ATE308870T1 - Mit führungen zur gleichmässigen führung von luftströmen versehene kühlvorrichtung für eine elektronische anlage - Google Patents

Mit führungen zur gleichmässigen führung von luftströmen versehene kühlvorrichtung für eine elektronische anlage

Info

Publication number
ATE308870T1
ATE308870T1 AT99114761T AT99114761T ATE308870T1 AT E308870 T1 ATE308870 T1 AT E308870T1 AT 99114761 T AT99114761 T AT 99114761T AT 99114761 T AT99114761 T AT 99114761T AT E308870 T1 ATE308870 T1 AT E308870T1
Authority
AT
Austria
Prior art keywords
circuit boards
inlet
guides
cooling device
device provided
Prior art date
Application number
AT99114761T
Other languages
English (en)
Inventor
Minoru Yoshikawa
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Application granted granted Critical
Publication of ATE308870T1 publication Critical patent/ATE308870T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Aerials (AREA)
  • Air Conditioning Control Device (AREA)
  • Flow Control (AREA)
AT99114761T 1998-07-28 1999-07-28 Mit führungen zur gleichmässigen führung von luftströmen versehene kühlvorrichtung für eine elektronische anlage ATE308870T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21307998A JP3408424B2 (ja) 1998-07-28 1998-07-28 電子機器の冷却構造

Publications (1)

Publication Number Publication Date
ATE308870T1 true ATE308870T1 (de) 2005-11-15

Family

ID=16633207

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99114761T ATE308870T1 (de) 1998-07-28 1999-07-28 Mit führungen zur gleichmässigen führung von luftströmen versehene kühlvorrichtung für eine elektronische anlage

Country Status (7)

