ATE274539T1 - Nichtfliessende flussmittel- klebstoffzusammensetzungen - Google Patents

Nichtfliessende flussmittel- klebstoffzusammensetzungen

Info

Publication number
ATE274539T1
ATE274539T1 AT01950659T AT01950659T ATE274539T1 AT E274539 T1 ATE274539 T1 AT E274539T1 AT 01950659 T AT01950659 T AT 01950659T AT 01950659 T AT01950659 T AT 01950659T AT E274539 T1 ATE274539 T1 AT E274539T1
Authority
AT
Austria
Prior art keywords
adhesive compositions
anhydride
flowing flux
epoxy resin
embodiment further
Prior art date
Application number
AT01950659T
Other languages
English (en)
Inventor
Scott B Charles
Robert J Kinney
Michael A Kropp
Roger A Mader
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE274539T1 publication Critical patent/ATE274539T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT01950659T 2000-07-06 2001-06-29 Nichtfliessende flussmittel- klebstoffzusammensetzungen ATE274539T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21628000P 2000-07-06 2000-07-06
PCT/US2001/020734 WO2002004541A2 (en) 2000-07-06 2001-06-29 No-flow flux adhesive compositions

Publications (1)

Publication Number Publication Date
ATE274539T1 true ATE274539T1 (de) 2004-09-15

Family

ID=22806455

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01950659T ATE274539T1 (de) 2000-07-06 2001-06-29 Nichtfliessende flussmittel- klebstoffzusammensetzungen

Country Status (8)

Country Link
US (1) US6528169B2 (de)
EP (1) EP1299447B1 (de)
JP (1) JP2004502846A (de)
CN (1) CN1449418A (de)
AT (1) ATE274539T1 (de)
AU (1) AU2001271627A1 (de)
DE (1) DE60105164T2 (de)
WO (1) WO2002004541A2 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3617999A (en) * 1998-04-22 1999-11-08 Hugh Patrick Craig Adhesive and encapsulating material with fluxing properties
US7323360B2 (en) 2001-10-26 2008-01-29 Intel Corporation Electronic assemblies with filled no-flow underfill
US6620512B2 (en) * 2001-12-21 2003-09-16 Intel Corporation Anhydride polymers for use as curing agents in epoxy resin-based underfill material
WO2004043086A2 (en) * 2002-11-05 2004-05-21 Telefonaktiebolaget Lm Ericsson (Publ) Collective notification of node reset to subset of connections in radio access network
US6882058B2 (en) 2002-11-05 2005-04-19 Henkel Corporation Organic acid containing compositions and methods for use thereof
US20060147719A1 (en) * 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
US20040101688A1 (en) * 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
US20040102529A1 (en) * 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
US20050181214A1 (en) * 2002-11-22 2005-08-18 John Robert Campbell Curable epoxy compositions, methods and articles made therefrom
US6902954B2 (en) * 2003-03-31 2005-06-07 Intel Corporation Temperature sustaining flip chip assembly process
JP2004307859A (ja) * 2003-04-05 2004-11-04 Rohm & Haas Electronic Materials Llc 電子デバイス製造
US7004375B2 (en) * 2003-05-23 2006-02-28 National Starch And Chemical Investment Holding Corporation Pre-applied fluxing underfill composition having pressure sensitive adhesive properties
US20040235996A1 (en) * 2003-05-23 2004-11-25 Jayesh Shah Foamable underfill encapsulant
US7047633B2 (en) * 2003-05-23 2006-05-23 National Starch And Chemical Investment Holding, Corporation Method of using pre-applied underfill encapsulant
US20040245611A1 (en) * 2003-05-23 2004-12-09 Paul Morganelli Pre-applied thermoplastic reinforcement for electronic components
US6978540B2 (en) * 2003-05-23 2005-12-27 National Starch And Chemical Investment Holding Corporation Method for pre-applied thermoplastic reinforcement of electronic components
US20040232530A1 (en) * 2003-05-23 2004-11-25 Paul Morganelli Pre-applied thermoplastic reinforcement for electronic components
US20040238925A1 (en) * 2003-05-23 2004-12-02 Paul Morganelli Pre-applied thermoplastic reinforcement for electronic components
US20060142424A1 (en) * 2003-05-23 2006-06-29 Jayesh Shah Foamable underfill encapsulant
JP4396879B2 (ja) * 2003-06-06 2010-01-13 インターメタリックス株式会社 粘着層形成方法
US7279223B2 (en) * 2003-12-16 2007-10-09 General Electric Company Underfill composition and packaged solid state device
US20060025509A1 (en) * 2004-07-29 2006-02-02 Ruzhi Zhang Fluxing no-flow underfill composition containing benzoxazines
EP1628508A1 (de) * 2004-08-19 2006-02-22 Valtronic S.A. Verfahren zur Herstellung einer elektronischen Baugruppe
US20060177966A1 (en) * 2005-02-09 2006-08-10 Jayesh Shah Package or pre-applied foamable underfill for lead-free process
JP5503830B2 (ja) * 2005-07-07 2014-05-28 積水化学工業株式会社 エポキシ系接着剤組成物及び接合方法
DE102005060348A1 (de) * 2005-09-28 2007-03-29 Osram Opto Semiconductors Gmbh Epoxidharzsystem sowie aus dem Epoxidharzsystem herstellbarer Formstoff und optoelektronisches Bauelement mit dem Formstoff
CN101490187A (zh) * 2006-05-16 2009-07-22 洛德公司 用于电子组件的可固化的防护剂
EP2260512A4 (de) * 2008-03-19 2016-04-06 Henkel Ltd Verfahren zum herstellen einer halbleiterkapselung oder schaltungsbaugruppe unter verwendung einer auf lötkontaktpunkte in einem eintauchprozess aufgebrachten flussmittelunterfüllungszusammensetzung
US9456513B2 (en) * 2009-02-25 2016-09-27 3M Innovative Properties Company Article with gasket having moisture transmission resistivity and method
JP5707110B2 (ja) * 2010-11-26 2015-04-22 デクセリアルズ株式会社 導電性接着材料、太陽電池モジュール及びその製造方法
FR3006493A1 (fr) * 2013-06-04 2014-12-05 Nexans Cable electrique a moyenne ou haute tension
CN104559892A (zh) * 2014-11-17 2015-04-29 南京艾布纳密封技术有限公司 一种环氧树脂灌封胶及其制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3052650A (en) 1953-03-27 1962-09-04 Minnesota Mining & Mfg Heat-curing epoxy resin compositions
US2993920A (en) 1958-09-23 1961-07-25 Archer Daniels Midland Co Resins and method of making the same
DE1763034A1 (de) 1968-03-26 1971-09-30 Licentia Gmbh Wicklungsisolation
US4097449A (en) * 1977-03-04 1978-06-27 Gulf Oil Corporation Handleable, thermosettable epoxide-polyanhydride compositions
US5227243A (en) * 1986-03-14 1993-07-13 The Sherwin-Williams Company Hydroxy addition polymer, anhydride addition polymer and cycloaliphatic polyepoxide
DE8710581U1 (de) 1987-08-01 1987-09-17 Römer GmbH, 7910 Neu-Ulm Schutzhelm u.a. für Arbeit oder Sport mit einer Gabelkinnberiemung
JPH0725774B2 (ja) * 1987-12-10 1995-03-22 日立化成工業株式会社 １―（２，３―ジカルボキシフエニル）―３―（３，４―ジカルボキシフエニル）―１，１，３，３―テトラメチルジシロキサン二無水物およびその製造方法
US5376403A (en) 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5128746A (en) 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
JPH0520918A (ja) * 1991-07-14 1993-01-29 Sony Chem Corp 導電ペースト
EP0870329A1 (de) 1995-08-11 1998-10-14 Kenneth J. Kirsten Lötpaste auf Epoxidharzbasis
US5851311A (en) 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
US5985043A (en) 1997-07-21 1999-11-16 Miguel Albert Capote Polymerizable fluxing agents and fluxing adhesive compositions therefrom
US6288170B1 (en) 1997-05-05 2001-09-11 3M Innovative Properties Company Removable adhesive of polyepoxide, curing agent and microspheres
US5985456A (en) 1997-07-21 1999-11-16 Miguel Albert Capote Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits
US6017634A (en) 1997-07-21 2000-01-25 Miguel Albert Capote Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive
US6103549A (en) 1998-03-17 2000-08-15 Advanced Micro Devices, Inc. No clean flux for flip chip assembly
AU3617999A (en) 1998-04-22 1999-11-08 Hugh Patrick Craig Adhesive and encapsulating material with fluxing properties

Also Published As

Publication number Publication date
JP2004502846A (ja) 2004-01-29
DE60105164D1 (de) 2004-09-30
US6528169B2 (en) 2003-03-04
DE60105164T2 (de) 2005-09-08
CN1449418A (zh) 2003-10-15
WO2002004541A2 (en) 2002-01-17
AU2001271627A1 (en) 2002-01-21
EP1299447B1 (de) 2004-08-25
EP1299447A2 (de) 2003-04-09
WO2002004541A3 (en) 2002-06-06
US20020032280A1 (en) 2002-03-14

Similar Documents

Publication Publication Date Title
ATE274539T1 (de) Nichtfliessende flussmittel- klebstoffzusammensetzungen
DE69903256D1 (de) Härtbare epoxyharzzusammensetzungen
DE60235523D1 (de) Klebstoffmasse
WO2003065447A3 (en) No-flow underfill encapsulant
SG82591A1 (en) Bumpless flip chip assembly with solder via
MY121433A (en) Package encapsulant compositions for use in electronic devices
DE59912991D1 (de) Schlagfeste epoxidharz-zusammensetzungen
ATE546830T1 (de) Mikro-elektronischer aufbau
SG111042A1 (en) Thermosetting resin composition and semiconductor device using the same
WO2005030894A3 (en) Adhesive compositions
DE69701583D1 (de) Härtbare Epoxidharzzusammensetzungen und elektronische Bauteile
TW200714682A (en) Adhesive composition
DE60314596D1 (de) Nichtfliessende unterfüllungszusammensetzung
ATE354451T1 (de) Lötmittel, lötpaste und lötverfahren
ATE483445T1 (de) Dentalzusammensetzung mit einer epoxy- funktionalen carbosilan-verbindung
SG170630A1 (en) Epoxy resin composition and semiconductor device
NZ513137A (en) Two part anchoring adhesive putty with the two parts being in a side by side relationship
TW200708584A (en) Die attach adhesives with improved stress performance
MX9200982A (es) Composiciones aglutinantes de resina de fenol-aldehido de resol alcalinas.
NO20004737L (no) Herdemiddel for anvendelse i urea-formaldehyd og urea-melamin- formaldehydbaserte adhesiver, og et adhesivpreparat omfattende nevnte herdemiddel og dets anvendelse
ID25968A (id) Komposisi resin epoksi untuk pengikatan keping-keping (chip-chip) semikonduktor
EP0986098A4 (de) Lotmaterial zum verbinden von chips
DE60139348D1 (de) Photohärtbare zusammensetzung sowie photoreaktive klebstoff-zusammensetzungen
DE60320571D1 (de) Heisshärtbarer klebstoff
EP1130041A4 (de) Epoxidharzzusammensetzung und halbleitervorrichtung

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties