ATE280204T1 - Nicht-korrodierende entfernungs-und reinigungs- zusammensetzung - Google Patents

Nicht-korrodierende entfernungs-und reinigungs- zusammensetzung

Info

Publication number
ATE280204T1
ATE280204T1 AT99940900T AT99940900T ATE280204T1 AT E280204 T1 ATE280204 T1 AT E280204T1 AT 99940900 T AT99940900 T AT 99940900T AT 99940900 T AT99940900 T AT 99940900T AT E280204 T1 ATE280204 T1 AT E280204T1
Authority
AT
Austria
Prior art keywords
cleaning composition
corrodive
removal
alkanolamine
solvent
Prior art date
Application number
AT99940900T
Other languages
English (en)
Inventor
Kenji Honda
Richard Mark Molin
Gale Lynne Hansen
Original Assignee
Arch Spec Chem Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arch Spec Chem Inc filed Critical Arch Spec Chem Inc
Application granted granted Critical
Publication of ATE280204T1 publication Critical patent/ATE280204T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5009—Organic solvents containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5013—Organic solvents containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/264—Aldehydes; Ketones; Acetals or ketals
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3263—Amides or imides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Detergent Compositions (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Weting (AREA)
  • Paints Or Removers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AT99940900T 1998-08-18 1999-08-05 Nicht-korrodierende entfernungs-und reinigungs- zusammensetzung ATE280204T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/135,809 US6268323B1 (en) 1997-05-05 1998-08-18 Non-corrosive stripping and cleaning composition
PCT/US1999/017749 WO2000011091A1 (en) 1998-08-18 1999-08-05 Non-corrosive stripping and cleaning composition

Publications (1)

Publication Number Publication Date
ATE280204T1 true ATE280204T1 (de) 2004-11-15

Family

ID=22469785

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99940900T ATE280204T1 (de) 1998-08-18 1999-08-05 Nicht-korrodierende entfernungs-und reinigungs- zusammensetzung

Country Status (8)

Country Link
US (2) US6268323B1 (de)
EP (1) EP1129145B1 (de)
JP (2) JP3796622B2 (de)
KR (1) KR20010072673A (de)
AT (1) ATE280204T1 (de)
DE (1) DE69921350T2 (de)
TW (1) TW552481B (de)
WO (1) WO2000011091A1 (de)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6825156B2 (en) * 2002-06-06 2004-11-30 Ekc Technology, Inc. Semiconductor process residue removal composition and process
US7144848B2 (en) * 1992-07-09 2006-12-05 Ekc Technology, Inc. Cleaning compositions containing hydroxylamine derivatives and processes using same for residue removal
US20040134873A1 (en) * 1996-07-25 2004-07-15 Li Yao Abrasive-free chemical mechanical polishing composition and polishing process containing same
US6268323B1 (en) * 1997-05-05 2001-07-31 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition
DE19744434A1 (de) * 1997-10-08 1999-04-15 Weigert Chem Fab Reinigungsmittel für chirurgische Instrumente
AU4189599A (en) 1998-05-18 1999-12-06 Mallinckrodt, Inc. Silicate-containing alkaline compositions for cleaning microelectronic substrates
US7579308B2 (en) * 1998-07-06 2009-08-25 Ekc/Dupont Electronics Technologies Compositions and processes for photoresist stripping and residue removal in wafer level packaging
CA2353609A1 (en) * 1998-12-04 2000-06-15 Marine Ultra Clean Limited Method for removing surface coatings
WO2001021750A1 (fr) * 1999-09-24 2001-03-29 Tokuyama Corporation Detergent
AU3838901A (en) * 2000-02-16 2001-08-27 Illumina Inc Parallel genotyping of multiple patient samples
JP2002075993A (ja) * 2000-06-15 2002-03-15 Mitsubishi Electric Corp 半導体装置の製造方法
US6455479B1 (en) * 2000-08-03 2002-09-24 Shipley Company, L.L.C. Stripping composition
US6498131B1 (en) * 2000-08-07 2002-12-24 Ekc Technology, Inc. Composition for cleaning chemical mechanical planarization apparatus
US6558879B1 (en) 2000-09-25 2003-05-06 Ashland Inc. Photoresist stripper/cleaner compositions containing aromatic acid inhibitors
US6599370B2 (en) * 2000-10-16 2003-07-29 Mallinckrodt Inc. Stabilized alkaline compositions for cleaning microelectronic substrates
JP2002180044A (ja) * 2000-12-07 2002-06-26 Toray Eng Co Ltd 熱可塑性ポリイミド樹脂用エッチング液
GB0031213D0 (en) * 2000-12-20 2001-01-31 Teklube Ltd Bactericidal emulsifying compound and process for producing such compound
WO2002095501A1 (en) * 2001-05-21 2002-11-28 Dongjin Semichem Co., Ltd. Resist remover composition
US6559104B2 (en) * 2001-07-13 2003-05-06 Exxonmobil Research And Engineering Co. Method for inhibiting corrosion using certain aromatic acidic species
JP3797541B2 (ja) * 2001-08-31 2006-07-19 東京応化工業株式会社 ホトレジスト用剥離液
KR100554964B1 (ko) * 2001-09-07 2006-03-03 길준잉 포토레지스트 스트립핑 조성물 및 이를 사용한 패턴 형성방법
JP2003177556A (ja) * 2001-12-12 2003-06-27 Sharp Corp フォトレジスト剥離剤組成物および剥離方法
US20030171239A1 (en) * 2002-01-28 2003-09-11 Patel Bakul P. Methods and compositions for chemically treating a substrate using foam technology
CN1441043A (zh) * 2002-02-06 2003-09-10 希普利公司 清洁用组合物
KR100997180B1 (ko) 2002-04-25 2010-11-29 아치 스페셜티 케미칼즈, 인코포레이티드 에치 잔여물질을 제거하기 위한 비-부식성 세척 조성물
US8003587B2 (en) * 2002-06-06 2011-08-23 Ekc Technology, Inc. Semiconductor process residue removal composition and process
US6677286B1 (en) * 2002-07-10 2004-01-13 Air Products And Chemicals, Inc. Compositions for removing etching residue and use thereof
ES2200700B2 (es) * 2002-07-19 2005-10-01 Prodema S.A Tablero tipo sandwich.
CN1646732A (zh) * 2002-08-19 2005-07-27 伊默克化学科技股份有限公司 清洗液
JP4282054B2 (ja) * 2002-09-09 2009-06-17 東京応化工業株式会社 デュアルダマシン構造形成プロセスに用いられる洗浄液および基板の処理方法
KR100503231B1 (ko) * 2002-10-22 2005-07-22 주식회사 엘지화학 반도체 및 ｔｆｔ-ｌｃｄ용 세정제 조성물
FR2850114B1 (fr) * 2003-01-17 2005-02-18 Atofina Nouvelles compositions contenant des hydrocarbures fluores et des solvants oxygenes
US6864193B2 (en) * 2003-03-05 2005-03-08 Taiwan Semiconductor Manufacturing Co., Ltd. Aqueous cleaning composition containing copper-specific corrosion inhibitor
US7337788B2 (en) * 2003-06-30 2008-03-04 Henkel Kommanditgesellschaft Auf Aktien Compositions useful for cleaning solvent-based paint from paint delivery installations
US20050032657A1 (en) * 2003-08-06 2005-02-10 Kane Sean Michael Stripping and cleaning compositions for microelectronics
US7384900B2 (en) * 2003-08-27 2008-06-10 Lg Display Co., Ltd. Composition and method for removing copper-compatible resist
EP1718271B1 (de) * 2003-10-30 2014-10-08 Basf Se Stabilisierte korperpflege-, haushaltsprodukte