Country Link
US (1) US6222729B1 (de)
EP (1) EP0977473B1 (de)
JP (1) JP3408424B2 (de)
AT (1) ATE308870T1 (de)
CA (1) CA2278901C (de)
DE (1) DE69928049T2 (de)
DK (1) DK0977473T3 (de)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10003247B4 (de) * 1999-01-29 2005-02-24 Sanyo Electric Co., Ltd., Moriguchi Stromquelle, versehen mit wiederaufladbaren Batterien
EP1258182A4 (de) 2000-02-18 2008-12-17 Rtkl Associates Inc Wärmeabführeinrichtung für computergestelle
US6574970B2 (en) 2000-02-18 2003-06-10 Toc Technology, Llc Computer room air flow method and apparatus
US6412292B2 (en) 2000-05-09 2002-07-02 Toc Technology, Llc Computer rack heat extraction device
US6557357B2 (en) 2000-02-18 2003-05-06 Toc Technology, Llc Computer rack heat extraction device
GB2369249B (en) * 2000-11-06 2004-06-09 3Com Corp Cooling apparatus including a flow guide
US6504717B1 (en) * 2001-06-15 2003-01-07 Cereva Networks. Inc. Failure-tolerant high-density card rack cooling system and method
US6668565B1 (en) 2002-04-12 2003-12-30 American Power Conversion Rack-mounted equipment cooling
JP3815559B2 (ja) 2002-10-04 2006-08-30 ヤマハ株式会社 電子装置
US7752858B2 (en) 2002-11-25 2010-07-13 American Power Conversion Corporation Exhaust air removal system
US6807057B2 (en) * 2003-01-22 2004-10-19 Hewlett-Packard Development Company, L.P. Apparatus and method for cooling an electronic device
US7046514B2 (en) * 2003-03-19 2006-05-16 American Power Conversion Corporation Data center cooling
US6859366B2 (en) * 2003-03-19 2005-02-22 American Power Conversion Data center cooling system
US7033267B2 (en) * 2003-05-13 2006-04-25 American Power Conversion Corporation Rack enclosure
US7112131B2 (en) * 2003-05-13 2006-09-26 American Power Conversion Corporation Rack enclosure
US7085133B2 (en) * 2003-07-09 2006-08-01 International Business Machines Corporation Cooling using complimentary tapered plenums
US7173817B2 (en) * 2003-09-29 2007-02-06 Intel Corporation Front side hot-swap chassis management module
US20050068731A1 (en) * 2003-09-29 2005-03-31 Wen Wei Hot-swap fan module configuration
US7184267B2 (en) * 2003-12-12 2007-02-27 Hewlett-Packard Development Company, Lp. Longitudinally cooled electronic assembly
US7295444B1 (en) * 2003-12-31 2007-11-13 Ncr Corporation Delivering chilled air to components in a hardware cabinet
US20050157472A1 (en) * 2004-01-15 2005-07-21 Hewlett-Packard Development Company, L.P. Slot filler with capability to control electronic cooling air recirculation
US6927976B1 (en) * 2004-01-15 2005-08-09 Hewlett-Packard Development Company, L.P. Air baffle for managing cooling air re-circulation in an electronic system
US7361081B2 (en) * 2004-07-23 2008-04-22 Hewlett-Packard Development Company, L.P. Small form factor air jet cooling system
US7345873B2 (en) * 2004-09-29 2008-03-18 General Electric Company System and method for cooling electronic systems
US7259963B2 (en) * 2004-12-29 2007-08-21 American Power Conversion Corp. Rack height cooling
US7589978B1 (en) * 2005-04-27 2009-09-15 Flextronics Ap, Llc Air inlet diffuser
US7841199B2 (en) * 2005-05-17 2010-11-30 American Power Conversion Corporation Cold aisle isolation
US11259446B2 (en) 2005-09-19 2022-02-22 Chatsworth Products, Inc. Vertical exhaust duct for electronic equipment enclosure
US7804685B2 (en) 2005-09-19 2010-09-28 Chatsworth Products, Inc. Ducted exhaust equipment enclosure
US7542287B2 (en) 2005-09-19 2009-06-02 Chatsworth Products, Inc. Air diverter for directing air upwardly in an equipment enclosure
US11212928B2 (en) 2005-09-19 2021-12-28 Chatsworth Products, Inc. Vertical exhaust duct for electronic equipment enclosure
US8107238B2 (en) 2005-09-19 2012-01-31 Chatsworth Products, Inc. Ducted exhaust equipment enclosure
JP4499647B2 (ja) 2005-10-07 2010-07-07 富士通株式会社 電子機器
US7307840B2 (en) * 2005-10-14 2007-12-11 Smiths Aerospace Llc Cross-flow redundant air cooling method for high reliability electronics
US20070171610A1 (en) * 2006-01-20 2007-07-26 Chatsworth Products, Inc. Internal air duct
US8257155B2 (en) * 2006-01-20 2012-09-04 Chatsworth Products, Inc. Selectively routing air within an electronic equipment enclosure
US7862410B2 (en) * 2006-01-20 2011-01-04 American Power Conversion Corporation Air removal unit
US7681410B1 (en) 2006-02-14 2010-03-23 American Power Conversion Corporation Ice thermal storage
US7509402B2 (en) * 2006-03-16 2009-03-24 Exceptional Innovation, Llc Automation control system having a configuration tool and two-way ethernet communication for web service messaging, discovery, description, and eventing that is controllable with a touch-screen display
US8725845B2 (en) * 2006-03-16 2014-05-13 Exceptional Innovation Llc Automation control system having a configuration tool
US8155142B2 (en) * 2006-03-16 2012-04-10 Exceptional Innovation Llc Network based digital access point device
US7587464B2 (en) * 2006-03-16 2009-09-08 Exceptional Innovation, Llc Device automation using networked device control having a web services for devices stack
US8209398B2 (en) * 2006-03-16 2012-06-26 Exceptional Innovation Llc Internet protocol based media streaming solution
US7496627B2 (en) 2006-03-16 2009-02-24 Exceptional Innovation, Llc Automation control system having digital logging
US8001219B2 (en) * 2006-03-16 2011-08-16 Exceptional Innovation, Llc User control interface for convergence and automation system
US7966083B2 (en) * 2006-03-16 2011-06-21 Exceptional Innovation Llc Automation control system having device scripting
WO2007126781A2 (en) * 2006-03-27 2007-11-08 Exceptional Innovation Llc Set top box for convergence and automation system
US7355850B2 (en) * 2006-03-31 2008-04-08 National Instruments Corporation Vented and ducted sub-rack support member
JP3947553B1 (ja) * 2006-03-31 2007-07-25 株式会社日立コミュニケーションテクノロジー 電子装置
WO2007124453A2 (en) * 2006-04-20 2007-11-01 Exceptional Innovation Llc Touch screen for convergence and automation system
WO2008011218A2 (en) * 2006-05-19 2008-01-24 Exceptional Innovation. Llc Air-cooling system configuration for touch screen
US7667968B2 (en) * 2006-05-19 2010-02-23 Exceptional Innovation, Llc Air-cooling system configuration for touch screen
US7595985B2 (en) * 2006-06-19 2009-09-29 Panduit Corp. Network cabinet with thermal air flow management
US7394654B2 (en) * 2006-10-19 2008-07-01 Cisco Technology, Inc. Method and apparatus for providing thermal management in an electronic device
US7962130B2 (en) * 2006-11-09 2011-06-14 Exceptional Innovation Portable device for convergence and automation solution
FR2910227A1 (fr) * 2006-12-18 2008-06-20 Sagem Defense Securite Dispositif a composants electroniques integres muni d'une cloison de separation de zones ventilees
JP5030631B2 (ja) * 2007-03-22 2012-09-19 富士通株式会社 情報機器の冷却システム
US20080278912A1 (en) * 2007-05-09 2008-11-13 Dean Zavadsky Thermal management systems and methods for electronic components in a sealed enclosure
JP5559040B2 (ja) 2007-05-15 2014-07-23 シュナイダー エレクトリック アイティー コーポレーション 設備の電力及び冷却を管理するための方法及びシステム
US20090061755A1 (en) * 2007-08-28 2009-03-05 Panduit Corp. Intake Duct
US9723760B2 (en) 2007-11-13 2017-08-01 International Business Machines Corporation Water-assisted air cooling for a row of cabinets
US10133320B2 (en) 2008-02-14 2018-11-20 Chatsworth Products, Inc. Air directing device
WO2009129414A1 (en) * 2008-04-16 2009-10-22 Perazzo Thomas M Active door array for cooling system
JP4607203B2 (ja) 2008-04-28 2011-01-05 株式会社日立製作所 ディスクアレイ装置
US20090277622A1 (en) * 2008-05-09 2009-11-12 Degree Controls, Inc. Air flow controller for electrical equipment holder
WO2010007821A1 (ja) * 2008-07-17 2010-01-21 日本電気株式会社 電子装置及び画像表示装置、ならびに電子装置の冷却方法
JP5164706B2 (ja) * 2008-07-17 2013-03-21 オリンパスメディカルシステムズ株式会社 装置内冷却構造、及び超音波観測装置
TWM346803U (en) * 2008-08-06 2008-12-11 Kun-Ta Lee Environmental test apparatus
US20100159816A1 (en) * 2008-12-23 2010-06-24 International Business Machines Corporation Converging segments cooling
EP2205054A1 (de) * 2009-01-05 2010-07-07 Chatsworth Product, INC. Gehäuse für elektronisches Gerät mit System zur Steuerung des Luftstroms von einer Seite zur anderen Seite
CN101848625B (zh) * 2009-03-26 2014-08-20 鸿富锦精密工业（深圳）有限公司 能对电子设备进行散热的电子装置及其散热系统
US20110081851A1 (en) * 2009-10-05 2011-04-07 Franz John P Flow control system and method
US20110228475A1 (en) * 2010-03-17 2011-09-22 International Business Machines Corporation Enclosure with concurrently maintainable field replaceable units
US8845403B2 (en) 2010-05-18 2014-09-30 International Business Machines Corporation Individually cooling one or more computers in a rack of computers in a data center
US8653363B2 (en) 2010-06-01 2014-02-18 Chatsworth Products, Inc. Magnetic filler panel for use in airflow control system in electronic equipment enclosure
US8233274B2 (en) 2010-07-21 2012-07-31 International Business Machines Corporation Computer chassis cooling sidecar
US8626346B2 (en) 2010-08-06 2014-01-07 International Business Machines Corporation Dynamically adjustable floor tile for a data center
US8270161B2 (en) 2010-08-06 2012-09-18 International Business Machines Corporation Hot or cold aisle computer chassis
US8812275B2 (en) 2010-09-18 2014-08-19 International Business Machines Corporation Modeling movement of air under a floor of a data center
JP2012085835A (ja) * 2010-10-20 2012-05-10 Panasonic Corp 洗濯機の制御装置
US9313927B2 (en) 2010-11-08 2016-04-12 Chatsworth Products, Inc. Header panel assembly for preventing air circulation above electronic equipment enclosure
US9585266B2 (en) 2010-11-08 2017-02-28 Chatsworth Products, Inc. Header panel assembly for preventing air circulation above electronic equipment enclosure
US9955616B2 (en) 2010-11-08 2018-04-24 Chatsworth Products, Inc. Header panel assembly for preventing air circulation above electronic equipment enclosure
US9655259B2 (en) 2011-12-09 2017-05-16 Chatsworth Products, Inc. Data processing equipment structure
US8641492B2 (en) * 2010-12-27 2014-02-04 Gary Meyer Directional flow raised floor air-grate
US8800455B2 (en) 2011-03-21 2014-08-12 Dana Monroe Audio mixing console case
KR101831761B1 (ko) * 2011-09-23 2018-02-26 삼성전자 주식회사 반도체 모듈 및 반도체 모듈을 포함하는 모듈 시스템
CN103135718A (zh) * 2011-12-03 2013-06-05 鸿富锦精密工业（深圳）有限公司 散热系统
AU2011384046A1 (en) 2011-12-22 2014-07-17 Schneider Electric It Corporation Analysis of effect of transient events on temperature in a data center
US9839155B2 (en) 2012-05-16 2017-12-05 Panduit Corp. Thermal ducting system
JP5659373B2 (ja) * 2013-05-09 2015-01-28 日本電信電話株式会社 気流制御板
JP6168908B2 (ja) * 2013-08-12 2017-07-26 株式会社東芝 発熱体収容装置
US10028414B2 (en) * 2014-06-24 2018-07-17 Vertiv Energy Systems, Inc. Passive cooling features for electronics equipment cabinets
US9497891B2 (en) * 2014-09-22 2016-11-15 Dell Products, L.P. Embedded chassis ducting system for parallelizing airflow through components oriented in series
US9871358B2 (en) * 2015-01-30 2018-01-16 Abb Schweiz Ag Electrical switchgear system
US10403328B2 (en) * 2016-01-29 2019-09-03 Western Digital Technologies, Inc. Acoustic attenuation in data storage enclosures
WO2017175568A1 (ja) * 2016-04-04 2017-10-12 オリンパス株式会社 内視鏡装置
US10453436B2 (en) * 2017-01-09 2019-10-22 Quanta Computer Inc. Anti-acoustics streamline apparatus
KR102141429B1 (ko) * 2017-08-25 2020-08-05 주식회사 어니언소프트웨어 전산 랙용 공기 배출 가이드 구조 및 이를 갖는 전산랙 어셈블리
CN107765795A (zh) 2017-11-08 2018-03-06 北京图森未来科技有限公司 一种计算机服务器
CN110602864A (zh) * 2018-06-13 2019-12-20 Oppo广东移动通信有限公司 电路板组件和具有其的电子设备
US10732681B2 (en) 2018-07-26 2020-08-04 Microsoft Technology Licensing, Llc Adaptive airflow guides in an electronic device
CN111381646A (zh) * 2018-12-29 2020-07-07 北京图森智途科技有限公司 用于车载服务器的散热系统、车载服务器及自动驾驶汽车
US10772188B1 (en) * 2019-06-11 2020-09-08 International Business Machines Corporation Stiffener cooling structure
LV15761A (lv) * 2021-12-30 2023-07-20 Rīgas Tehniskā Universitāte Energotaupīga datu apstrādes centra ventilācijas un dzesēšanas sistēma
CN118870763B (zh) * 2024-09-14 2025-09-23 杭州医维之星医疗技术有限公司 一种侧进风集成式机柜及其温度调节方法
CN119468575A (zh) * 2024-11-14 2025-02-18 浙江丰熙食品有限公司 一种小笼包蒸制后降温速冻设备

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2635445C3 (de) 1976-08-06 1979-07-12 Zweites Deutsches Fernsehen, Anstalt Des Oeffentlichen Rechts, 6500 Mainz Vorrichtung zur Wärmeabführung aus Geräten
JPS6011830B2 (ja) * 1977-05-24 1985-03-28 日本電気株式会社 電子部品の冷却装置
US4894749A (en) * 1987-08-31 1990-01-16 AT&T Information Systems Inc American Telephone and Telegraph Company Option slot filler board
JPH0231191A (ja) 1988-07-20 1990-02-01 Nippon Atom Ind Group Co Ltd 燃料集合体
JPH0254998A (ja) 1988-08-20 1990-02-23 Fujitsu Ltd 空冷ファンユニット
DE3837744A1 (de) * 1988-11-07 1990-05-10 Knuerr Mechanik Ag Baugruppentraeger fuer leiterplatten mit elektronischen bauelementen
JPH02278896A (ja) 1989-04-20 1990-11-15 Nec Corp 電子機器類の冷却方式
JPH0394A (ja) 1989-05-29 1991-01-07 Nippon Kentetsu Co Ltd 洗濯機の排水切換装置
JPH03268484A (ja) 1990-03-19 1991-11-29 Fujitsu Ltd 冷却ファン装置
CH680693A5 (de) * 1990-08-07 1992-10-15 Sulzer Ag
US5414591A (en) 1991-04-15 1995-05-09 Hitachi, Ltd. Magnetic disk storage system
JP3011349B2 (ja) 1992-01-27 2000-02-21 日本電信電話株式会社 電子装置の強制空冷装置
US5428503A (en) * 1992-03-24 1995-06-27 Hitachi, Ltd. Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon
JPH07202464A (ja) * 1993-12-28 1995-08-04 Toshiba Corp 電子機器装置並びに電子機器装置用冷却方法及びファン装置
JPH0832248A (ja) 1994-07-20 1996-02-02 Fujitsu General Ltd フィルタ取付装置
US5793610A (en) * 1996-01-25 1998-08-11 Dell Usa, L.P. Multi-position air regulation device
JP3496398B2 (ja) 1996-07-03 2004-02-09 株式会社明電舎 制御盤
US5762550A (en) * 1996-08-21 1998-06-09 Toshiba America Information Systems, Inc. Heat transfer system for electronic enclosures
US6011688A (en) * 1997-06-04 2000-01-04 Hewlett Packard Co. Compact apparatus for cooling a plurality of circuit packs arranged with a cage
US6005770A (en) * 1997-11-12 1999-12-21 Dell U.S.A., L.P. Computer and a system and method for cooling the interior of the computer
US5914858A (en) * 1997-11-13 1999-06-22 Northern Telecom Limited Baffle arrangement for an airflow balance system
DE29804396U1 (de) 1998-03-13 1998-05-14 Schroff Gmbh, 75334 Straubenhardt Belüftbarer Elektronikschrank
US6011689A (en) * 1998-04-27 2000-01-04 Sun Microsystems, Inc. Computer component cooling fan closure device and method thereof
JP5758686B2 (ja) 2011-04-21 2015-08-05 株式会社日本触媒 非晶質シリカ粒子

Also Published As

Publication number Publication date
EP0977473A2 (de) 2000-02-02
DE69928049D1 (de) 2005-12-08
EP0977473B1 (de) 2005-11-02
DE69928049T2 (de) 2006-07-13
EP0977473A3 (de) 2000-04-19
CA2278901C (en) 2003-03-18
CA2278901A1 (en) 2000-01-28
JP2000049482A (ja) 2000-02-18
JP3408424B2 (ja) 2003-05-19
DK0977473T3 (da) 2005-12-05
US6222729B1 (en) 2001-04-24

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