ATE274287T1 - Überbrückungskondensator-verfahren zum erreichen eines gewünschten elektrischen impedanzwerts zwischen parallelen planaren leitern einer elektrischen stromverteilungsstruktur, und zugehörige elektrische stromverteilungsstrukturen - Google Patents

Überbrückungskondensator-verfahren zum erreichen eines gewünschten elektrischen impedanzwerts zwischen parallelen planaren leitern einer elektrischen stromverteilungsstruktur, und zugehörige elektrische stromverteilungsstrukturen

Info

Publication number
ATE274287T1
ATE274287T1 AT01948427T AT01948427T ATE274287T1 AT E274287 T1 ATE274287 T1 AT E274287T1 AT 01948427 T AT01948427 T AT 01948427T AT 01948427 T AT01948427 T AT 01948427T AT E274287 T1 ATE274287 T1 AT E274287T1
Authority
AT
Austria
Prior art keywords
power distribution
planar conductors
electrical power
capacitors
capacitor
Prior art date
Application number
AT01948427T
Other languages
English (en)
Inventor
Istvan Novak
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Application granted granted Critical
Publication of ATE274287T1 publication Critical patent/ATE274287T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Evolutionary Computation (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structure Of Printed Boards (AREA)
  • Power Conversion In General (AREA)
  • Filters And Equalizers (AREA)
  • Amplifiers (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
AT01948427T 2000-06-19 2001-06-14 Überbrückungskondensator-verfahren zum erreichen eines gewünschten elektrischen impedanzwerts zwischen parallelen planaren leitern einer elektrischen stromverteilungsstruktur, und zugehörige elektrische stromverteilungsstrukturen ATE274287T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/596,863 US6727774B1 (en) 2000-06-19 2000-06-19 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures
PCT/US2001/019380 WO2001099479A2 (en) 2000-06-19 2001-06-14 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures

Publications (1)

Publication Number Publication Date
ATE274287T1 true ATE274287T1 (de) 2004-09-15

Family

ID=24389033

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01948427T ATE274287T1 (de) 2000-06-19 2001-06-14 Überbrückungskondensator-verfahren zum erreichen eines gewünschten elektrischen impedanzwerts zwischen parallelen planaren leitern einer elektrischen stromverteilungsstruktur, und zugehörige elektrische stromverteilungsstrukturen

Country Status (7)

Country Link
US (1) US6727774B1 (de)
EP (1) EP1295516B1 (de)
JP (1) JP2004501515A (de)
AT (1) ATE274287T1 (de)
AU (1) AU2001269879A1 (de)
DE (1) DE60105030T2 (de)
WO (1) WO2001099479A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2503793A1 (en) 2002-10-22 2004-05-06 Jason A. Sullivan Systems and methods for providing a dynamically modular processing unit
EP1557075A4 (de) 2002-10-22 2010-01-13 Sullivan Jason Nicht-peripheres verarbeitungssteuermodul mit verbesserten wärmeableiteigenschaften
CA2504222C (en) 2002-10-22 2012-05-22 Jason A. Sullivan Robust customizable computer processing system
US7282647B2 (en) * 2002-12-23 2007-10-16 Intel Corporation Apparatus for improving coupling across plane discontinuities on circuit boards
DE10305520A1 (de) * 2003-02-11 2004-08-19 Robert Bosch Gmbh Vorrichtung und Verfahren zur Dämpfung von Hohlraumresonanzen in einer mehrschichtigen Trägereinrichtung
US20070083841A1 (en) * 2005-10-06 2007-04-12 Lantz John E Assessing bypass capacitor locations in printed circuit board design
US7705691B2 (en) * 2005-10-18 2010-04-27 Agency For Science, Technology & Research Capacitor interconnection
US20070279882A1 (en) * 2006-06-06 2007-12-06 Samtec, Inc. Power distribution system for integrated circuits
US7773390B2 (en) * 2006-06-06 2010-08-10 Teraspeed Consulting Group Llc Power distribution system for integrated circuits
US7886431B2 (en) * 2006-06-06 2011-02-15 Teraspeed Consulting Group Llc Power distribution system for integrated circuits
US20120002455A1 (en) * 2010-06-07 2012-01-05 Sullivan Jason A Miniturization techniques, systems, and apparatus relatng to power supplies, memory, interconnections, and leds
US8952503B2 (en) 2013-01-29 2015-02-10 International Business Machines Corporation Organic module EMI shielding structures and methods
CN113224237B (zh) * 2020-02-05 2022-07-29 联芯集成电路制造(厦门)有限公司 电容器结构的制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3209284A (en) 1963-06-05 1965-09-28 Charles O Hast Termination for strip transmission lines
US3678417A (en) 1971-07-14 1972-07-18 Collins Radio Co Planar r. f. load resistor for microstrip or stripline
US4371746A (en) 1978-01-05 1983-02-01 Peptek, Incorporated Edge terminations for impedance planes
JPS60134440A (ja) 1983-12-23 1985-07-17 Hitachi Ltd 半導体集積回路装置
US5114912A (en) 1991-05-13 1992-05-19 The United States Of America As Represented By The Secretary Of Commerce Two-dimensional, Josephson-array, voltage-tunable, high-frequency oscillator
US5266036A (en) 1992-06-02 1993-11-30 Hewlett-Packard Company Reduction of radio frequency emissions through terminating geometrically induced transmission lines in computer products
JP3089443B2 (ja) 1992-07-24 2000-09-18 本田技研工業株式会社 非放射性誘電体線路
US5598131A (en) 1995-11-16 1997-01-28 Emc Technology, Inc. AC coupled termination
JP3036629B2 (ja) * 1996-10-07 2000-04-24 富士ゼロックス株式会社 プリント配線基板装置
US5708400A (en) 1996-10-30 1998-01-13 Hewlett-Packard Company AC coupled termination of a printed circuit board power plane in its characteristic impedance
US5818315A (en) 1996-12-31 1998-10-06 Lucent Technologies Inc. Signal trace impedance control using a grid-like ground plane
JP3055136B2 (ja) * 1998-03-16 2000-06-26 日本電気株式会社 プリント回路基板
US6104258A (en) 1998-05-19 2000-08-15 Sun Microsystems, Inc. System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus
US6532439B2 (en) * 1998-06-18 2003-03-11 Sun Microsystems, Inc. Method for determining the desired decoupling components for power distribution systems

Also Published As

Publication number Publication date
WO2001099479A2 (en) 2001-12-27
EP1295516B1 (de) 2004-08-18
DE60105030D1 (de) 2004-09-23
AU2001269879A1 (en) 2002-01-02
WO2001099479A3 (en) 2002-03-28
DE60105030T2 (de) 2005-08-18
EP1295516A2 (de) 2003-03-26
US6727774B1 (en) 2004-04-27
JP2004501515A (ja) 2004-01-15

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