ATE309618T1 - Elektronisches kühlgerät - Google Patents
Elektronisches kühlgerätInfo
- Publication number
- ATE309618T1 ATE309618T1 AT02733589T AT02733589T ATE309618T1 AT E309618 T1 ATE309618 T1 AT E309618T1 AT 02733589 T AT02733589 T AT 02733589T AT 02733589 T AT02733589 T AT 02733589T AT E309618 T1 ATE309618 T1 AT E309618T1
- Authority
- AT
- Austria
- Prior art keywords
- cooling
- plates
- liquid
- contact surface
- cooling element
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
- B60H1/00—Heating, cooling or ventilating devices
- B60H1/00478—Air-conditioning devices using the Peltier effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL1017913A NL1017913C2 (nl) | 2001-04-24 | 2001-04-24 | Montage van Peltier elementen in een koel of warmte inrichting. |
| NL1018493A NL1018493C1 (nl) | 2001-07-09 | 2001-07-09 | Eenvoudige en goedkope elektrische airco voor voertuigen. |
| PCT/NL2002/000268 WO2002086980A1 (en) | 2001-04-24 | 2002-04-24 | Electric cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE309618T1 true ATE309618T1 (de) | 2005-11-15 |
Family
ID=26643326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02733589T ATE309618T1 (de) | 2001-04-24 | 2002-04-24 | Elektronisches kühlgerät |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7096676B2 (de) |
| EP (1) | EP1384271B1 (de) |
| JP (1) | JP2004524506A (de) |
| CN (1) | CN1228864C (de) |
| AT (1) | ATE309618T1 (de) |
| DE (1) | DE60207230T2 (de) |
| ES (1) | ES2253535T3 (de) |
| WO (1) | WO2002086980A1 (de) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003206124A1 (en) * | 2002-02-22 | 2003-09-09 | Varmaraf Ehf. | A heat transfer apparatus |
| AU2003286400A1 (en) * | 2002-12-09 | 2004-06-30 | M.T.R.E Advanced Technologies Ltd. | Thermoelectric heat pumps |
| DE102005012501A1 (de) * | 2005-03-16 | 2006-09-21 | Behr Industry Gmbh & Co. Kg | Vorrichtung zur Kühlung von elektronischen Bauteilen |
| US20080142068A1 (en) * | 2006-12-18 | 2008-06-19 | American Power Conversion Corporation | Direct Thermoelectric chiller assembly |
| DE102007016676A1 (de) * | 2007-04-04 | 2008-10-09 | Vincenz, Manuela | Halbleiterblockelement und daraus gebildetes Energieerzeugungssystem |
| EP2167887B1 (de) * | 2007-05-25 | 2021-01-13 | Gentherm Incorporated | System und verfahren für verteiltes thermoelektrisches heizen und kühlen |
| ITBS20080196A1 (it) * | 2008-11-03 | 2010-05-04 | Enrico Zaglio | Scambiatore di calore a piastre |
| JP2011002187A (ja) * | 2009-06-19 | 2011-01-06 | Keenusdesign Corp | 熱交換ファンおよび冷却装置 |
| NL2003188C2 (nl) * | 2009-07-10 | 2011-01-11 | Nilesk Group Ltd | Constructie-element. |
| JP2011035305A (ja) * | 2009-08-05 | 2011-02-17 | Toyota Industries Corp | 熱交換器 |
| US9112109B2 (en) | 2009-11-06 | 2015-08-18 | The Boeing Company | Thermoelectric generator assembly and system |
| US20110232866A1 (en) * | 2010-03-29 | 2011-09-29 | Zaffetti Mark A | Integral cold plate and honeycomb facesheet assembly |
| DE102010015321A1 (de) * | 2010-04-17 | 2011-10-20 | J. Eberspächer GmbH & Co. KG | Wärmeübertrager und Herstellungsverfahren |
| DE102010024414A1 (de) | 2010-06-19 | 2011-12-22 | Volkswagen Ag | Elektrothermisches Wandeln |
| DE102011005246A1 (de) * | 2011-03-08 | 2012-09-13 | Behr Gmbh & Co. Kg | Verfahren zur Herstellung eines thermoelektrischen Moduls |
| JP5488510B2 (ja) | 2011-03-25 | 2014-05-14 | 株式会社豊田自動織機 | 熱電変換ユニット |
| JP2012209305A (ja) * | 2011-03-29 | 2012-10-25 | Toyota Industries Corp | 熱電変換ユニットと該熱電変換ユニットの製造方法 |
