ATE285578T1 - Mikroelektronischer sensor zur feststellung einer bindungsverschlechterung und zugehöriges herstellungsverfahren - Google Patents
Mikroelektronischer sensor zur feststellung einer bindungsverschlechterung und zugehöriges herstellungsverfahrenInfo
- Publication number
- ATE285578T1 ATE285578T1 AT00914558T AT00914558T ATE285578T1 AT E285578 T1 ATE285578 T1 AT E285578T1 AT 00914558 T AT00914558 T AT 00914558T AT 00914558 T AT00914558 T AT 00914558T AT E285578 T1 ATE285578 T1 AT E285578T1
- Authority
- AT
- Austria
- Prior art keywords
- sensor
- stud
- production method
- bond degradation
- associated production
- Prior art date
Links
- 230000015556 catabolic process Effects 0.000 title abstract 2
- 238000006731 degradation reaction Methods 0.000 title abstract 2
- 238000004377 microelectronic Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N17/00—Investigating resistance of materials to the weather, to corrosion, or to light
- G01N17/02—Electrochemical measuring systems for weathering, corrosion or corrosion-protection measurement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/44—Resins; Plastics; Rubber; Leather
- G01N33/442—Resins; Plastics
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Environmental Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Biodiversity & Conservation Biology (AREA)
- Ecology (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11916699P | 1999-02-08 | 1999-02-08 | |
| PCT/US2000/003308 WO2000046593A2 (en) | 1999-02-08 | 2000-02-08 | A micro-electronic bond degradation sensor and method of manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE285578T1 true ATE285578T1 (de) | 2005-01-15 |
Family
ID=22382891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT00914558T ATE285578T1 (de) | 1999-02-08 | 2000-02-08 | Mikroelektronischer sensor zur feststellung einer bindungsverschlechterung und zugehöriges herstellungsverfahren |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6384610B1 (de) |
| EP (1) | EP1151286B1 (de) |
| AT (1) | ATE285578T1 (de) |
| AU (2) | AU770057B2 (de) |
| DE (1) | DE60016896D1 (de) |
| WO (1) | WO2000046593A2 (de) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69929967T2 (de) | 1998-04-21 | 2007-05-24 | Applied Materials, Inc., Santa Clara | Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten |
| EP1151286B1 (de) | 1999-02-08 | 2004-12-22 | Defence Science and Technology Organisation of the Department of Defence | Mikroelektronischer sensor zur feststellung einer bindungsverschlechterung und zugehöriges herstellungsverfahren |
| KR100427405B1 (ko) * | 2001-03-07 | 2004-04-17 | 박재만 | 피에스에스씨 합성거더 |
| US6911828B1 (en) * | 2001-05-23 | 2005-06-28 | Southwest Research Institute | Apparatus and method for detecting the degradation of a coating using embedded sensors |
| FR2839796B1 (fr) * | 2002-05-15 | 2004-11-26 | Ermme | Systeme d'acquisition multi-voies synchrones pour la mesure de grandeurs physiques, module d'acquisition utilise et procede mis en oeuvre dans un tel systeme |
| US7590397B2 (en) * | 2003-09-10 | 2009-09-15 | Sony Corporation | Signal processing apparatus and signal processing method, program, and recording medium |
| JP2005151617A (ja) * | 2003-11-11 | 2005-06-09 | Sumitomo Wiring Syst Ltd | 回路構成体及び回路構成体の製造方法 |
| TW200717682A (en) * | 2005-10-11 | 2007-05-01 | Orbotech Ltd | Method for inspecting microelectronic components on a substrate and apparatus for testing same |
| US7398698B2 (en) * | 2005-11-03 | 2008-07-15 | The Boeing Company | Smart repair patch and associated method |
| US7434480B2 (en) * | 2005-12-14 | 2008-10-14 | The Boeing Company | Methods and systems for using active surface coverings for structural assessment and monitoring |
| US7477060B2 (en) * | 2005-12-27 | 2009-01-13 | 3M Innovative Properties Company | Coating impedance monitoring system |
| KR100750192B1 (ko) * | 2006-05-04 | 2007-08-17 | 삼성전자주식회사 | 크랙 검사 회로를 갖는 반도체 칩 및 이를 이용한 크랙검사 방법 |
| US7504834B2 (en) * | 2006-12-20 | 2009-03-17 | 3M Innovative Properties Company | Detection system |
| US7622737B2 (en) * | 2007-07-11 | 2009-11-24 | International Business Machines Corporation | Test structures for electrically detecting back end of the line failures and methods of making and using the same |
| US7877009B2 (en) * | 2007-12-20 | 2011-01-25 | 3M Innovative Properties Company | Method and system for electrochemical impedance spectroscopy |
| US8400172B2 (en) | 2008-02-05 | 2013-03-19 | The Commonwealth of Australia, Department of Defense | Degradation sensor |
| DE102009042989A1 (de) * | 2009-09-25 | 2011-04-21 | Hellma Materials Gmbh & Co. Kg | Vorrichtung und Verfahren zur Bestimmung der Laserstabilität eines optischen Elements |
| DE102009056894B4 (de) * | 2009-12-10 | 2011-11-10 | Eads Deutschland Gmbh | Verfahren zur Herstellung eines Bauteils mit mindestens einem Mikrosensor |
| FR2953812B1 (fr) * | 2009-12-11 | 2012-09-07 | Airbus Operations Sas | Procede de reparation d'un fuselage d'aeronef |
| US9816978B2 (en) | 2010-07-15 | 2017-11-14 | Brigham Young University | Apparatus for analysis of concrete including a reinforcing bar |
| US9031734B2 (en) * | 2010-09-29 | 2015-05-12 | Aerobotics, Inc. | Systems and methods for non-destructive inspection of airplanes |
| US8928339B2 (en) * | 2010-10-29 | 2015-01-06 | The Boeing Company | Methods and systems for automated measurement of electrical bonds |
| US9567104B2 (en) | 2011-04-12 | 2017-02-14 | The Boeing Company | Utilization of aircraft bondline embedded current sensors in the determination of a lightning damage index |
| US9267906B2 (en) | 2011-04-12 | 2016-02-23 | The Boeing Company | Bondline embedded current sensor |
| US8812251B2 (en) * | 2011-04-12 | 2014-08-19 | The Boeing Company | System and method for monitoring bonding integrity |
| JP2013108831A (ja) * | 2011-11-21 | 2013-06-06 | Seiko Epson Corp | センサー装置およびセンサー装置の製造方法 |
| JP2014163900A (ja) * | 2013-02-27 | 2014-09-08 | Dainippon Printing Co Ltd | 濃度測定センサ、濃度測定センサ用シート及びその製造方法 |
| US9123701B2 (en) * | 2013-07-11 | 2015-09-01 | Infineon Technologies Austria Ag | Semiconductor die and package with source down and sensing configuration |
| US9261444B1 (en) * | 2013-07-30 | 2016-02-16 | The Boeing Company | Apparatus, system, and method for in situ strength testing of a bonded joint |
| US9909974B2 (en) | 2014-04-28 | 2018-03-06 | Brigham Young University | Data acquisition system with rotating probe members and ground reference electrode |
| JP2017520007A (ja) | 2014-06-26 | 2017-07-20 | アナラトム インコーポレイテッド | 構造体を作用電極として扱う直線分極抵抗可撓性センサ及び方法 |
| US10082492B2 (en) | 2015-06-14 | 2018-09-25 | Bringham Young University | Flexible elements for probes and guard rings |
| EP3141893B1 (de) * | 2015-09-08 | 2019-12-11 | Mitsubishi Electric R&D Centre Europe B.V. | System zur bestimmung, ob in einer schnittstelle eines halbleiterchips eine verschlechterung stattfindet |
| US9818655B2 (en) | 2015-12-08 | 2017-11-14 | International Business Machines Corporation | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups |
| IL247408B (en) | 2016-08-21 | 2018-03-29 | Elbit Systems Ltd | A system and method for identifying weaknesses in the adhesion between structural elements |
| US11255820B2 (en) * | 2019-01-16 | 2022-02-22 | The Boeing Company | Patch for in-situ monitoring of structures |
| US20230342514A1 (en) * | 2022-04-21 | 2023-10-26 | The Boeing Company | Method and system for estimating structural damage to a bonded joint |
