ATE517974T1 - Wässrige stripp- und reinigungszusammensetzung - Google Patents

Wässrige stripp- und reinigungszusammensetzung

Info

Publication number
ATE517974T1
ATE517974T1 AT03729578T AT03729578T ATE517974T1 AT E517974 T1 ATE517974 T1 AT E517974T1 AT 03729578 T AT03729578 T AT 03729578T AT 03729578 T AT03729578 T AT 03729578T AT E517974 T1 ATE517974 T1 AT E517974T1
Authority
AT
Austria
Prior art keywords
cleaning composition
aqueous stripping
water
composition
stripping
Prior art date
Application number
AT03729578T
Other languages
English (en)
Inventor
Matthew Egbe
Darryl Peters
Original Assignee
Air Prod & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Prod & Chem filed Critical Air Prod & Chem
Application granted granted Critical
Publication of ATE517974T1 publication Critical patent/ATE517974T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/38—Cationic compounds
    • C11D1/62—Quaternary ammonium compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/273—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a delineation of conductive layers, e.g. by RIE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/02—Anionic compounds
    • C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
    • C11D1/14—Sulfonic acids or sulfuric acid esters; Salts thereof derived from aliphatic hydrocarbons or mono-alcohols
    • C11D1/143—Sulfonic acid esters
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/02—Anionic compounds
    • C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
    • C11D1/22—Sulfonic acids or sulfuric acid esters; Salts thereof derived from aromatic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/34—Organic compounds containing sulfur
    • C11D3/3409—Alkyl -, alkenyl -, cycloalkyl - or terpene sulfates or sulfonates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/34—Organic compounds containing sulfur
    • C11D3/3418—Toluene -, xylene -, cumene -, benzene - or naphthalene sulfonates or sulfates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3263—Amides or imides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Detergent Compositions (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
AT03729578T 2002-01-09 2003-01-06 Wässrige stripp- und reinigungszusammensetzung ATE517974T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/042,612 US6943142B2 (en) 2002-01-09 2002-01-09 Aqueous stripping and cleaning composition
PCT/US2003/000291 WO2003060045A1 (en) 2002-01-09 2003-01-06 Aqueous stripping and cleaning composition

Publications (1)

Publication Number Publication Date
ATE517974T1 true ATE517974T1 (de) 2011-08-15

Family

ID=21922846

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03729578T ATE517974T1 (de) 2002-01-09 2003-01-06 Wässrige stripp- und reinigungszusammensetzung

Country Status (10)

Country Link
US (2) US6943142B2 (de)
EP (2) EP2281866A1 (de)
JP (2) JP2006505629A (de)
KR (1) KR100714951B1 (de)
CN (2) CN1900829A (de)
AT (1) ATE517974T1 (de)
AU (1) AU2003216037A1 (de)
MY (1) MY130394A (de)
TW (1) TWI300885B (de)
WO (1) WO2003060045A1 (de)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4154999B2 (ja) * 2002-11-01 2008-09-24 東ソー株式会社 洗浄方法
KR100835606B1 (ko) * 2002-12-30 2008-06-09 엘지디스플레이 주식회사 구리용 레지스트 제거용 조성물
US7384900B2 (en) * 2003-08-27 2008-06-10 Lg Display Co., Ltd. Composition and method for removing copper-compatible resist
US8338087B2 (en) * 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
JP2006169442A (ja) * 2004-12-17 2006-06-29 Tokuyama Corp 洗浄剤
US7867779B2 (en) 2005-02-03 2011-01-11 Air Products And Chemicals, Inc. System and method comprising same for measurement and/or analysis of particles in gas stream
US20060183055A1 (en) * 2005-02-15 2006-08-17 O'neill Mark L Method for defining a feature on a substrate
EP1857036B1 (de) * 2005-03-09 2012-07-25 Olympus Corporation In einen probanden einzuführende vorrichtung und in einen probanden einzuführendes system
KR100690347B1 (ko) * 2005-04-09 2007-03-09 주식회사 엘지화학 박리액 조성물, 이를 이용한 박리 방법 및 그 박리 장치
JP2008537343A (ja) * 2005-04-15 2008-09-11 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド マイクロエレクトロニクスデバイスからイオン注入フォトレジスト層をクリーニングするための配合物
KR101088568B1 (ko) 2005-04-19 2011-12-05 아반토르 퍼포먼스 머티리얼스, 인크. 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼
JP2008543060A (ja) * 2005-05-26 2008-11-27 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 銅不活性化化学機械研磨後洗浄組成物及び使用方法
EP2687589A3 (de) * 2005-05-26 2014-05-07 Advanced Technology Materials, Inc. Nach dem chemisch-mechanischen Polieren kupferpassivierende Reinigungszusammensetzung und Verwendungsverfahren
CN1982426B (zh) * 2005-12-16 2011-08-03 安集微电子（上海）有限公司 用于半导体晶片清洗的缓蚀剂体系
TW200734448A (en) * 2006-02-03 2007-09-16 Advanced Tech Materials Low pH post-CMP residue removal composition and method of use
US8288330B2 (en) * 2006-05-26 2012-10-16 Air Products And Chemicals, Inc. Composition and method for photoresist removal
US8987039B2 (en) 2007-10-12 2015-03-24 Air Products And Chemicals, Inc. Antireflective coatings for photovoltaic applications
US20090096106A1 (en) * 2007-10-12 2009-04-16 Air Products And Chemicals, Inc. Antireflective coatings
US7687447B2 (en) * 2008-03-13 2010-03-30 Air Products And Chemicals, Inc. Semi-aqueous stripping and cleaning composition containing aminobenzenesulfonic acid
JP5466836B2 (ja) * 2008-06-13 2014-04-09 花王株式会社 フラックス用洗浄剤組成物
CN101295143B (zh) * 2008-06-19 2011-11-23 大连三达奥克化学股份有限公司 光刻胶残留物清洗剂
US20100151206A1 (en) 2008-12-11 2010-06-17 Air Products And Chemicals, Inc. Method for Removal of Carbon From An Organosilicate Material
US8361237B2 (en) * 2008-12-17 2013-01-29 Air Products And Chemicals, Inc. Wet clean compositions for CoWP and porous dielectrics
US8444768B2 (en) 2009-03-27 2013-05-21 Eastman Chemical Company Compositions and methods for removing organic substances
US8309502B2 (en) * 2009-03-27 2012-11-13 Eastman Chemical Company Compositions and methods for removing organic substances
US8614053B2 (en) 2009-03-27 2013-12-24 Eastman Chemical Company Processess and compositions for removing substances from substrates
US8110535B2 (en) 2009-08-05 2012-02-07 Air Products And Chemicals, Inc. Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same
US8101561B2 (en) * 2009-11-17 2012-01-24 Wai Mun Lee Composition and method for treating semiconductor substrate surface
JP2012018982A (ja) * 2010-07-06 2012-01-26 Tosoh Corp レジスト剥離剤及びそれを用いた剥離法
EP2460860A1 (de) * 2010-12-02 2012-06-06 Basf Se Verwendung von Mischungen zur Entfernung von Polyurethanen von Metalloberflächen
JP2013032473A (ja) * 2011-07-29 2013-02-14 Mitsuhiro Kawada 水系洗浄剤
US9029268B2 (en) 2012-11-21 2015-05-12 Dynaloy, Llc Process for etching metals
US10189712B2 (en) 2013-03-15 2019-01-29 International Business Machines Corporation Oxidation of porous, carbon-containing materials using fuel and oxidizing agent
JP6450366B2 (ja) 2013-03-29 2019-01-09 ライフ テクノロジーズ コーポレーション 半導体装置を処理するための方法
EP3143117B1 (de) * 2014-05-13 2019-09-04 Basf Se Tin-entfernung und reinigungsmittel
KR102405637B1 (ko) * 2014-11-13 2022-06-07 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 텅스텐을 포함하는 재료의 데미지를 억제한 반도체 소자의 세정액, 및 이것을 이용한 반도체 소자의 세정방법
CN105177599A (zh) * 2015-07-21 2015-12-23 安徽江威精密制造有限公司 无磷除油剂及其制备方法
CN105543869A (zh) * 2015-12-31 2016-05-04 芜湖市金宇石化设备有限公司 一种用于铝材表面处理的清洗液
CN105543868A (zh) * 2015-12-31 2016-05-04 芜湖市金宇石化设备有限公司 一种用于铝材表面处理的清洗液的制备方法
CN105568302A (zh) * 2015-12-31 2016-05-11 芜湖市金宇石化设备有限公司 一种铝材的表面处理工艺
CN105855212B (zh) * 2016-05-23 2017-11-07 强新正品（苏州）环保材料科技有限公司 一种硅胶高分子材料的清洗方法
CN106434025A (zh) * 2016-09-14 2017-02-22 芜湖成德龙过滤设备有限公司 套管灭菌剂及其制备方法
WO2018093827A1 (en) 2016-11-17 2018-05-24 Fujifilm Electronic Materials U.S.A., Inc. Stripping process
CN108424818A (zh) * 2017-02-14 2018-08-21 东友精细化工有限公司 掩模清洗液组合物
US11353794B2 (en) * 2017-12-22 2022-06-07 Versum Materials Us, Llc Photoresist stripper
JP7150433B2 (ja) * 2017-12-28 2022-10-11 東京応化工業株式会社 リワーク方法、及び酸性洗浄液
KR102691177B1 (ko) * 2018-01-25 2024-08-01 메르크 파텐트 게엠베하 포토레지스트 리무버 조성물
CN114008181A (zh) * 2019-06-19 2022-02-01 弗萨姆材料美国有限责任公司 用于半导体衬底的清洁组合物
JP7419905B2 (ja) * 2020-03-19 2024-01-23 日油株式会社 回路基板用樹脂膜剥離剤
US11584900B2 (en) 2020-05-14 2023-02-21 Corrosion Innovations, Llc Method for removing one or more of: coating, corrosion, salt from a surface
TWI824299B (zh) * 2020-09-22 2023-12-01 美商恩特葛瑞斯股份有限公司 蝕刻劑組合物
CN112592775B (zh) * 2020-12-07 2021-10-12 湖北兴福电子材料有限公司 一种控挡片清洗液及清洗方法
KR102933956B1 (ko) 2021-05-03 2026-03-04 삼성전자주식회사 포토레지스트 박리 조성물과 이를 이용하는 반도체 소자 및 반도체 패키지의 제조 방법
CN119325501A (zh) 2022-05-31 2025-01-17 巴斯夫欧洲公司 用于清洁包含钴和铜的衬底的组合物、其用途及方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653931A (en) * 1970-12-30 1972-04-04 Miles Lab Anti-tarnish composition for metal surfaces and process for its use
US3887497A (en) * 1973-03-15 1975-06-03 George B Ulvild Liquid cleansing composition and method of producing
US3915902A (en) * 1973-08-29 1975-10-28 Chemtrust Ind Corp Cleaning compositions
US4165295A (en) * 1976-10-04 1979-08-21 Allied Chemical Corporation Organic stripping compositions and method for using same
US4242218A (en) * 1976-11-08 1980-12-30 Allied Chemical Corporation Phenol-free photoresist stripper
US4215005A (en) * 1978-01-30 1980-07-29 Allied Chemical Corporation Organic stripping compositions and method for using same
CA1116059A (en) * 1978-05-22 1982-01-12 Allied Corporation Phenol-free and chlorinated hydrocarbon-free photoresist stripper
US4221674A (en) * 1979-03-09 1980-09-09 Allied Chemical Corporation Organic sulfonic acid stripping composition and method with nitrile and fluoride metal corrosion inhibitor system
US4321166A (en) * 1978-12-26 1982-03-23 The Procter & Gamble Company Liquid detergent compositions containing corrosion inhibiting system
US4199483A (en) * 1979-03-05 1980-04-22 The Procter & Gamble Company Detergent compositions containing salicylate corrosion inhibitor
US4304681A (en) * 1980-09-15 1981-12-08 Shipley Company, Inc. Novel stripping composition for positive photoresists and method of using same
US4491530A (en) * 1983-05-20 1985-01-01 Allied Corporation Brown stain suppressing phenol free and chlorinated hydrocarbons free photoresist stripper
US4617251A (en) * 1985-04-11 1986-10-14 Olin Hunt Specialty Products, Inc. Stripping composition and method of using the same
GB8827847D0 (en) * 1988-11-29 1988-12-29 Ciba Geigy Ag Method
JPH04199483A (ja) * 1990-11-29 1992-07-20 Fuji Xerox Co Ltd 文書認識修正装置
JPH04321166A (ja) * 1991-04-22 1992-11-11 Sanyo Electric Co Ltd 情報処理装置
US5534177A (en) * 1992-02-14 1996-07-09 Mayhan; Kenneth G. Compositions useful for removing products of metal corrosion
US5308745A (en) * 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
US5512201A (en) * 1995-02-13 1996-04-30 Applied Chemical Technologies, Inc. Solder and tin stripper composition
JP3373105B2 (ja) * 1996-03-11 2003-02-04 富士フイルムアーチ株式会社 フォトレジスト剥離液
US5728664A (en) * 1996-04-15 1998-03-17 Ashland, Inc. Photoresist stripping compositions
JPH1055993A (ja) * 1996-08-09 1998-02-24 Hitachi Ltd 半導体素子製造用洗浄液及びそれを用いた半導体素子の製造方法
TW411356B (en) * 1996-09-11 2000-11-11 Nippon Kayaku Kk Anthrapyridone compounds, water-borne ink composition, and colored objects thereof
US5888308A (en) * 1997-02-28 1999-03-30 International Business Machines Corporation Process for removing residue from screening masks with alkaline solution
US5798323A (en) 1997-05-05 1998-08-25 Olin Microelectronic Chemicals, Inc. Non-corrosive stripping and cleaning composition
JPH11125917A (ja) 1997-10-21 1999-05-11 Fuji Film Olin Kk フォトレジスト剥離液
JP3264878B2 (ja) * 1997-12-26 2002-03-11 花王株式会社 液体洗浄剤組成物
US6231677B1 (en) * 1998-02-27 2001-05-15 Kanto Kagaku Kabushiki Kaisha Photoresist stripping liquid composition
US6417112B1 (en) * 1998-07-06 2002-07-09 Ekc Technology, Inc. Post etch cleaning composition and process for dual damascene system
JP3474127B2 (ja) 1998-11-13 2003-12-08 花王株式会社 剥離剤組成物
US6486115B1 (en) * 1999-11-09 2002-11-26 Baker Hughes Incorporated Microemulsion cleaning composition
EP1277830A4 (de) * 2000-04-26 2004-08-04 Daikin Ind Ltd Waschmittelzusammensetzung
US6498131B1 (en) * 2000-08-07 2002-12-24 Ekc Technology, Inc. Composition for cleaning chemical mechanical planarization apparatus
DE60124473T2 (de) * 2000-09-08 2007-09-06 Kanto Kagaku K.K. Ätzflüssigkeitszusammensetzung
US6656894B2 (en) * 2000-12-07 2003-12-02 Ashland Inc. Method for cleaning etcher parts
WO2002089532A1 (en) * 2001-04-26 2002-11-07 Phifer Smith Corporation A method and apparatus for heating a gas-solvent solution

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CN1612927A (zh) 2005-05-04
US20050217697A1 (en) 2005-10-06
HK1078102A1 (en) 2006-03-03
US6943142B2 (en) 2005-09-13
EP1470207A4 (de) 2005-03-16
MY130394A (en) 2007-06-29
TW200306464A (en) 2003-11-16
CN1900829A (zh) 2007-01-24
JP2006505629A (ja) 2006-02-16
TWI300885B (en) 2008-09-11
US20030130146A1 (en) 2003-07-10
US8231733B2 (en) 2012-07-31
AU2003216037A1 (en) 2003-07-30
EP1470207B1 (de) 2011-07-27
EP2281866A1 (de) 2011-02-09
EP1470207A1 (de) 2004-10-27
KR20040075058A (ko) 2004-08-26
JP2009102729A (ja) 2009-05-14
WO2003060045A1 (en) 2003-07-24
CN1298827C (zh) 2007-02-07
KR100714951B1 (ko) 2007-05-04

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