ATE275214T1 - Bad und verfahren zur stromlosen plattierung von silber auf metallischen oberflächen - Google Patents

Bad und verfahren zur stromlosen plattierung von silber auf metallischen oberflächen

Info

Publication number
ATE275214T1
ATE275214T1 AT01980428T AT01980428T ATE275214T1 AT E275214 T1 ATE275214 T1 AT E275214T1 AT 01980428 T AT01980428 T AT 01980428T AT 01980428 T AT01980428 T AT 01980428T AT E275214 T1 ATE275214 T1 AT E275214T1
Authority
AT
Austria
Prior art keywords
silver
bath
electroless plating
copper
metallic surfaces
Prior art date
Application number
AT01980428T
Other languages
English (en)
Inventor
Carl Hutchinson
Hartmut Mahlkow
Christian Sparing
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE275214T1 publication Critical patent/ATE275214T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
AT01980428T 2000-10-06 2001-09-21 Bad und verfahren zur stromlosen plattierung von silber auf metallischen oberflächen ATE275214T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10050862A DE10050862C2 (de) 2000-10-06 2000-10-06 Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen
PCT/EP2001/011020 WO2002029132A1 (en) 2000-10-06 2001-09-21 Bath and method of electroless plating of silver on metal surfaces

Publications (1)

Publication Number Publication Date
ATE275214T1 true ATE275214T1 (de) 2004-09-15

Family

ID=7659722

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01980428T ATE275214T1 (de) 2000-10-06 2001-09-21 Bad und verfahren zur stromlosen plattierung von silber auf metallischen oberflächen

Country Status (16)

Country Link
US (1) US6869637B2 (de)
EP (1) EP1322798B1 (de)
JP (1) JP2004510885A (de)
KR (1) KR100809891B1 (de)
CN (1) CN1276994C (de)
AT (1) ATE275214T1 (de)
AU (1) AU2002212274A1 (de)
BR (1) BR0114155A (de)
CA (1) CA2417071A1 (de)
DE (2) DE10050862C2 (de)
ES (1) ES2227295T3 (de)
HK (1) HK1053152B (de)
MX (1) MXPA03000899A (de)
MY (1) MY137750A (de)
TW (1) TWI242607B (de)
WO (1) WO2002029132A1 (de)

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DE10226328B3 (de) * 2002-06-11 2004-02-19 Atotech Deutschland Gmbh Saure Lösung zur Silberabscheidung und Verfahren zum Abscheiden von Silberschichten auf Metalloberflächen
EP1245697A3 (de) 2002-07-17 2003-02-19 ATOTECH Deutschland GmbH Verfahren zum aussenstromlosen Abscheiden von Silber
FI20030816L (fi) * 2003-05-30 2004-12-01 Metso Corp Menetelmä metallijohtimien valmistamiseksi substraatille
AT500807B1 (de) * 2004-01-23 2006-11-15 Austria Tech & System Tech Verfahren zum herstellen eines leiterplattenelements sowie leiterplattenelement
US8349393B2 (en) * 2004-07-29 2013-01-08 Enthone Inc. Silver plating in electronics manufacture
JP4660701B2 (ja) * 2004-12-03 2011-03-30 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法並びに導電ペースト
KR100782810B1 (ko) * 2005-01-07 2007-12-06 삼성전자주식회사 확장 검색 기능을 제공하기 위한 메타데이터가 기록된 저장매체를 재생하는 방법 및 장치
DE102005038392B4 (de) * 2005-08-09 2008-07-10 Atotech Deutschland Gmbh Verfahren zum Herstellen von Muster bildenden Kupferstrukturen auf einem Trägersubstrat
US7767009B2 (en) * 2005-09-14 2010-08-03 OMG Electronic Chemicals, Inc. Solution and process for improving the solderability of a metal surface
JP5036216B2 (ja) * 2006-05-19 2012-09-26 四国化成工業株式会社 金属の表面処理剤およびその利用
KR100794804B1 (ko) * 2006-08-01 2008-01-14 주식회사 에이스테크놀로지 은도금 처리방법
US7883738B2 (en) * 2007-04-18 2011-02-08 Enthone Inc. Metallic surface enhancement
US10017863B2 (en) * 2007-06-21 2018-07-10 Joseph A. Abys Corrosion protection of bronzes
DE102007040065A1 (de) * 2007-08-24 2009-02-26 Ormecon Gmbh Artikel mit einer nanoskopischen Beschichtung aus Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung
TWI453301B (zh) * 2007-11-08 2014-09-21 Enthone 浸鍍銀塗層上的自組分子
US7972655B2 (en) * 2007-11-21 2011-07-05 Enthone Inc. Anti-tarnish coatings
US8869165B2 (en) * 2008-03-20 2014-10-21 International Business Machines Corporation Integrating flow orchestration and scheduling of jobs and data activities for a batch of workflows over multiple domains subject to constraints
AT11005U1 (de) * 2008-09-24 2010-02-15 Austria Tech & System Tech Verfahren zum verbessern der korrosionsbeständigkeit einer elektronischen komponente, insbesondere von leiterbahnen einer leiterplatte
KR101852641B1 (ko) 2010-02-25 2018-04-26 메르크 파텐트 게엠베하 유기 전자 디바이스에 대한 전극 처리 공정
JP2013534726A (ja) * 2010-06-24 2013-09-05 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 有機電子装置における電極を改質する方法
US9663667B2 (en) 2013-01-22 2017-05-30 Andre Reiss Electroless silvering ink
KR101536446B1 (ko) * 2013-12-06 2015-07-13 주식회사 포스코 Ｏｌｅｄ 조명용 기판 및 그 제조방법
KR101478486B1 (ko) 2014-05-12 2014-12-31 성균관대학교산학협력단 자발적 치환 반응을 이용한 은 코팅 구리 분말 제조 방법
CN104619133B (zh) * 2015-01-20 2017-12-29 江门崇达电路技术有限公司 一种全面化银线路板的制作方法
JP6666723B2 (ja) * 2015-03-31 2020-03-18 Ｄｏｗａエレクトロニクス株式会社 銀被覆テルル粉及びその製造方法、並びに導電性ペースト
US20160351522A1 (en) * 2015-05-27 2016-12-01 Freescale Semiconductor, Inc. Package-on-package device and cavity formation by solder removal for package interconnection
DE102016110377A1 (de) 2016-06-06 2017-12-07 Harting Ag & Co. Kg Verfahren zur Herstellung von elektrischen Kontakten mit einer Silber-Wolfram-Legierung und ein Elektrolyt zum stromlosen/elektrolytischen Abscheiden von einer Silber-Wolfram-Legierung
US20190029122A1 (en) * 2017-07-19 2019-01-24 Anaren, Inc. Encapsulation of circuit trace
CN109423635A (zh) * 2017-08-22 2019-03-05 深圳市虹喜科技发展有限公司 一种印制线路板表面处理用化学镀银溶液
CN110927231B (zh) * 2019-12-31 2022-08-19 嘉兴学院 一种离子色谱安培检测用银电极的处理方法
CN114959666A (zh) * 2022-05-12 2022-08-30 李正新 化学镀银液以及化学镀银新方法

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US2602757A (en) * 1948-04-09 1952-07-08 Morris S Kantrowitz Method and composition for producing silver coatings
GB1022061A (en) * 1962-01-19 1966-03-09 Mitsubishi Electric Corp Solutions for immersion plating gold and silver
US3294578A (en) * 1963-10-22 1966-12-27 Gen Aniline & Film Corp Deposition of a metallic coat on metal surfaces
SU501116A1 (ru) 1973-05-18 1976-01-30 Предприятие П/Я А-7284 Раствор дл иммерсионного серебрени меди
DE3148330A1 (de) 1981-12-07 1983-06-09 Max Planck Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen Verfahren zur stromlosen abscheidung von edelmetallschichten auf oberflaechen von unedlen metallen
GB8703664D0 (en) 1987-02-17 1987-03-25 Green A Electroless silver plating composition
DE3868128D1 (de) * 1987-04-22 1992-03-12 Sumitomo Electric Industries Verfahren zur herstellung eines supraleitenden gegenstandes.
JPH05287542A (ja) 1992-04-08 1993-11-02 Mitsubishi Paper Mills Ltd 無電解銀メッキ方法
JPH06240463A (ja) * 1993-02-22 1994-08-30 Mitsubishi Paper Mills Ltd 金属微粉末の無電解銀鍍金方法
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
GB9425031D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
US5733599A (en) 1996-03-22 1998-03-31 Macdermid, Incorporated Method for enhancing the solderability of a surface
JP3419995B2 (ja) 1996-05-10 2003-06-23 株式会社大和化成研究所 無電解錫−銀合金めっき浴
JP3915850B2 (ja) * 1996-09-06 2007-05-16 ソニー株式会社 光学装置及び電解液
JP3532046B2 (ja) * 1996-10-25 2004-05-31 株式会社大和化成研究所 非シアン置換銀めっき浴
US5871896A (en) * 1997-05-30 1999-02-16 Eastman Kodak Company Preparation and use of a dimethylamine silver bromide complex as a single source precursor for nucleation of silver bromide crystals

Also Published As

Publication number Publication date
ES2227295T3 (es) 2005-04-01
HK1053152A1 (en) 2003-10-10
DE60105305T2 (de) 2005-09-29
KR100809891B1 (ko) 2008-03-06
MXPA03000899A (es) 2003-06-24
US20030157264A1 (en) 2003-08-21
DE10050862C2 (de) 2002-08-01
JP2004510885A (ja) 2004-04-08
US6869637B2 (en) 2005-03-22
CN1276994C (zh) 2006-09-27
KR20030057530A (ko) 2003-07-04
HK1053152B (en) 2005-01-28
AU2002212274A1 (en) 2002-04-15
MY137750A (en) 2009-03-31
DE60105305D1 (de) 2004-10-07
CA2417071A1 (en) 2002-04-11
DE10050862A1 (de) 2002-04-25
WO2002029132A1 (en) 2002-04-11
EP1322798A1 (de) 2003-07-02
BR0114155A (pt) 2003-07-29
TWI242607B (en) 2005-11-01
CN1468324A (zh) 2004-01-14
EP1322798B1 (de) 2004-09-01

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