| DE102022208239A1 (de) * | 2022-08-08 | 2024-02-08 | Carl Zeiss Smt Gmbh | Vorrichtung und Verfahren zur Sensorischen Messung Chemischer und/oder Physikalischer Eigenschaften einer Klebeschicht und/oder eines die Klebeschicht Kontaktierenden Mediums, sowie Verfahren zur Herstellung einer entsprechenden Vorrichtung und Verfahren zur Sensorischen Messung |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2423776A1 (fr) * | 1978-04-19 | 1979-11-16 | Exper Rech Etu Batiment Centre | Procede et appareillage de detection de fissures dans une paroi de beton immergee |
| US4423371A (en) * | 1981-09-03 | 1983-12-27 | Massachusetts Institute Of Technology | Methods and apparatus for microdielectrometry |
| DE3870685D1 (de) | 1987-02-23 | 1992-06-11 | Siemens Ag | Galvanisiereinrichtung zur erzeugung von hoeckern auf chip-bauelementen. |
| DE8706256U1 (de) * | 1987-04-30 | 1987-06-25 | Bayer Ag, 5090 Leverkusen | Kontrolleiter zum Prüfen von Schweißnähten |
| US5158091A (en) * | 1990-11-30 | 1992-10-27 | Ivac Corporation | Tonometry system for determining blood pressure |
| US5245293A (en) * | 1991-12-23 | 1993-09-14 | Teledyne Ryan Aeronautical, Division Of Teledyne Industries, Inc. | Adhesive bond degradation monitor |
| US5572115A (en) * | 1992-09-22 | 1996-11-05 | Brigham Young University | Device and method for measuring charge carrying activity in generally non-conductive materials |
| DE4239495C2 (de) | 1992-11-25 | 1995-04-13 | Willibald Luber | Vorrichtung zur zerstörungsfreien Aufdeckung von Schäden an flächenhaften Abdichtungen wie auf Brücken, Wannen, Deponiesohlen und Flachdächern |
| US5864162A (en) * | 1993-07-12 | 1999-01-26 | Peregrine Seimconductor Corporation | Apparatus and method of making a self-aligned integrated resistor load on ultrathin silicon on sapphire |
| FR2732465B1 (fr) * | 1995-03-31 | 1997-06-06 | Aerospatiale | Procede de mesure du gradient d'humidite dans l'epaisseur d'une piece en materiau composite |
| DE19707788A1 (de) * | 1996-12-24 | 1998-07-02 | I M E S Ges Fuer Innovative Me | Verfahren zur Überwachung und Kontrolle von Schlitz- und Dichtwänden |
| US5833820A (en) | 1997-06-19 | 1998-11-10 | Advanced Micro Devices, Inc. | Electroplating apparatus |
| US6004440A (en) * | 1997-09-18 | 1999-12-21 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
| EP1151286B1 (de) | 1999-02-08 | 2004-12-22 | Defence Science and Technology Organisation of the Department of Defence | Mikroelektronischer sensor zur feststellung einer bindungsverschlechterung und zugehöriges herstellungsverfahren |
-
2000
- 2000-02-08 EP EP00914558A patent/EP1151286B1/de not_active Expired - Lifetime
- 2000-02-08 WO PCT/US2000/003308 patent/WO2000046593A2/en not_active Ceased
- 2000-02-08 AT AT00914558T patent/ATE285578T1/de not_active IP Right Cessation
- 2000-02-08 US US09/501,798 patent/US6384610B1/en not_active Expired - Fee Related
- 2000-02-08 DE DE60016896T patent/DE60016896D1/de not_active Expired - Lifetime
- 2000-02-08 AU AU35931/00A patent/AU770057B2/en not_active Ceased
-
2002
- 2002-05-03 US US10/139,035 patent/US6693417B2/en not_active Expired - Fee Related
-
2004
- 2004-05-11 AU AU2004201996A patent/AU2004201996A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1151286B1 (de) | 2004-12-22 |
| US20020190729A1 (en) | 2002-12-19 |
| US6693417B2 (en) | 2004-02-17 |
| DE60016896D1 (de) | 2005-01-27 |
| WO2000046593A3 (en) | 2000-12-14 |
| EP1151286A2 (de) | 2001-11-07 |
| WO2000046593A2 (en) | 2000-08-10 |
| AU2004201996A1 (en) | 2004-06-10 |
| AU3593100A (en) | 2000-08-25 |
| US6384610B1 (en) | 2002-05-07 |
| AU770057B2 (en) | 2004-02-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |