ATE291048T1 - Vinylether und karbamat oder harnstofffunktionalität enthaltende haftklebemittel für halbleiterplatten - Google Patents

Vinylether und karbamat oder harnstofffunktionalität enthaltende haftklebemittel für halbleiterplatten

Info

Publication number
ATE291048T1
ATE291048T1 AT01111271T AT01111271T ATE291048T1 AT E291048 T1 ATE291048 T1 AT E291048T1 AT 01111271 T AT01111271 T AT 01111271T AT 01111271 T AT01111271 T AT 01111271T AT E291048 T1 ATE291048 T1 AT E291048T1
Authority
AT
Austria
Prior art keywords
vinyl ether
carbamat
containing vinyl
urea functionality
adhesives containing
Prior art date
Application number
AT01111271T
Other languages
English (en)
Inventor
Osama M Musa
Donald E Herr
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Application granted granted Critical
Publication of ATE291048T1 publication Critical patent/ATE291048T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/6715—Unsaturated monofunctional alcohols or amines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J135/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J135/08—Copolymers with vinyl ethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Conductive Materials (AREA)
AT01111271T 2000-05-18 2001-05-16 Vinylether und karbamat oder harnstofffunktionalität enthaltende haftklebemittel für halbleiterplatten ATE291048T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US57330300A 2000-05-18 2000-05-18

Publications (1)

Publication Number Publication Date
ATE291048T1 true ATE291048T1 (de) 2005-04-15

Family

ID=24291427

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01111271T ATE291048T1 (de) 2000-05-18 2001-05-16 Vinylether und karbamat oder harnstofffunktionalität enthaltende haftklebemittel für halbleiterplatten

Country Status (10)

Country Link
US (2) US20020032260A1 (de)
EP (1) EP1156068B1 (de)
JP (1) JP2002047475A (de)
KR (1) KR100789332B1 (de)
CN (1) CN1180044C (de)
AT (1) ATE291048T1 (de)
CA (1) CA2347872A1 (de)
DE (1) DE60109356T2 (de)
SG (1) SG95650A1 (de)
TW (1) TWI301491B (de)

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CN1180044C (zh) * 2000-05-18 2004-12-15 国家淀粉及化学投资控股公司 含有乙烯基醚和氨基甲酸酯或脲官能团的小片连接粘合剂
US6831132B2 (en) * 2002-03-28 2004-12-14 Henkel Corporation Film adhesives containing maleimide compounds and methods for use thereof
US20030232926A1 (en) * 2002-05-14 2003-12-18 Nikolic Nikola A. Thermoset adhesive films
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
US7884174B2 (en) 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US8513375B2 (en) * 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
CN1784457B (zh) * 2003-05-05 2010-07-14 设计者分子公司 二酰亚胺连接的马来酰亚胺和聚马来酰亚胺化合物
EP1756035B1 (de) * 2004-05-02 2013-08-14 Ashland Licensing and Intellectual Property LLC Strahlungshärtbare beschichtungen für metallsubstrate aus multifunktionellen acrylatoligomeren
US20050267254A1 (en) * 2004-05-28 2005-12-01 Mizori Farhad G Functionalized urethanes and methods for use thereof
CN101014664B (zh) * 2004-06-04 2012-10-10 设计者分子公司 可自由基固化的聚酯及其使用方法
US7875688B2 (en) * 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
US7875686B2 (en) * 2004-08-18 2011-01-25 Promerus Llc Polycycloolefin polymeric compositions for semiconductor applications
JP5478827B2 (ja) * 2004-10-28 2014-04-23 ダウ・コーニング・コーポレイション 硬化可能な伝導組成物
JP2006193666A (ja) * 2005-01-14 2006-07-27 Sumitomo Bakelite Co Ltd 半導体用接着フィルム、半導体用接着フィルム付きキャリア材料および半導体装置
US20060235137A1 (en) * 2005-04-18 2006-10-19 Eunsook Chae Die attach adhesives with improved stress performance
CN101267949A (zh) * 2005-09-21 2008-09-17 陶氏康宁公司 使用有机基硼烷胺络合物的环境平版印刷方法
US8043534B2 (en) * 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
DE602006001393D1 (de) * 2006-03-06 2008-07-17 Umicore Ag & Co Kg Zusammensetzung zur Befestigung von Hochleistungshalbleiter
WO2008092168A2 (en) * 2007-01-26 2008-07-31 Designer Molecules, Inc. Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
US8063161B2 (en) * 2007-04-16 2011-11-22 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US8637611B2 (en) 2008-08-13 2014-01-28 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US8158748B2 (en) 2008-08-13 2012-04-17 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
GB201102035D0 (en) * 2011-02-04 2011-03-23 Zephyros Inc Improvements in or relating to extrusion
JP6070699B2 (ja) * 2012-04-27 2017-02-01 旭硝子株式会社 蓄電デバイス用バインダー
KR102058113B1 (ko) * 2015-11-23 2019-12-23 주식회사 엘지화학 접착력이 개선된 리튬 이차전지용 전극 및 이의 제조방법

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GB2116082A (en) * 1982-02-26 1983-09-21 Gen Electric Inserts for cutting tools
US4486582A (en) 1983-01-27 1984-12-04 The Dow Chemical Company Reactive monomers and thermosettable compositions containing same
CA1229196A (en) * 1983-07-18 1987-11-10 General Electric Company Polyimide molding compositions
US4732956A (en) 1984-06-18 1988-03-22 Loctite (Ireland) Ltd. Styryloxy resins and compositions thereof
US4543397A (en) 1984-06-18 1985-09-24 Loctite (Ireland) Ltd. Styryloxy resins and compositions thereof
US4640849A (en) 1986-01-31 1987-02-03 Loctite (Ireland) Limited Meta-bridged styryloxy resins
US4751273A (en) 1986-08-19 1988-06-14 Allied-Signal, Inc. Vinyl ether terminated urethane resins
US4749807A (en) 1987-02-17 1988-06-07 Allied-Signal Inc. Vinyl ether terminated ester oligomers
US4775732A (en) * 1988-01-11 1988-10-04 Allied-Signal Inc. Vinyl ether terminated ester and urethane resins from bis(hydroxyalkyl)cycloalkanes
US5334456A (en) 1988-08-12 1994-08-02 Stamicarbon B.V. Free-radical curable compositions
AU4432789A (en) 1988-11-10 1990-05-17 Loctite (Ireland) Limited Polymerisable styryloxy resins and compositions thereof
US5183946A (en) 1989-02-08 1993-02-02 Isp Investments Inc. Vinyloxy hydroxyalkylcycloalkane and preparation therefor
US5084490A (en) 1990-12-10 1992-01-28 Loctite (Ireland) Limited Styryloxy compounds and polymers thereof
WO1994025508A1 (en) 1993-05-03 1994-11-10 Loctite Corporation Polymer dispersed liquid crystals in electron-rich alkene-thiol polymers
EP0638547B1 (de) 1993-08-09 2000-08-16 Ciba SC Holding AG Neue urethangruppenhaltige (Meth)Acrylate
US6034194A (en) 1994-09-02 2000-03-07 Quantum Materials/Dexter Corporation Bismaleimide-divinyl adhesive compositions and uses therefor
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US5491178A (en) 1994-07-13 1996-02-13 Alliedsignal Inc. Hydrogen stabilizers for vinyl ether-based coating systems
US5514727A (en) 1994-07-13 1996-05-07 Alliedsignal Inc. Stabilizers for vinyl ether-based coating systems
US5789757A (en) 1996-09-10 1998-08-04 The Dexter Corporation Malemide containing formulations and uses therefor
WO2000000808A2 (en) 1998-06-09 2000-01-06 California Institute Of Technology Colloidal particles used in sensing arrays
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US6121358A (en) 1997-09-22 2000-09-19 The Dexter Corporation Hydrophobic vinyl monomers, formulations containing same, and uses therefor
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US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
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Also Published As

Publication number Publication date
HK1042316A1 (en) 2002-08-09
KR100789332B1 (ko) 2007-12-28
CN1324908A (zh) 2001-12-05
US20020032260A1 (en) 2002-03-14
SG95650A1 (en) 2003-04-23
KR20010106259A (ko) 2001-11-29
DE60109356D1 (de) 2005-04-21
EP1156068A1 (de) 2001-11-21
TWI301491B (en) 2008-10-01
US20020032257A1 (en) 2002-03-14
JP2002047475A (ja) 2002-02-12
EP1156068B1 (de) 2005-03-16
CA2347872A1 (en) 2001-11-18
US6699929B2 (en) 2004-03-02
CN1180044C (zh) 2004-12-15
DE60109356T2 (de) 2005-07-28

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