent/ATE269632T1/de not_active IP Right Cessation
- 2002-10-23 EP EP02778172A patent/EP1360885B1/de not_active Expired - Lifetime
- 2002-10-23 US US10/432,929 patent/US7161090B2/en not_active Expired - Lifetime
- 2002-10-23 CN CN02803328.0A patent/CN1259802C/zh not_active Expired - Lifetime
- 2002-10-23 DE DE60200654T patent/DE60200654T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20040026100A1 (en) | 2004-02-12 |
| SE0103597D0 (sv) | 2001-10-26 |
| SE0103597L (sv) | 2003-04-27 |
| DE60200654D1 (de) | 2004-07-22 |
| EP1360885B1 (de) | 2004-06-16 |
| WO2003037057A1 (en) | 2003-05-01 |
| US7161090B2 (en) | 2007-01-09 |
| CN1259802C (zh) | 2006-06-14 |
| DE60200654T2 (de) | 2004-11-11 |
| SE521689C2 (sv) | 2003-11-25 |
| DE20280417U1 (de) | 2004-06-09 |
| CN1481661A (zh) | 2004-03-10 |
| EP1360885A1 (de) | 2003-11-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |