ATE272922T1 - Bildaufnahmevorrichtung und bildaufnahmelinse - Google Patents
Bildaufnahmevorrichtung und bildaufnahmelinseInfo
- Publication number
- ATE272922T1 ATE272922T1 AT02250063T AT02250063T ATE272922T1 AT E272922 T1 ATE272922 T1 AT E272922T1 AT 02250063 T AT02250063 T AT 02250063T AT 02250063 T AT02250063 T AT 02250063T AT E272922 T1 ATE272922 T1 AT E272922T1
- Authority
- AT
- Austria
- Prior art keywords
- image recording
- image pickup
- section
- lens
- pickup element
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/0025—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having one lens only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/003—Alignment of optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/026—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using retaining rings or springs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/407—Optical elements or arrangements indirectly associated with the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Wire Bonding (AREA)
- Cameras In General (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001004706 | 2001-01-12 | ||
| JP2001033111 | 2001-02-09 | ||
| JP2001148912 | 2001-05-18 | ||
| JP2001155083 | 2001-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE272922T1 true ATE272922T1 (de) | 2004-08-15 |
Family
ID=27481967
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02250063T ATE272922T1 (de) | 2001-01-12 | 2002-01-07 | Bildaufnahmevorrichtung und bildaufnahmelinse |
| AT04010162T ATE399437T1 (de) | 2001-01-12 | 2002-01-07 | Bildaufnahmevorrichtung und bildaufnahmelinse |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04010162T ATE399437T1 (de) | 2001-01-12 | 2002-01-07 | Bildaufnahmevorrichtung und bildaufnahmelinse |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7528880B2 (de) |
| EP (2) | EP1443755B1 (de) |
| KR (2) | KR100864557B1 (de) |
| CN (1) | CN100473074C (de) |
| AT (2) | ATE272922T1 (de) |
| DE (2) | DE60227275D1 (de) |
| TW (1) | TW523924B (de) |
Families Citing this family (99)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4698874B2 (ja) * | 2001-04-24 | 2011-06-08 | ローム株式会社 | イメージセンサモジュール、およびイメージセンサモジュールの製造方法 |
| US7092174B2 (en) * | 2001-05-18 | 2006-08-15 | Konica Corporation | Image pickup lens, image pickup apparatus and method for forming image pickup lens |
| TW540157B (en) * | 2001-05-31 | 2003-07-01 | Konishiroku Photo Ind | CMOS image sensor |
| JP4061936B2 (ja) * | 2002-03-22 | 2008-03-19 | コニカミノルタホールディングス株式会社 | 撮像装置 |
| EP1357606A1 (de) * | 2002-04-22 | 2003-10-29 | Scientek Corporation | Gehäuse für einen Halbleiter-Bildsensor |
| JP2003318585A (ja) * | 2002-04-24 | 2003-11-07 | Toshiba Corp | 電子機器 |
| US7127793B2 (en) * | 2002-04-24 | 2006-10-31 | Fuji Photo Film Co., Ltd. | Method of producing solid state pickup device |
| WO2004003618A1 (ja) * | 2002-07-01 | 2004-01-08 | Rohm Co., Ltd. | イメージセンサモジュール |
| JP4397819B2 (ja) * | 2002-09-17 | 2010-01-13 | アンテルヨン、ベスローテン、フェンノートシャップ | カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法 |
| US20040061799A1 (en) * | 2002-09-27 | 2004-04-01 | Konica Corporation | Image pickup device and portable terminal equipped therewith |
| JP3915683B2 (ja) * | 2002-12-05 | 2007-05-16 | ソニー株式会社 | レンズ鏡筒および撮像装置 |
| JP2004194223A (ja) * | 2002-12-13 | 2004-07-08 | Konica Minolta Holdings Inc | 撮像装置及び携帯端末 |
| JP4300811B2 (ja) * | 2003-02-03 | 2009-07-22 | コニカミノルタホールディングス株式会社 | 撮像装置及び携帯端末 |
| JP2004296453A (ja) * | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
| JP4204368B2 (ja) * | 2003-03-28 | 2009-01-07 | シャープ株式会社 | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
| JP4223851B2 (ja) * | 2003-03-31 | 2009-02-12 | ミツミ電機株式会社 | 小型カメラモジュール |
| FR2854496B1 (fr) * | 2003-04-29 | 2005-09-16 | St Microelectronics Sa | Boitier semi-conducteur |
| US7453516B2 (en) * | 2003-06-04 | 2008-11-18 | Aptina Imaging Corporation | Flexible camera lens barrel |
| EP1643282A4 (de) * | 2003-07-08 | 2009-06-03 | Konica Minolta Opto Inc | Bildgebereinrichtung, tragbares endgerät damit bildeinrichtungs-erzeugungsverfahren |
| KR100532287B1 (ko) * | 2003-09-17 | 2005-11-29 | 삼성전자주식회사 | 휴대용 카메라 모듈의 미세 이물질 제거 장치 및 방법 |
| JP3921467B2 (ja) * | 2003-12-11 | 2007-05-30 | シャープ株式会社 | カメラモジュール、カメラモジュールの製造方法、電子機器及び電子機器の製造方法 |
| KR100617680B1 (ko) * | 2003-12-31 | 2006-08-28 | 삼성전자주식회사 | 카메라 렌즈 모듈의 렌즈 홀더 장치 |
| KR100800705B1 (ko) * | 2004-03-26 | 2008-02-01 | 삼성전자주식회사 | 입사파에 의해 발생되는 반사파를 억제하는 카메라 렌즈장치 |
| TWM271321U (en) * | 2004-09-10 | 2005-07-21 | Aiptek Int Inc | Flip-chip packaging device |
| US7486240B2 (en) * | 2004-10-12 | 2009-02-03 | Qualcomm Incorporated | Devices and methods for retaining an antenna |
| US7133222B2 (en) * | 2004-10-12 | 2006-11-07 | Qualcomm, Inc. | Devices and methods for retaining a lens in a mobile electronic device |
| JP2006148710A (ja) * | 2004-11-22 | 2006-06-08 | Sharp Corp | 撮像モジュール及び撮像モジュールの製造方法 |
| JP2006195331A (ja) * | 2005-01-17 | 2006-07-27 | Matsushita Electric Ind Co Ltd | 撮影レンズ |
| CN100520472C (zh) * | 2005-01-25 | 2009-07-29 | 柯尼卡美能达精密光学株式会社 | 摄像装置以及具有该摄像装置的便携式终端 |
| JP2006276463A (ja) * | 2005-03-29 | 2006-10-12 | Sharp Corp | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
| KR100691157B1 (ko) | 2005-04-07 | 2007-03-09 | 삼성전기주식회사 | 포커싱 무조정형 카메라 모듈 |
| US8085318B2 (en) * | 2005-10-11 | 2011-12-27 | Apple Inc. | Real-time image capture and manipulation based on streaming data |
| CN100470349C (zh) * | 2005-06-28 | 2009-03-18 | 华硕电脑股份有限公司 | 影像撷取模组 |
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| US7554599B2 (en) * | 2006-03-02 | 2009-06-30 | Kingpak Technology, Inc. | Image sensor module with air escape hole and a method for manufacturing the same |
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| JP4189769B2 (ja) * | 2006-10-18 | 2008-12-03 | 進展産業株式会社 | 撮像装置 |
| JP5060767B2 (ja) * | 2006-11-06 | 2012-10-31 | 富士フイルム株式会社 | レンズ装置 |
| JP4923967B2 (ja) * | 2006-11-14 | 2012-04-25 | 凸版印刷株式会社 | 固体撮像装置及び電子機器 |
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| US8456560B2 (en) * | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
| KR100843300B1 (ko) * | 2007-04-12 | 2008-07-03 | 삼성전기주식회사 | 카메라 모듈 및 그 제조방법 |
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| JP5521649B2 (ja) | 2010-03-05 | 2014-06-18 | 株式会社リコー | 撮像装置及び車載カメラ |
| TWI426311B (zh) * | 2010-04-13 | 2014-02-11 | Himax Tech Ltd | 晶圓級鏡頭模組、製造晶圓級鏡頭模組的方法與晶圓級攝影機 |
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| WO2013015929A1 (en) * | 2011-07-22 | 2013-01-31 | Alex Ning | Lens mount |
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| CN103988062B (zh) * | 2011-12-14 | 2017-09-22 | 松下知识产权经营株式会社 | 红外传感器 |
| JP5984378B2 (ja) * | 2011-12-22 | 2016-09-06 | キヤノン株式会社 | 撮像装置 |
| KR20130083249A (ko) * | 2012-01-12 | 2013-07-22 | 삼성전자주식회사 | 반도체 장치 및 이를 이용한 이미지 센서 패키지 |
| CN103293626A (zh) * | 2012-02-27 | 2013-09-11 | 鸿富锦精密工业(深圳)有限公司 | 镜头模组及其组装方法 |
| US20130258474A1 (en) * | 2012-04-03 | 2013-10-03 | Cheng-Ta Chen | Optoelectronic device with improved lens cap |
| US20130270426A1 (en) * | 2012-04-13 | 2013-10-17 | Global Microptics Company | Lens module |
| EP2653917B1 (de) * | 2012-04-17 | 2017-02-08 | Basler AG | Objektivadapter für Kameras |
| JP5962235B2 (ja) * | 2012-06-07 | 2016-08-03 | オムロン株式会社 | 物体の固定構造およびこの構造を用いた光学装置 |
| US9307128B2 (en) | 2012-06-26 | 2016-04-05 | Alex Ning | Lens mount |
| TWI534494B (zh) * | 2012-07-12 | 2016-05-21 | 鴻海精密工業股份有限公司 | 鏡頭模組組裝平臺、組裝裝置及組裝方法 |
| CN103543534B (zh) * | 2012-07-17 | 2017-09-26 | 鸿富锦精密工业(深圳)有限公司 | 镜头模块组装平台、组装装置及组装方法 |
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| EP3707750B1 (de) * | 2017-11-07 | 2024-12-04 | AMS Sensors Singapore Pte. Ltd. | Optoelektronische module mit verriegelungsanordnungen und verfahren zu ihrer herstellung |
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| CN109348104B (zh) * | 2018-10-30 | 2021-01-08 | 维沃移动通信(杭州)有限公司 | 摄像头模组、电子设备及拍摄方法 |
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| TWI702433B (zh) | 2019-07-25 | 2020-08-21 | 大立光電股份有限公司 | 成像鏡頭模組、相機模組及電子裝置 |
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-
2002
- 2002-01-04 TW TW091100081A patent/TW523924B/zh not_active IP Right Cessation
- 2002-01-07 DE DE60227275T patent/DE60227275D1/de not_active Expired - Lifetime
- 2002-01-07 AT AT02250063T patent/ATE272922T1/de not_active IP Right Cessation
- 2002-01-07 DE DE60200840T patent/DE60200840T2/de not_active Expired - Lifetime
- 2002-01-07 EP EP04010162A patent/EP1443755B1/de not_active Expired - Lifetime
- 2002-01-07 EP EP02250063A patent/EP1223749B1/de not_active Expired - Lifetime
- 2002-01-07 AT AT04010162T patent/ATE399437T1/de not_active IP Right Cessation
- 2002-01-09 US US10/040,437 patent/US7528880B2/en not_active Expired - Fee Related
- 2002-01-11 CN CNB021018154A patent/CN100473074C/zh not_active Expired - Fee Related
- 2002-01-11 KR KR1020020001622A patent/KR100864557B1/ko not_active Expired - Fee Related
-
2007
- 2007-10-29 KR KR1020070108669A patent/KR100824125B1/ko not_active Expired - Fee Related
- 2007-12-19 US US12/000,937 patent/US7880796B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20080143864A1 (en) | 2008-06-19 |
| US20020131782A1 (en) | 2002-09-19 |
| CN100473074C (zh) | 2009-03-25 |
| KR100824125B1 (ko) | 2008-04-21 |
| DE60227275D1 (de) | 2008-08-07 |
| KR20020061108A (ko) | 2002-07-22 |
| ATE399437T1 (de) | 2008-07-15 |
| EP1223749B1 (de) | 2004-08-04 |
| EP1443755B1 (de) | 2008-06-25 |
| KR100864557B1 (ko) | 2008-10-20 |
| US7528880B2 (en) | 2009-05-05 |
| DE60200840D1 (de) | 2004-09-09 |
| EP1223749A1 (de) | 2002-07-17 |
| EP1443755A2 (de) | 2004-08-04 |
| CN1365221A (zh) | 2002-08-21 |
| TW523924B (en) | 2003-03-11 |
| DE60200840T2 (de) | 2005-08-04 |
| KR20070110235A (ko) | 2007-11-16 |
| EP1443755A3 (de) | 2005-11-16 |
| US7880796B2 (en) | 2011-02-01 |
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