ATE285665T1 - Kühlkörper für ein elektronisches bauelement, vorrichtung und verfahren zu dessen herstellung - Google Patents

Kühlkörper für ein elektronisches bauelement, vorrichtung und verfahren zu dessen herstellung

Info

Publication number
ATE285665T1
ATE285665T1 AT99954464T AT99954464T ATE285665T1 AT E285665 T1 ATE285665 T1 AT E285665T1 AT 99954464 T AT99954464 T AT 99954464T AT 99954464 T AT99954464 T AT 99954464T AT E285665 T1 ATE285665 T1 AT E285665T1
Authority
AT
Austria
Prior art keywords
heatsink
heat
plates
dissipating
heatsink plates
Prior art date
Application number
AT99954464T
Other languages
English (en)
Inventor
Sang Cheol Lee
Original Assignee
Zalman Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zalman Tech Co Ltd filed Critical Zalman Tech Co Ltd
Application granted granted Critical
Publication of ATE285665T1 publication Critical patent/ATE285665T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237—Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Thermistors And Varistors (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
AT99954464T 1998-11-04 1999-11-03 Kühlkörper für ein elektronisches bauelement, vorrichtung und verfahren zu dessen herstellung ATE285665T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR19980047121 1998-11-04
KR1019990048238A KR100317450B1 (ko) 1998-11-04 1999-11-02 전기전자기기 부품용 히트싱크 및 그 제조장치
PCT/KR1999/000660 WO2000027177A1 (en) 1998-11-04 1999-11-03 Heatsink for electronic component, and apparatus and method for manufacturing the same

Publications (1)

Publication Number Publication Date
ATE285665T1 true ATE285665T1 (de) 2005-01-15

Family

ID=36202225

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99954464T ATE285665T1 (de) 1998-11-04 1999-11-03 Kühlkörper für ein elektronisches bauelement, vorrichtung und verfahren zu dessen herstellung

Country Status (13)

Country Link
EP (1) EP1135978B1 (de)
JP (1) JP3847561B2 (de)
KR (1) KR100317450B1 (de)
CN (1) CN1204797C (de)
AT (1) ATE285665T1 (de)
AU (1) AU745603B2 (de)
BR (1) BR9914936A (de)
CA (1) CA2349340A1 (de)
DE (1) DE69922838T2 (de)
ID (1) ID29388A (de)
IL (1) IL142733A0 (de)
RU (1) RU2217886C2 (de)
WO (1) WO2000027177A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3431004B2 (ja) * 2000-01-14 2003-07-28 松下電器産業株式会社 ヒートシンクおよびそれを用いた冷却装置
JP2001135755A (ja) * 1999-11-10 2001-05-18 Oki Electric Ind Co Ltd 放熱フィン構造
CN1215751C (zh) * 2001-03-03 2005-08-17 扎尔曼技术株式会社 散热器
AU2004210531B2 (en) * 2001-03-03 2005-03-24 Zalman Tech Co., Ltd. Heatsink
KR20020073868A (ko) * 2001-03-16 2002-09-28 김종국 슬롯이 형성된 방열 핀들이 적층된 히트싱크와 이를적용한 냉각모듈
TW516809U (en) * 2001-09-21 2003-01-01 Leadtek Research Inc Integrated heat dissipating device
JP3798405B2 (ja) * 2002-04-06 2006-07-19 ザルマン テック カンパニー リミテッド Ｖｇａカードのチップセット冷却装置
KR100455562B1 (ko) * 2002-06-26 2004-11-06 히트텍(주) 전자 부품 소자 냉각용 방열핀
US6958915B2 (en) 2003-10-07 2005-10-25 Hon Hai Precision Ind. Co., Ltd. Heat dissipating device for electronic component
KR100650122B1 (ko) * 2004-09-20 2006-11-27 잘만테크 주식회사 히트싱크
DE102005062030B3 (de) * 2005-12-22 2007-06-21 Eads Space Transportation Gmbh Hitzeschild zur Montage an einem wärmestrahlenden Gegenstand, insbesondere an einem Raketentriebwerk
RU2360381C1 (ru) * 2008-03-26 2009-06-27 Юрий Михайлович Муров Радиатор для электронного компонента
CN101856701B (zh) * 2009-04-13 2013-12-25 富准精密工业(深圳)有限公司 散热器及其制造方法
KR100948401B1 (ko) * 2009-04-17 2010-03-22 석주한 거꾸로 부착된 발광 다이오드 장치
US8552283B2 (en) * 2010-01-11 2013-10-08 Toyota Motor Engineering & Manufacturing North America, Inc. Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems
CN103399622A (zh) * 2013-07-02 2013-11-20 重庆富鸿达电子有限公司 散热模组的制作工艺
CN104302147B (zh) * 2013-07-18 2017-07-28 技嘉科技股份有限公司 散热器的制造方法及其散热器
CN106392475B (zh) * 2016-10-14 2018-11-09 山东开元电子有限公司 插片散热器制造方法及其制作装置
RU184729U1 (ru) * 2016-12-02 2018-11-07 Юрий Константинович Морозов Радиатор для охлаждения электронных устройств
WO2018182449A1 (ru) * 2017-03-27 2018-10-04 Олег Вячеславович НУЖДИН Радиатор
JP6988148B2 (ja) 2017-04-24 2022-01-05 富士電機株式会社 鉄道車両用電力変換装置
US10180247B1 (en) * 2017-07-03 2019-01-15 Valeo North America, Inc. Device and method for placement of light source on a heat sink
US11665857B2 (en) * 2020-09-17 2023-05-30 Te Connectivity Solutions Gmbh Heat sink assembly for an electrical connector assembly
US20230081151A1 (en) * 2021-09-10 2023-03-16 Dell Products L.P. Heat pipes with high recycled content for information handling systems

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB210087A (en) * 1923-01-20 1925-05-21 Hoppe & Co Nachf O Improved mechanism for feeding cardboard or paper webs in printing, stamping or embossing machines
ZA843231B (en) * 1983-05-04 1984-12-24 American Can Co Multiple layer packaging film
JPS6465076A (en) * 1987-09-05 1989-03-10 Sumitomo Electric Industries Production of long-sized product of sintered body
RU2047953C1 (ru) * 1993-08-17 1995-11-10 Омское научно-производственное объединение "Сибкриотехника" Радиатор для охлаждения силовых полупроводниковых приборов
US5794695A (en) * 1996-08-02 1998-08-18 Peterson; Roger Method and apparatus for gathering and preparing liquid samples for analysis
JPH1065076A (ja) * 1996-08-23 1998-03-06 Matsushita Electric Ind Co Ltd 半導体発熱素子の放熱器
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths

Also Published As

Publication number Publication date
EP1135978A1 (de) 2001-09-26
WO2000027177A1 (en) 2000-05-11
IL142733A0 (en) 2002-03-10
BR9914936A (pt) 2001-10-30
KR20000035173A (ko) 2000-06-26
ID29388A (id) 2001-08-30
AU1080500A (en) 2000-05-22
JP3847561B2 (ja) 2006-11-22
KR100317450B1 (ko) 2001-12-24
CN1348679A (zh) 2002-05-08
DE69922838D1 (de) 2005-01-27
JP2002529921A (ja) 2002-09-10
AU745603B2 (en) 2002-03-21
DE69922838T2 (de) 2006-05-04
CN1204797C (zh) 2005-06-01
EP1135978B1 (de) 2004-12-22
RU2217886C2 (ru) 2003-11-27
CA2349340A1 (en) 2000-05-11

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