|
US6754551B1
(en)
*
|
2000-06-29 |
2004-06-22 |
Printar Ltd. |
Jet print apparatus and method for printed circuit board manufacturing
|
|
US8178188B2
(en)
*
|
2001-04-20 |
2012-05-15 |
Panasonic Corporation |
Base layer for manufacturing an electronic component by an etching process
|
|
JP4477359B2
(ja)
|
2002-03-04 |
2010-06-09 |
プリンター リミティド |
プリント回路板に対しソルダーマスクを塗布する方法
|
|
AU2003240751A1
(en)
|
2002-03-28 |
2003-10-13 |
Huntsman Advanced Materials (Switzerland) Gmbh |
Polymerisable composition
|
|
WO2004050260A2
(en)
*
|
2002-11-27 |
2004-06-17 |
Litrex Corporation |
Microdeposition system
|
|
JP4198514B2
(ja)
*
|
2003-04-23 |
2008-12-17 |
新光電気工業株式会社 |
無電解めっき方法
|
|
US20050042852A1
(en)
*
|
2003-08-19 |
2005-02-24 |
Unitech Printed Circuit Board Corp. |
Method for applying solder mask onto pad spacings of a printed circuit board
|
|
KR100577406B1
(ko)
*
|
2003-09-17 |
2006-05-10 |
박재상 |
Pcb 방식을 이용한 히터 제조방법 및 히터
|
|
JP4875834B2
(ja)
*
|
2003-12-24 |
2012-02-15 |
ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. |
マスク
|
|
US20050175941A1
(en)
*
|
2004-02-06 |
2005-08-11 |
Rohm And Hass Electronic Materials, L.L.C. |
Imaging composition and method
|
|
KR101125678B1
(ko)
*
|
2004-02-06 |
2012-03-28 |
롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. |
개선된 이미지화 조성물 및 방법
|
|
US7270932B2
(en)
*
|
2004-02-06 |
2007-09-18 |
Rohm And Haas Electronic Materials Llc |
Imaging composition and method
|
|
US7977026B2
(en)
*
|
2004-02-06 |
2011-07-12 |
Rohm And Haas Electronic Materials Llc |
Imaging methods
|
|
US7144676B2
(en)
*
|
2004-02-06 |
2006-12-05 |
Rohm And Haas Electronic Materials Llc |
Imaging compositions and methods
|
|
US7185799B2
(en)
*
|
2004-03-29 |
2007-03-06 |
Intel Corporation |
Method of creating solder bar connections on electronic packages
|
|
US20050270755A1
(en)
*
|
2004-06-04 |
2005-12-08 |
Inventec Corporation |
Method for preventing pins of semiconductor package from short circuit during soldering
|
|
US7815949B2
(en)
*
|
2004-12-17 |
2010-10-19 |
Bionovo, Inc. |
Estrogenic extracts of Morus alba and uses thereof
|
|
US20060176350A1
(en)
*
|
2005-01-14 |
2006-08-10 |
Howarth James J |
Replacement of passive electrical components
|
|
US20060275590A1
(en)
*
|
2005-06-03 |
2006-12-07 |
Lorenz Daniel W |
Method of printing a durable UV cured ink design on a substrate
|
|
US7611216B2
(en)
*
|
2005-07-22 |
2009-11-03 |
Pitney Bowes Inc. |
Method and system for correcting print image distortion due to irregular print image space topography
|
|
US20070068898A1
(en)
*
|
2005-09-29 |
2007-03-29 |
Lorenz Glen D |
Multi-level etching method and product
|
|
US20070117042A1
(en)
*
|
2005-11-23 |
2007-05-24 |
Rohm And Haas Electronic Materials Llc |
Imaging methods
|
|
US20070119911A1
(en)
*
|
2005-11-28 |
2007-05-31 |
Chan Su L |
Method of forming a composite standoff on a circuit board
|
|
TWI287828B
(en)
*
|
2005-12-30 |
2007-10-01 |
Ind Tech Res Inst |
Method for printing a pattern and data processing method thereof
|
|
US7402341B2
(en)
*
|
2006-05-23 |
2008-07-22 |
Printar Ltd. |
Methods and compositions for printable surface pre-treatment
|
|
WO2008102266A2
(en)
*
|
2007-02-23 |
2008-08-28 |
Infermata Systems Ltd. |
Method and apparatus for rapid fabrication of functional printed circuit board
|
|
US20090002422A1
(en)
*
|
2007-06-29 |
2009-01-01 |
Stephenson Iii Stanley W |
Structure for monolithic thermal inkjet array
|
|
US8534787B2
(en)
*
|
2007-10-11 |
2013-09-17 |
Camtek Ltd. |
Method and system for printing on a printed circuit board
|
|
US20090095176A1
(en)
*
|
2007-10-11 |
2009-04-16 |
Printar Ltd. |
Method and apparatus for PCB finishing processes
|
|
US20090199141A1
(en)
*
|
2008-02-06 |
2009-08-06 |
Anritsu Company |
Systems and methods for prototyping and testing electrical circuits in near real-time
|
|
EP2105247B1
(de)
|
2008-03-25 |
2017-11-29 |
Mycronic AB |
Positionierungssystem
|
|
US8062693B2
(en)
*
|
2008-09-22 |
2011-11-22 |
Sunpower Corporation |
Generation of contact masks for inkjet printing on solar cell substrates
|
|
KR101057462B1
(ko)
|
2008-10-23 |
2011-08-17 |
에센하이텍(주) |
자동 인쇄회로기판 생산시스템
|
|
US20100156998A1
(en)
*
|
2008-12-19 |
2010-06-24 |
Nobuo Matsumoto |
Method and apparatus for printing
|
|
US8229719B2
(en)
*
|
2009-03-26 |
2012-07-24 |
Seiko Epson Corporation |
Finite element algorithm for solving a fourth order nonlinear lubrication equation for droplet evaporation
|
|
US8014986B2
(en)
*
|
2009-06-02 |
2011-09-06 |
Seiko Epson Corporation |
Finite difference algorithm for solving lubrication equations with solute diffusion
|
|
CN102576405B
(zh)
*
|
2009-07-06 |
2014-09-17 |
卡姆特有限公司 |
阻焊层检查的系统和方法
|
|
US9661755B2
(en)
*
|
2009-07-06 |
2017-05-23 |
Camtek Ltd. |
System and a method for solder mask inspection
|
|
US8198547B2
(en)
|
2009-07-23 |
2012-06-12 |
Lexmark International, Inc. |
Z-directed pass-through components for printed circuit boards
|
|
US8735734B2
(en)
*
|
2009-07-23 |
2014-05-27 |
Lexmark International, Inc. |
Z-directed delay line components for printed circuit boards
|
|
JP5018840B2
(ja)
*
|
2009-07-27 |
2012-09-05 |
富士通株式会社 |
クーポン基板
|
|
JP5535561B2
(ja)
*
|
2009-09-15 |
2014-07-02 |
日本発條株式会社 |
接着剤塗布装置
|
|
US20110080476A1
(en)
*
|
2009-10-02 |
2011-04-07 |
Lasx Industries, Inc. |
High Performance Vision System for Part Registration
|
|
US8285530B2
(en)
*
|
2009-10-15 |
2012-10-09 |
Seiko Epson Corporation |
Upwind algorithm for solving lubrication equations
|
|
JP5718342B2
(ja)
|
2009-10-16 |
2015-05-13 |
エンパイア テクノロジー ディベロップメント エルエルシー |
半導体ウェーハにフィルムを付加する装置および方法ならびに半導体ウェーハを処理する方法
|
|
US8255194B2
(en)
*
|
2009-12-02 |
2012-08-28 |
Seiko Epson Corporation |
Judiciously retreated finite element method for solving lubrication equation
|
|
US8285526B2
(en)
*
|
2009-12-02 |
2012-10-09 |
Seiko Epson Corporation |
Finite difference algorithm for solving slender droplet evaporation with moving contact lines
|
|
FR2953617B1
(fr)
*
|
2009-12-03 |
2012-01-20 |
Herve Mongin |
Machine de personnalisation electrique et graphique d'objets electroniques portatifs
|
|
US20110196657A1
(en)
*
|
2010-02-11 |
2011-08-11 |
Jie Zhang |
Solving a Solute Lubrication Equation for 3D Droplet Evaporation on a Complicated OLED Bank Structure
|
|
US8271238B2
(en)
*
|
2010-03-23 |
2012-09-18 |
Seiko Epson Corporation |
Finite difference scheme for solving droplet evaporation lubrication equations on a time-dependent varying domain
|
|
US8678534B2
(en)
*
|
2010-12-22 |
2014-03-25 |
Camtek Ltd. |
Multiple iteration substrate printing
|
|
US20120171356A1
(en)
*
|
2010-12-27 |
2012-07-05 |
Camtek Ltd. |
System for digital deposition of pad / interconnects coatings
|
|
US8677929B2
(en)
*
|
2010-12-29 |
2014-03-25 |
Intevac, Inc. |
Method and apparatus for masking solar cell substrates for deposition
|
|
US20120194622A1
(en)
*
|
2011-01-31 |
2012-08-02 |
Camtek Ltd. |
Ultra violet light emitting diode curing of uv reactive ink
|
|
US20120196039A1
(en)
*
|
2011-01-31 |
2012-08-02 |
Camtek Ltd. |
Method for enhancing metallization in selective deposition processes
|
|
CN102991164B
(zh)
*
|
2011-07-28 |
2016-12-21 |
卡姆特有限公司 |
用于焊接掩模检验的系统和方法
|
|
EP2556962A1
(de)
*
|
2011-08-12 |
2013-02-13 |
hülsta-werke Hüls GmbH & Co. KG |
Verfahren zum Digitaldruck eines Druckbildes auf ein flächiges Bauteil
|
|
US8658245B2
(en)
|
2011-08-31 |
2014-02-25 |
Lexmark International, Inc. |
Spin coat process for manufacturing a Z-directed component for a printed circuit board
|
|
US8943684B2
(en)
*
|
2011-08-31 |
2015-02-03 |
Lexmark International, Inc. |
Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board
|
|
US9009954B2
(en)
|
2011-08-31 |
2015-04-21 |
Lexmark International, Inc. |
Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material
|
|
US8790520B2
(en)
*
|
2011-08-31 |
2014-07-29 |
Lexmark International, Inc. |
Die press process for manufacturing a Z-directed component for a printed circuit board
|
|
US9078374B2
(en)
|
2011-08-31 |
2015-07-07 |
Lexmark International, Inc. |
Screening process for manufacturing a Z-directed component for a printed circuit board
|
|
US8752280B2
(en)
|
2011-09-30 |
2014-06-17 |
Lexmark International, Inc. |
Extrusion process for manufacturing a Z-directed component for a printed circuit board
|
|
US20140010952A1
(en)
*
|
2012-01-02 |
2014-01-09 |
Noam ROSENSTEIN |
Pcb repair of defective interconnects by deposition of conductive ink
|
|
US9060437B2
(en)
*
|
2012-02-01 |
2015-06-16 |
Illinois Tool Works Inc. |
System and method for operating a stencil printer
|
|
US8912452B2
(en)
|
2012-03-29 |
2014-12-16 |
Lexmark International, Inc. |
Z-directed printed circuit board components having different dielectric regions
|
|
US8830692B2
(en)
|
2012-03-29 |
2014-09-09 |
Lexmark International, Inc. |
Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component
|
|
US8822838B2
(en)
|
2012-03-29 |
2014-09-02 |
Lexmark International, Inc. |
Z-directed printed circuit board components having conductive channels for reducing radiated emissions
|
|
US8822840B2
(en)
|
2012-03-29 |
2014-09-02 |
Lexmark International, Inc. |
Z-directed printed circuit board components having conductive channels for controlling transmission line impedance
|
|
CN102682166B
(zh)
*
|
2012-05-09 |
2014-01-15 |
上海望友信息科技有限公司 |
Smt设备快速制程系统及方法
|
|
WO2013174651A1
(en)
|
2012-05-23 |
2013-11-28 |
Oce-Technologies B.V. |
Printing method for printing a functional pattern and a printing apparatus
|
|
KR20190123811A
(ko)
|
2012-12-27 |
2019-11-01 |
카티바, 인크. |
정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법
|
|
US9832428B2
(en)
|
2012-12-27 |
2017-11-28 |
Kateeva, Inc. |
Fast measurement of droplet parameters in industrial printing system
|
|
US9700908B2
(en)
|
2012-12-27 |
2017-07-11 |
Kateeva, Inc. |
Techniques for arrayed printing of a permanent layer with improved speed and accuracy
|
|
US11673155B2
(en)
|
2012-12-27 |
2023-06-13 |
Kateeva, Inc. |
Techniques for arrayed printing of a permanent layer with improved speed and accuracy
|
|
US12330178B2
(en)
|
2012-12-27 |
2025-06-17 |
Kateeva, Inc. |
Techniques for arrayed printing of a permanent layer with improved speed and accuracy
|
|
US11141752B2
(en)
|
2012-12-27 |
2021-10-12 |
Kateeva, Inc. |
Techniques for arrayed printing of a permanent layer with improved speed and accuracy
|
|
US9352561B2
(en)
|
2012-12-27 |
2016-05-31 |
Kateeva, Inc. |
Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances
|
|
EP2860036B1
(de)
*
|
2013-10-09 |
2019-12-04 |
HINTERKOPF GmbH |
Druckeinrichtung, Druckmaschine und Verfahren zum Betreiben einer Druckeinrichtung
|
|
KR102034420B1
(ko)
|
2013-12-12 |
2019-11-08 |
카티바, 인크. |
두께를 제어하기 위해 하프토닝을 이용하는 잉크-기반 층 제조
|
|
GB2538522B
(en)
|
2015-05-19 |
2019-03-06 |
Dst Innovations Ltd |
Electronic circuit and component construction
|
|
CN106696475B
(zh)
*
|
2015-11-13 |
2019-06-18 |
富泰华工业(深圳)有限公司 |
打印机及利用打印机打印电路板的方法
|
|
WO2018140517A1
(en)
*
|
2017-01-26 |
2018-08-02 |
Nano-Dimension Technologies, Ltd. |
Chip embedded printed circuit boards and methods of fabrication
|
|
JP6887511B2
(ja)
*
|
2017-04-14 |
2021-06-16 |
ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. |
流体ダイ
|
|
WO2019172912A1
(en)
*
|
2018-03-08 |
2019-09-12 |
Hewlett-Packard Development Company, L.P. |
Printing utilizing quality data for printed target areas
|
|
CN108633184A
(zh)
*
|
2018-07-16 |
2018-10-09 |
湖北荣宝电子科技有限公司 |
一种用于印刷电路板塞孔的垫板装置
|
|
CN109109471A
(zh)
*
|
2018-09-21 |
2019-01-01 |
深圳市微印科技有限公司 |
一种双工位喷印设备
|
|
CN109068563B
(zh)
*
|
2018-09-21 |
2024-03-26 |
北京梦之墨科技有限公司 |
一种液态金属打印机
|
|
US10939600B2
(en)
|
2018-11-28 |
2021-03-02 |
International Business Machines Corporation |
Flux residue detection
|
|
WO2020165897A1
(en)
|
2019-02-14 |
2020-08-20 |
Orbotech Ltd |
A method and apparatus for preparing a pcb product having highly dense conductors
|
|
US11682600B2
(en)
|
2019-08-07 |
2023-06-20 |
At&S Austria Technologie & Systemtechnik Aktiengesellschaft |
Protection layer for panel handling systems
|
|
US11452199B2
(en)
|
2019-09-12 |
2022-09-20 |
At&S Austria Technologie & Systemtechnik Aktiengesellschaft |
Electronic module with single or multiple components partially surrounded by a thermal decoupling gap
|
|
JP7470184B2
(ja)
*
|
2020-04-24 |
2024-04-17 |
株式会社Fuji |
回路形成方法、および回路形成装置
|
|
TWI819237B
(zh)
*
|
2020-09-08 |
2023-10-21 |
健鼎科技股份有限公司 |
印刷電路板製程方法
|
|
US11571896B2
(en)
|
2021-02-01 |
2023-02-07 |
Funai Electric Co., Ltd. |
Customization of multichannel printhead
|
|
DE102021116019A1
(de)
*
|
2021-06-21 |
2022-12-22 |
Notion Systems GmbH |
Verfahren zum Bedrucken eines Substrats
|
|
CN115257192B
(zh)
*
|
2021-06-25 |
2023-11-17 |
深圳达捷科技有限公司 |
一种柔性电路板用喷印平台
|
|
CN116321788B
(zh)
*
|
2021-10-13 |
2024-02-06 |
苏州康尼格电子科技股份有限公司 |
Pcba板封装设备、pcba板的封装方法
|
|
US12259715B2
(en)
|
2021-10-27 |
2025-03-25 |
Illinois Tool Works Inc. |
Open application interface for industrial equipment
|
|
CN114959602B
(zh)
*
|
2022-06-13 |
2023-08-15 |
江西福昌发电路科技有限公司 |
一种基于金面镀铜表面混合的阶梯线路板表面镀膜装置及工艺
|
|
CN119317029B
(zh)
*
|
2024-10-15 |
2025-08-01 |
深圳宏创为数字技术有限公司 |
一种印制电路板导通孔的阻焊塞孔油墨制备工艺
|
|
CN120542359B
(zh)
*
|
2025-04-21 |
2026-04-03 |
长沙金维集成电路股份有限公司 |
导航系统模块平整度提升方法、装置、设备及介质
|