ATE277415T1 - Keramikbauteil und herstellungsverfahren - Google Patents

Keramikbauteil und herstellungsverfahren

Info

Publication number
ATE277415T1
ATE277415T1 AT02000798T AT02000798T ATE277415T1 AT E277415 T1 ATE277415 T1 AT E277415T1 AT 02000798 T AT02000798 T AT 02000798T AT 02000798 T AT02000798 T AT 02000798T AT E277415 T1 ATE277415 T1 AT E277415T1
Authority
AT
Austria
Prior art keywords
production process
ceramic component
ceramic
retention
protected
Prior art date
Application number
AT02000798T
Other languages
English (en)
Inventor
Takeshi Kimura
Emiko Igaki
Hiroshi Ito
Osamu Yamashita
Masakazu Tanahashi
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of ATE277415T1 publication Critical patent/ATE277415T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Thermistors And Varistors (AREA)
  • Formation Of Insulating Films (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
AT02000798T 2000-07-14 2002-01-14 Keramikbauteil und herstellungsverfahren ATE277415T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000214058A JP2002033237A (ja) 2000-07-14 2000-07-14 セラミック電子部品およびその製造方法
US10/042,138 US6808813B2 (en) 2000-07-14 2002-01-11 Ceramic electronic device and method of manufacturing the device
EP02000798A EP1335392B1 (de) 2000-07-14 2002-01-14 Keramikbauteil und Herstellungsverfahren

Publications (1)

Publication Number Publication Date
ATE277415T1 true ATE277415T1 (de) 2004-10-15

Family

ID=28794668

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02000798T ATE277415T1 (de) 2000-07-14 2002-01-14 Keramikbauteil und herstellungsverfahren

Country Status (5)

Country Link
US (1) US6808813B2 (de)
EP (1) EP1335392B1 (de)
JP (1) JP2002033237A (de)
AT (1) ATE277415T1 (de)
DE (1) DE60201329T2 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1238873C (zh) * 2001-03-26 2006-01-25 株式会社村田制作所 陶瓷电子元件及其制造方法
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US8004423B2 (en) * 2004-06-21 2011-08-23 Siemens Energy, Inc. Instrumented component for use in an operating environment
FR2886449B1 (fr) * 2005-05-25 2010-08-27 Tpc Condensateur film multicouche presentant une bonne soudabilite et procede de fabrication d'un tel condensateur
JP2007234800A (ja) * 2006-02-28 2007-09-13 Tdk Corp 電子部品及びその製造方法
KR100975757B1 (ko) * 2006-03-15 2010-08-12 가부시키가이샤 무라타 세이사쿠쇼 적층형 전자부품 및 그 제조방법
US7368827B2 (en) * 2006-09-06 2008-05-06 Siemens Power Generation, Inc. Electrical assembly for monitoring conditions in a combustion turbine operating environment
US7969323B2 (en) * 2006-09-14 2011-06-28 Siemens Energy, Inc. Instrumented component for combustion turbine engine
US9071888B2 (en) * 2007-11-08 2015-06-30 Siemens Aktiengesellschaft Instrumented component for wireless telemetry
US8519866B2 (en) 2007-11-08 2013-08-27 Siemens Energy, Inc. Wireless telemetry for instrumented component
US8797179B2 (en) * 2007-11-08 2014-08-05 Siemens Aktiengesellschaft Instrumented component for wireless telemetry
JP2009145745A (ja) * 2007-12-17 2009-07-02 Hitachi Displays Ltd 液晶表示装置およびその製造方法
JP5439954B2 (ja) * 2009-06-01 2014-03-12 株式会社村田製作所 積層型電子部品およびその製造方法
KR101971912B1 (ko) * 2012-03-05 2019-04-25 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
US9325388B2 (en) 2012-06-21 2016-04-26 Siemens Energy, Inc. Wireless telemetry system including an induction power system
CN104969307B (zh) * 2013-01-29 2018-09-28 株式会社村田制作所 陶瓷电子部件及其制造方法
CN103208974A (zh) * 2013-03-13 2013-07-17 南京航空航天大学 用于大功率平面emi滤波器的差共模电容集成模块
US9420356B2 (en) 2013-08-27 2016-08-16 Siemens Energy, Inc. Wireless power-receiving assembly for a telemetry system in a high-temperature environment of a combustion turbine engine
WO2016013649A1 (ja) 2014-07-25 2016-01-28 株式会社村田製作所 電子部品及びその製造方法
JP6252393B2 (ja) * 2014-07-28 2017-12-27 株式会社村田製作所 セラミック電子部品およびその製造方法
JP6060945B2 (ja) * 2014-07-28 2017-01-18 株式会社村田製作所 セラミック電子部品およびその製造方法
KR102097333B1 (ko) 2014-08-05 2020-04-06 삼성전기주식회사 적층 세라믹 커패시터
US10875095B2 (en) * 2015-03-19 2020-12-29 Murata Manufacturing Co., Ltd. Electronic component comprising magnetic metal powder
JP7481064B2 (ja) 2019-11-19 2024-05-10 太陽誘電株式会社 セラミック電子部品およびその製造方法
JP7115461B2 (ja) * 2019-12-12 2022-08-09 株式会社村田製作所 積層セラミックコンデンサ
KR102946083B1 (ko) * 2020-12-18 2026-04-01 삼성전기주식회사 적층형 전자 부품 및 그 제조방법
JP7702261B2 (ja) * 2021-02-17 2025-07-03 太陽誘電株式会社 セラミック電子部品、回路基板およびセラミック電子部品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53138448A (en) 1977-05-10 1978-12-02 Toshiba Corp Dielectric composition for capacitors
JPS6039095B2 (ja) * 1978-11-06 1985-09-04 信越化学工業株式会社 光硬化性オルガノポリシロキサン組成物
US4327369A (en) * 1979-08-06 1982-04-27 Hi-Tech Industries, Inc. Encapsulating moisture-proof coating
KR970004121B1 (ko) 1991-12-27 1997-03-25 마쯔시다덴기산교 가부시기가이샤 필름콘덴서와 그 제조방법
JP3057305B2 (ja) 1993-06-22 2000-06-26 信越化学工業株式会社 電子部品用含浸剤
JPH07307243A (ja) 1994-05-11 1995-11-21 Elna Co Ltd フィルムコンデンサの製造方法
DE19634498C2 (de) * 1996-08-26 1999-01-28 Siemens Matsushita Components Elektro-keramisches Bauelement und Verfahren zu seiner Herstellung
JP3304798B2 (ja) * 1997-01-28 2002-07-22 松下電器産業株式会社 電子部品およびその製造方法
US6043330A (en) * 1997-04-21 2000-03-28 Alliedsignal Inc. Synthesis of siloxane resins

Also Published As

Publication number Publication date
DE60201329D1 (de) 2004-10-28
JP2002033237A (ja) 2002-01-31
EP1335392A1 (de) 2003-08-13
US20030134133A1 (en) 2003-07-17
DE60201329T2 (de) 2005-02-10
EP1335392B1 (de) 2004-09-22
US6808813B2 (en) 2004-10-26

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties