ATE292159T1 - Härter für epoxidharze, epoxidharzzusammensetzung und verfahren zur herstellung von silanmodifizierten phenolischen harzen - Google Patents

Härter für epoxidharze, epoxidharzzusammensetzung und verfahren zur herstellung von silanmodifizierten phenolischen harzen

Info

Publication number
ATE292159T1
ATE292159T1 AT00901954T AT00901954T ATE292159T1 AT E292159 T1 ATE292159 T1 AT E292159T1 AT 00901954 T AT00901954 T AT 00901954T AT 00901954 T AT00901954 T AT 00901954T AT E292159 T1 ATE292159 T1 AT E292159T1
Authority
AT
Austria
Prior art keywords
epoxy resin
resins
epoxy
resin composition
hardeners
Prior art date
Application number
AT00901954T
Other languages
English (en)
Inventor
Hideki Goda
Shoji Takeda
Original Assignee
Arakawa Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP34809699A external-priority patent/JP3395744B2/ja
Priority claimed from JP34965899A external-priority patent/JP3710346B2/ja
Application filed by Arakawa Chem Ind filed Critical Arakawa Chem Ind
Application granted granted Critical
Publication of ATE292159T1 publication Critical patent/ATE292159T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT00901954T 1999-01-29 2000-01-27 Härter für epoxidharze, epoxidharzzusammensetzung und verfahren zur herstellung von silanmodifizierten phenolischen harzen ATE292159T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2095499 1999-01-29
JP11463599 1999-04-22
JP34809699A JP3395744B2 (ja) 1999-01-29 1999-12-07 エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
JP34965899A JP3710346B2 (ja) 1999-04-22 1999-12-09 メトキシ基含有シラン変性フェノール樹脂の製造方法
PCT/JP2000/000440 WO2000044806A1 (en) 1999-01-29 2000-01-27 Hardener for epoxy resin, epoxy resin composition, and process for producing silane-modified phenolic resin

Publications (1)

Publication Number Publication Date
ATE292159T1 true ATE292159T1 (de) 2005-04-15

Family

ID=27457485

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00901954T ATE292159T1 (de) 1999-01-29 2000-01-27 Härter für epoxidharze, epoxidharzzusammensetzung und verfahren zur herstellung von silanmodifizierten phenolischen harzen

Country Status (9)

Country Link
US (1) US6441106B1 (de)
EP (1) EP1086972B1 (de)
KR (1) KR100591698B1 (de)
CN (1) CN1155641C (de)
AT (1) ATE292159T1 (de)
DE (1) DE60019046T2 (de)
ES (1) ES2238986T3 (de)
TW (1) TW490472B (de)
WO (1) WO2000044806A1 (de)

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CN1202154C (zh) * 1999-07-15 2005-05-18 荒川化学工业株式会社 含缩水甘油醚基团的烷氧基硅烷氧基硅烷的部分微合物与硅烷改性树脂的组合物及其制备方法
KR100718854B1 (ko) * 2002-05-24 2007-05-16 가부시키가이샤 닛폰 쇼쿠바이 난연성 수지 조성물, 이의 제조 방법, 및 난연성 수지조성물을 함유하는 성형품 및 실리카
US6875807B2 (en) * 2003-05-28 2005-04-05 Indspec Chemical Corporation Silane-modified phenolic resins and applications thereof
SG119379A1 (en) * 2004-08-06 2006-02-28 Nippon Catalytic Chem Ind Resin composition method of its composition and cured formulation
WO2006040336A1 (en) * 2004-10-13 2006-04-20 Luca Prezzi Polymeric compositions with modified siloxane networks, corresponding production and uses thereof
CN101124233B (zh) * 2005-02-18 2012-12-05 日立化成工业株式会社 新型固化性树脂及其制造方法、及环氧树脂组合物、电子部件装置
JP5207591B2 (ja) * 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP4967485B2 (ja) * 2006-06-12 2012-07-04 荒川化学工業株式会社 接着剤組成物および透明積層体
DE102008055042A1 (de) 2008-12-19 2010-06-24 Hüttenes-Albertus Chemische Werke GmbH Modifizierte Phenolharze
FR2943068B1 (fr) 2009-03-13 2011-04-15 Markem Imaje Composition d'encre pour l'impression par jet continu devie notamment sur verre humide
KR101252063B1 (ko) 2011-08-25 2013-04-12 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물과 경화물 및 이의 용도
WO2013066078A1 (ko) 2011-11-01 2013-05-10 한국생산기술연구원 알콕시실릴기를 갖는 이소시아누레이트 에폭시 화합물, 이의 제조 방법 및 이를 포함하는 조성물과 경화물 및 이의 용도
EP2826777B1 (de) 2012-03-14 2020-08-05 Korea Institute of Industrial Technology Epoxidverbindung mit alkoxysilylgruppe, diese enthaltende zusammensetzung, gehärtetes produkt, dessen verwendung sowie verfahren zur herstellung einer epoxyverbindung mit einer alkoxysilylgruppe
US10689482B2 (en) 2012-04-02 2020-06-23 Korea Institute Of Industrial Technology Epoxy compound having alkoxysilyl group, composition and hardened material comprising same, use for same, and production method for epoxy compound having alkoxysilyl group
KR101863111B1 (ko) * 2012-07-06 2018-06-01 한국생산기술연구원 노볼락계 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도
WO2015105379A1 (ko) * 2014-01-09 2015-07-16 한국생산기술연구원 알콕시실릴기를 갖는 새로운 노볼락 경화제, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도
KR101664948B1 (ko) * 2014-01-09 2016-10-13 한국생산기술연구원 알콕시실릴기를 갖는 새로운 노볼락 경화제, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도
KR101992003B1 (ko) * 2016-12-15 2019-06-21 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치
KR102018361B1 (ko) * 2016-12-28 2019-09-04 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치
ES2971873T3 (es) 2017-04-10 2024-06-10 Continental Reifen Deutschland Gmbh Resina funcionalizada que tiene un conector polar
EP3609936B1 (de) 2017-04-10 2023-10-11 Continental Reifen Deutschland GmbH Funktionalisiertes harz mit einem polarlinker
US10815320B2 (en) 2017-04-10 2020-10-27 Eastman Chemical Company Functionalized resin having a polar linker
SG11202101938QA (en) 2018-09-27 2021-04-29 Basf Se Epoxy resin composition
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체

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US4022753A (en) * 1974-03-25 1977-05-10 Ciba-Geigy Corporation Reaction products of polysiloxanes and polyphenols
DE2900185A1 (de) * 1979-01-04 1980-07-17 Bayer Ag Siloxanmodifizierte novolake, deren herstellung und verwendung zur herstellung von reibbelaegen
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JPH0386716A (ja) 1989-08-31 1991-04-11 Toray Dow Corning Silicone Co Ltd シリコーン樹脂で変性されたフェノール樹脂の製造方法
JPH0794533B2 (ja) * 1989-09-29 1995-10-11 日東電工株式会社 半導体装置
JP2506220B2 (ja) * 1990-06-19 1996-06-12 日東電工株式会社 半導体装置
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US5306748A (en) * 1991-07-31 1994-04-26 Shin-Etsu Chemical Co., Ltd. Fluorine-modified thermosetting resin and thermosetting resin composition
JPH0794534A (ja) * 1993-09-24 1995-04-07 Sony Corp ダイボンディング方法とダイボンディング装置
US5736619A (en) * 1995-04-21 1998-04-07 Ameron International Corporation Phenolic resin compositions with improved impact resistance
JP3479818B2 (ja) * 1995-08-31 2003-12-15 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JPH09216939A (ja) 1996-02-09 1997-08-19 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP3174745B2 (ja) 1997-06-17 2001-06-11 住友大阪セメント株式会社 低自己収縮性セメント系材料およびセメント硬化体の自己収縮低減方法

Also Published As

Publication number Publication date
KR20010071125A (ko) 2001-07-28
US6441106B1 (en) 2002-08-27
EP1086972A1 (de) 2001-03-28
TW490472B (en) 2002-06-11
WO2000044806A1 (en) 2000-08-03
ES2238986T3 (es) 2005-09-16
CN1155641C (zh) 2004-06-30
DE60019046D1 (de) 2005-05-04
CN1293685A (zh) 2001-05-02
EP1086972A4 (de) 2001-07-11
KR100591698B1 (ko) 2006-06-20
DE60019046T2 (de) 2006-02-02
EP1086972B1 (de) 2005-03-30

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