US6946396B2 (en) * 2003-10-30 2005-09-20 Nissan Chemical Indusries, Ltd. Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer
US8338087B2 (en) * 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
FR2868429B1 (fr) * 2004-04-02 2006-06-23 Ind De Chimie Elaboree Francai Agent activateur pour composition decapante et utilisations
US7094742B2 (en) * 2004-04-23 2006-08-22 Jelmar, Llc Hard surface cleaning compositions containing a sultaine and a mixture of organic acids
CN1994033A (zh) * 2004-07-29 2007-07-04 三井金属矿业株式会社 印刷电路板、其制造方法及半导体装置
US8178482B2 (en) * 2004-08-03 2012-05-15 Avantor Performance Materials, Inc. Cleaning compositions for microelectronic substrates
JP2006077134A (ja) * 2004-09-10 2006-03-23 Kawaken Fine Chem Co Ltd 塗料剥離剤
US20060094612A1 (en) * 2004-11-04 2006-05-04 Mayumi Kimura Post etch cleaning composition for use with substrates having aluminum
CN101076760B (zh) * 2004-12-10 2010-12-22 马林克罗特贝克公司 含有聚合物腐蚀抑制剂的非水的、无腐蚀性的微电子清洁组合物
KR101088568B1 (ko) * 2005-04-19 2011-12-05 아반토르 퍼포먼스 머티리얼스, 인크. 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼
TWI282363B (en) * 2005-05-19 2007-06-11 Epoch Material Co Ltd Aqueous cleaning composition for semiconductor copper processing
EP1913448B1 (de) * 2005-08-13 2010-10-13 Techno Semichem Co., Ltd. Fotoresist-entfernungszusammensetzung für die halbleiterherstellung
US8211844B2 (en) * 2005-10-21 2012-07-03 Freescale Semiconductor, Inc. Method for cleaning a semiconductor structure and chemistry thereof
KR101152139B1 (ko) 2005-12-06 2012-06-15 삼성전자주식회사 표시 장치용 세정제 및 이를 사용하는 박막 트랜지스터표시판의 제조 방법
US20070232511A1 (en) * 2006-03-28 2007-10-04 Matthew Fisher Cleaning solutions including preservative compounds for post CMP cleaning processes
US20080070820A1 (en) * 2006-09-19 2008-03-20 Wescor, Inc. Stain removing cleaning solutions
TWI338026B (en) * 2007-01-05 2011-03-01 Basf Electronic Materials Taiwan Ltd Composition and method for stripping organic coatings
FR2912151B1 (fr) * 2007-02-05 2009-05-08 Arkema France Formulation de dimethylsulfoxyde en melange avec un additif permettant d'abaisser le point de cristallisation de ce dernier, et applications de ce melange
JP5464809B2 (ja) * 2008-02-29 2014-04-09 横浜油脂工業株式会社 塗膜用水系剥離剤および塗膜剥離方法
CN101251722B (zh) * 2008-03-19 2011-06-29 曹学增 一种正性光刻胶剥离液及其制备方法
CN101251723B (zh) * 2008-03-19 2010-10-27 曹学增 一种负性彩色光刻胶脱胶剂及其制备方法
JP4903242B2 (ja) * 2008-10-28 2012-03-28 アバントール パフォーマンス マテリアルズ， インコーポレイテッド 多金属デバイス処理のためのグルコン酸含有フォトレジスト洗浄組成物
US8361237B2 (en) * 2008-12-17 2013-01-29 Air Products And Chemicals, Inc. Wet clean compositions for CoWP and porous dielectrics
US8309502B2 (en) * 2009-03-27 2012-11-13 Eastman Chemical Company Compositions and methods for removing organic substances
KR101098373B1 (ko) 2009-07-23 2011-12-23 남방씨.엔.에이 주식회사 슬래그 제거제용 조성물
US8569220B2 (en) 2010-11-12 2013-10-29 Jelmar, Llc Hard surface cleaning composition
US8575084B2 (en) 2010-11-12 2013-11-05 Jelmar, Llc Hard surface cleaning composition for personal contact areas
CN103160161B (zh) * 2011-12-16 2015-06-17 天津立昌科技有限公司 一种漆膜剥离剂
CN103631101B (zh) * 2012-08-22 2018-01-09 得凯莫斯公司弗罗里达有限公司 包含含氟表面活性剂的光阻剥除剂
US9434910B2 (en) 2013-01-16 2016-09-06 Jelmar, Llc Mold and mildew stain removing solution
US9873854B2 (en) 2013-01-16 2018-01-23 Jelmar, Llc Stain removing solution
CN103571644A (zh) * 2013-10-31 2014-02-12 合肥中南光电有限公司 一种水基硅片清洗剂及其制备方法
CN103571640A (zh) * 2013-10-31 2014-02-12 合肥中南光电有限公司 一种水基led芯片清洗剂及其制备方法
CN103589521A (zh) * 2013-10-31 2014-02-19 合肥中南光电有限公司 一种去除硅片表面污斑的水基清洗剂及其制备方法
CN103571670A (zh) * 2013-10-31 2014-02-12 合肥中南光电有限公司 一种光伏电池硅片清洗剂及其制备方法
CN103589525A (zh) * 2013-10-31 2014-02-19 合肥中南光电有限公司 一种去除黑蜡、松香和石蜡混合物的半导体硅片清洗剂及其制备方法
JP2015207712A (ja) * 2014-04-22 2015-11-19 三菱電機株式会社 洗浄液、洗浄設備、および実装基板の洗浄方法
US9957469B2 (en) 2014-07-14 2018-05-01 Versum Materials Us, Llc Copper corrosion inhibition system
US10168805B2 (en) 2014-08-18 2019-01-01 3M Innovative Properties Company Conductive layered structure and methods of making same
US20220251480A1 (en) * 2019-07-15 2022-08-11 Versum Materials Us, Llc Compositions for removing etch residues, methods of using and use thereof
JPWO2021049330A1 (de) * 2019-09-11 2021-03-18
WO2021067147A1 (en) 2019-09-30 2021-04-08 Versum Materials Us, Llc Photoresist remover
KR102334425B1 (ko) * 2019-11-21 2021-12-01 엘티씨 (주) 디스플레이 제조용 포토레지스트 박리액 조성물
WO2025086185A1 (en) * 2023-10-26 2025-05-01 Dow Global Technologies Llc Solvent mixture

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115368A (en) 1980-02-15 1981-09-10 San Ei Chem Ind Ltd Releasing agent of photosensitive polymer
US4395348A (en) 1981-11-23 1983-07-26 Ekc Technology, Inc. Photoresist stripping composition and method
US4617251A (en) * 1985-04-11 1986-10-14 Olin Hunt Specialty Products, Inc. Stripping composition and method of using the same
US4770713A (en) 1986-12-10 1988-09-13 Advanced Chemical Technologies, Inc. Stripping compositions containing an alkylamide and an alkanolamine and use thereof
JPS63208043A (ja) 1987-02-25 1988-08-29 Kanto Kagaku Kk ポジ型フオトレジスト用水溶性剥離液
US5035829A (en) * 1987-03-04 1991-07-30 Gaf Chemicals Corporation Paint removing compositions
JP2553872B2 (ja) 1987-07-21 1996-11-13 東京応化工業株式会社 ホトレジスト用剥離液
US4824763A (en) 1987-07-30 1989-04-25 Ekc Technology, Inc. Triamine positive photoresist stripping composition and prebaking process
JPH0769618B2 (ja) 1987-09-25 1995-07-31 旭化成工業株式会社 フオトレジスト用剥離剤
JP2631849B2 (ja) 1987-09-30 1997-07-16 ナガセ電子化学 株式会社 剥離剤組成物
US5011621A (en) * 1990-06-04 1991-04-30 Arco Chemical Technology, Inc. Paint stripper compositions containing N-methyl-2-pyrrolidone and renewable resources
JP2906590B2 (ja) 1990-06-14 1999-06-21 三菱瓦斯化学株式会社 アルミニウム配線半導体基板の表面処理剤
JP2527268B2 (ja) 1990-09-17 1996-08-21 東京応化工業株式会社 レジスト用剥離剤組成物
US5279771A (en) 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
JP3160344B2 (ja) 1991-01-25 2001-04-25 アシュランド インコーポレーテッド 有機ストリッピング組成物
US5753601A (en) * 1991-01-25 1998-05-19 Ashland Inc Organic stripping composition
US5988186A (en) * 1991-01-25 1999-11-23 Ashland, Inc. Aqueous stripping and cleaning compositions
JPH04350660A (ja) 1991-05-28 1992-12-04 Texas Instr Japan Ltd 半導体装置製造用ポジ型フォトレジスト用剥離液および半導体装置の製造方法
US5454985A (en) * 1992-11-06 1995-10-03 Gage Products Company Paint stripping composition
US5308745A (en) * 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
US6326130B1 (en) 1993-10-07 2001-12-04 Mallinckrodt Baker, Inc. Photoresist strippers containing reducing agents to reduce metal corrosion
JP3406055B2 (ja) 1994-03-31 2003-05-12 東京応化工業株式会社 ポジ型レジスト用剥離液
US5472830A (en) 1994-04-18 1995-12-05 Ocg Microelectronic Materials, Inc. Non-corrosion photoresist stripping composition
US5545353A (en) 1995-05-08 1996-08-13 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
US5597678A (en) * 1994-04-18 1997-01-28 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
US5567574A (en) 1995-01-10 1996-10-22 Mitsubishi Gas Chemical Company, Inc. Removing agent composition for photoresist and method of removing
US5563119A (en) * 1995-01-26 1996-10-08 Ashland Inc. Stripping compositions containing alkanolamine compounds
US5571447A (en) 1995-03-20 1996-11-05 Ashland Inc. Stripping and cleaning composition
US5507978A (en) 1995-05-08 1996-04-16 Ocg Microelectronic Materials, Inc. Novolak containing photoresist stripper composition
JP2911792B2 (ja) * 1995-09-29 1999-06-23 東京応化工業株式会社 レジスト用剥離液組成物
JP3236220B2 (ja) * 1995-11-13 2001-12-10 東京応化工業株式会社 レジスト用剥離液組成物
US5759975A (en) * 1996-08-26 1998-06-02 Gage Products Company Paint line cleaner
US5798323A (en) * 1997-05-05 1998-08-25 Olin Microelectronic Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6268323B1 (en) * 1997-05-05 2001-07-31 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition

Also Published As

Publication number Publication date
JP2006146272A (ja) 2006-06-08
US20010034313A1 (en) 2001-10-25
US6268323B1 (en) 2001-07-31
DE69921350D1 (de) 2004-11-25
KR20010072673A (ko) 2001-07-31
EP1129145B1 (de) 2004-10-20
TW552481B (en) 2003-09-11
JP3796622B2 (ja) 2006-07-12
EP1129145A1 (de) 2001-09-05
WO2000011091A1 (en) 2000-03-02
JP2002523546A (ja) 2002-07-30
EP1129145A4 (de) 2001-11-21
DE69921350T2 (de) 2006-02-16
US6372050B2 (en) 2002-04-16

Similar Documents

Publication Publication Date Title
ATE280204T1 (de) Nicht-korrodierende entfernungs-und reinigungs- zusammensetzung
IL138706A0 (en) Acidic composition containing fluoride for removal of photoresists and etch residues
ES2133785T3 (es) Inhibidores de metaloproteinasas.
DE69431646D1 (de) Haarwasch- und Konditionierungsmittel
DK0783486T3 (da) Hidtil ukendte prostaglandinsynthaseinhibitorer
MY122745A (en) Method for removing an aluminide coating from a substrate
ATE353034T1 (de) Wässerige abstreif- und reinigungszusammenstellungen
ATE517974T1 (de) Wässrige stripp- und reinigungszusammensetzung
KR950018340A (ko) 히드록실아민 및 알카놀아민을 포함하는 수성 스트립핑 조성물 및 그 사용방법
DE69912976D1 (de) Konzentrierte entlackungsmittel, zusammensetzung und verfahren
SE8404019D0 (sv) Oftalmiskt medel
BG46451A3 (en) Herbicide means
ES2149543T3 (es) Composiciones para eliminar incrustaciones de cal.
ATE284384T1 (de) Aromatische sulfonierung-reaktionen
DK0813585T3 (da) Rengøringssammensætninger
NO982229D0 (no) Svovelholdige di-tert-butylfenol-forbindelser anvendbare som antiinflammatoriske midler
ATE55615T1 (de) Abbeizpaste zum entfernen von lack- und farbschichten.
DE50107209D1 (de) Verfahren zur herstellung von 5-aminosalicylsäure
CY1107765T1 (el) Μεθοδος για τη δημιουργια μιας συνθεσης, ενα προϊον απο μια τετοια μεθοδο, και η χρηση αυτου στην αφαιρεση ή τη διαλυση ενος μολυσματος απο ενα περιβαλλον
DK314289A (da) Kompositioner
BG104302A (en) Method for preparing substituted 4-phenyl-4-cyanocyclohexanoic acids
ATE84074T1 (de) Verfahren zur fermentativen herstellung von 2-(4- hydroxiphenoxi-)propionsaeure.
DE69705592D1 (de) Kautschukzusammensetzungen, die N,N'-bis(Hydroxyphenyl)maleinsäureamid enthalten
ATE294790T1 (de) Chlormethylierung von thiophene
DE69707928D1 (de) Herstellung von dinatrium-ethylendiamin-n,n'-disuccinat

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties