ATE308800T1 - Verfahren und vorrichtung zum bonden und debonden von systemwafern auf trägerwafern - Google Patents

Verfahren und vorrichtung zum bonden und debonden von systemwafern auf trägerwafern

Info

Publication number
ATE308800T1
ATE308800T1 AT02014551T AT02014551T ATE308800T1 AT E308800 T1 ATE308800 T1 AT E308800T1 AT 02014551 T AT02014551 T AT 02014551T AT 02014551 T AT02014551 T AT 02014551T AT E308800 T1 ATE308800 T1 AT E308800T1
Authority
AT
Austria
Prior art keywords
wafers
bonding
debonding
carried out
carrier
Prior art date
Application number
AT02014551T
Other languages
German (de)
English (en)
Inventor
Oliver Hellmund
Koblinski Carsten Dr Von
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Application granted granted Critical
Publication of ATE308800T1 publication Critical patent/ATE308800T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT02014551T 2001-08-29 2002-07-01 Verfahren und vorrichtung zum bonden und debonden von systemwafern auf trägerwafern ATE308800T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10142073A DE10142073C1 (de) 2001-08-29 2001-08-29 Verfahren und Vorrichtung zum Verbinden und Trennen von Systemwafern und Trägerwafern

Publications (1)

Publication Number Publication Date
ATE308800T1 true ATE308800T1 (de) 2005-11-15

Family

ID=7696832

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02014551T ATE308800T1 (de) 2001-08-29 2002-07-01 Verfahren und vorrichtung zum bonden und debonden von systemwafern auf trägerwafern

Country Status (3)

Country Link
EP (1) EP1289007B1 (fr)
AT (1) ATE308800T1 (fr)
DE (1) DE10142073C1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105855213A (zh) * 2016-03-31 2016-08-17 苏州晶樱光电科技有限公司 硅晶片脱胶工艺
CN107342241B (zh) * 2016-04-29 2021-04-09 上海微电子装备（集团）股份有限公司 一种解键合装置和方法
CN106783699A (zh) * 2017-03-03 2017-05-31 爱立发自动化设备（上海）有限公司 一种晶圆与玻璃分离装置及方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5395788A (en) * 1991-03-15 1995-03-07 Shin Etsu Handotai Co., Ltd. Method of producing semiconductor substrate
US5300175A (en) * 1993-01-04 1994-04-05 Motorola, Inc. Method for mounting a wafer to a submount
US5500540A (en) * 1994-04-15 1996-03-19 Photonics Research Incorporated Wafer scale optoelectronic package
US5654226A (en) * 1994-09-07 1997-08-05 Harris Corporation Wafer bonding for power devices
DE4433343C2 (de) * 1994-09-19 1998-01-22 Suess Kg Karl Verfahren und Vorrichtung zum Ausrichten und Verbinden von mehreren, zueinander ausgerichteten, übereinander angeordneten Scheiben
JPH09115788A (ja) * 1995-09-29 1997-05-02 Samsung Electron Co Ltd 半導体ウェーハ接合装置
JP3720515B2 (ja) * 1997-03-13 2005-11-30 キヤノン株式会社 基板処理装置及びその方法並びに基板の製造方法

Also Published As

Publication number Publication date
DE10142073C1 (de) 2003-06-12
EP1289007A3 (fr) 2004-12-15
EP1289007B1 (fr) 2005-11-02
EP1289007A2 (fr) 2003-03-05

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee