ATE291829T1 - Gerät für elektromagnetische abschirmung - Google Patents

Gerät für elektromagnetische abschirmung

Info

Publication number
ATE291829T1
ATE291829T1 AT99966213T AT99966213T ATE291829T1 AT E291829 T1 ATE291829 T1 AT E291829T1 AT 99966213 T AT99966213 T AT 99966213T AT 99966213 T AT99966213 T AT 99966213T AT E291829 T1 ATE291829 T1 AT E291829T1
Authority
AT
Austria
Prior art keywords
electromagnetic shielding
shielding device
areas
conductive
gasket
Prior art date
Application number
AT99966213T
Other languages
English (en)
Inventor
Robert C Benn Jr
Original Assignee
Vanguard Products Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vanguard Products Corp filed Critical Vanguard Products Corp
Application granted granted Critical
Publication of ATE291829T1 publication Critical patent/ATE291829T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Surgical Instruments (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
AT99966213T 1998-12-15 1999-12-14 Gerät für elektromagnetische abschirmung ATE291829T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11233398P 1998-12-15 1998-12-15
PCT/US1999/029636 WO2000036895A2 (en) 1998-12-15 1999-12-14 Electromagnetic interference shielding device

Publications (1)

Publication Number Publication Date
ATE291829T1 true ATE291829T1 (de) 2005-04-15

Family

ID=22343339

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99966213T ATE291829T1 (de) 1998-12-15 1999-12-14 Gerät für elektromagnetische abschirmung

Country Status (9)

Country Link
US (1) US6410846B1 (de)
EP (1) EP1145611B1 (de)
JP (1) JP4176310B2 (de)
CN (1) CN101427618B (de)
AT (1) ATE291829T1 (de)
AU (1) AU2181300A (de)
DE (1) DE69924410T2 (de)
HK (1) HK1042813B (de)
WO (1) WO2000036895A2 (de)

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US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US20090226696A1 (en) * 2008-02-06 2009-09-10 World Properties, Inc. Conductive Polymer Foams, Method of Manufacture, And Uses Thereof
US7815998B2 (en) * 2007-02-06 2010-10-19 World Properties, Inc. Conductive polymer foams, method of manufacture, and uses thereof
US8623265B2 (en) * 2007-02-06 2014-01-07 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
EP2073619B1 (de) 2007-06-11 2011-08-17 Fuji Polymer Industries Co., Ltd. Leitfähige integral-metall-gummi-komponente
DK2325948T3 (da) * 2008-09-16 2013-06-03 Fuji Polymer Ind Elektroledende gummikomponent, fremgangsmåde til at bruge den og bærbar telefon omfattende den
KR101339697B1 (ko) * 2009-03-06 2013-12-11 생-고뱅 퍼포먼스 플라스틱스 코포레이션 직선 운동 전기 커넥터 어셈블리
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US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
RU2504933C2 (ru) * 2009-10-02 2014-01-20 Сэнт-Гобен Перформанс Пластикс Корпорейшн Уплотнение, содержащая его система и способ изготовления уплотнения
JP2013515840A (ja) * 2009-12-29 2013-05-09 ロジャース コーポレーション 導電性ポリマーフォーム、その製造方法および使用
US20110255850A1 (en) * 2010-04-19 2011-10-20 Richard Hung Minh Dinh Electronic subassemblies for electronic devices
KR101033193B1 (ko) 2010-10-14 2011-05-06 주식회사 이노칩테크놀로지 전자파 차폐 가스켓
JP5060647B1 (ja) * 2011-09-14 2012-10-31 三菱航空機株式会社 航空機の窓、開口部の閉塞体、ガスケットシール
US9888562B2 (en) * 2012-12-24 2018-02-06 Apple Inc. Electromagnetic interference shielding and strain relief structures for coupled printed circuits
CN104847894A (zh) * 2014-07-15 2015-08-19 北汽福田汽车股份有限公司 一种平面密封方法
JP6574024B1 (ja) * 2018-06-07 2019-09-11 レノボ・シンガポール・プライベート・リミテッド 電子機器
WO2021034768A1 (en) * 2019-08-16 2021-02-25 Emseal Joint Systems Ltd. Expansion joint sealing system having shielding properties
CN118858717A (zh) * 2024-07-03 2024-10-29 四川中威能电力科技有限公司 具有抗干扰模块的智能电表及方法

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Also Published As

Publication number Publication date
HK1042813A1 (en) 2002-08-23
CN101427618B (zh) 2011-04-20
EP1145611A2 (de) 2001-10-17
AU2181300A (en) 2000-07-03
CN101427618A (zh) 2009-05-06
DE69924410D1 (de) 2005-04-28
US6410846B1 (en) 2002-06-25
JP2003510797A (ja) 2003-03-18
WO2000036895A2 (en) 2000-06-22
HK1129800A1 (en) 2009-12-04
HK1042813B (en) 2006-01-27
DE69924410T2 (de) 2006-03-23
JP4176310B2 (ja) 2008-11-05
WO2000036895A3 (en) 2002-09-19
EP1145611A3 (de) 2002-11-06
EP1145611B1 (de) 2005-03-23

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Legal Events

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