| DE102012208406A1 (de) * | 2012-05-21 | 2013-11-21 | P.R. Agentur für transparente Kommunikation GmbH | Vorrichtung zum Heizen und/oder Kühlen eines Raums |
| DE102012214759B3 (de) * | 2012-08-20 | 2014-02-06 | Eberspächer Exhaust Technology GmbH & Co. KG | Wärmeübertrager |
| DE102012216042A1 (de) * | 2012-09-11 | 2014-03-13 | Friedrich Boysen Gmbh & Co. Kg | Vorrichtung zur Wandlung von Wärmeenergie in elektrische Energie |
| DE102012216041B4 (de) * | 2012-09-11 | 2024-06-06 | Friedrich Boysen Gmbh & Co. Kg | Vorrichtung zur Wandlung von Wärmeenergie in elektrische Energie |
| WO2014129886A1 (en) | 2013-02-25 | 2014-08-28 | Marcus Jozef Gertrudis Zelissen | Thermoelectric heat transferring system |
| KR101348067B1 (ko) * | 2013-04-22 | 2014-01-03 | (주)퓨리셈 | 칠러 및 그의 제조방법 |
| JP6124742B2 (ja) * | 2013-09-05 | 2017-05-10 | 三菱電機株式会社 | 半導体装置 |
| DE102014203176A1 (de) * | 2014-02-21 | 2015-09-10 | MAHLE Behr GmbH & Co. KG | Thermoelektrische Vorrichtung, insbesondere thermoelektrischer Generator oder Wärmepumpe |
| DE102014002247A1 (de) * | 2014-02-21 | 2015-08-27 | Stiebel Eltron Gmbh & Co. Kg | Aufbau eines Peltiermoduls für Warmwasserspeicher |
| KR101932052B1 (ko) * | 2014-03-14 | 2018-12-24 | 젠썸 게엠베하 | 열전 어셈블리의 열전 장치를 위한 절연체 및 커넥터 |
| DE102014208433A1 (de) * | 2014-05-06 | 2015-11-26 | MAHLE Behr GmbH & Co. KG | Thermoelektrische Vorrichtung, insbesondere für ein Kraftfahrzeug |
| JP2018522408A (ja) * | 2015-06-10 | 2018-08-09 | ジェンサーム インコーポレイテッドGentherm Incorporated | 車両バッテリのための仮圧縮性圧縮リミッタを備える熱電モジュール |
| WO2016200943A1 (en) | 2015-06-10 | 2016-12-15 | Gentherm Inc. | Vehicle battery thermoelectric device with integrated cold plate assembly and method of assembling same |
| DE102015116811B4 (de) | 2015-10-02 | 2017-04-13 | Dynamic E Flow Gmbh | Verbindungsstück |
| EP3171100B1 (de) * | 2015-11-17 | 2018-02-21 | Mahle International GmbH | Thermoelektrische temperaturregelungseinheit und temperaturregelungsvorrichtung |
| US11340005B2 (en) | 2016-07-25 | 2022-05-24 | Cold Chain Technologies, Llc | Hybrid method and system for transporting and/or storing temperature-sensitive materials |
| DE102016014686B4 (de) * | 2016-12-12 | 2018-08-02 | Gentherm Gmbh | Thermoelektrische Einrichtung, Verfahren zu seiner Herstellung, Getränkehalter für ein Fahrzeug sowie Temperier-Vorrichtung für Sitze |
| US20190189886A1 (en) * | 2017-12-15 | 2019-06-20 | Industrial Technology Research Institute | Power supplying device and heating system |
| JP2021519668A (ja) | 2018-03-22 | 2021-08-12 | クライオライフ、インコーポレイテッド | 中枢神経系局所的低体温装置および方法 |
| DE102018004928B4 (de) | 2018-06-21 | 2020-04-16 | Voss Automotive Gmbh | Thermoelektrisches Modul sowie Wärmetauschereinheit mit zumindest einem solchen thermoelektrischen Modul |
| TWI651463B (zh) * | 2018-08-03 | 2019-02-21 | 陳傳生 | 一種以半導體為致冷核心之車用空調設備 |
| US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
| CN116780940B (zh) * | 2023-07-03 | 2024-11-29 | 深圳大学 | 一种地热热伏发电模块以及地热热伏发电机 |
| US20260029173A1 (en) * | 2024-07-25 | 2026-01-29 | ACTA-TechUS, Inc. | High-efficiency thermoelectric cooling and heating systems |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1539330A1 (de) * | 1966-12-06 | 1969-11-06 | Siemens Ag | Thermoelektrische Anordnung |
| US3449172A (en) | 1967-06-09 | 1969-06-10 | Atomic Energy Commission | Thermoelectric assembly having a prepunched metal foil connector |
| FR2477780A1 (fr) * | 1980-03-07 | 1981-09-11 | Buffet Jean | Echangeurs de chaleur pour installations thermo-electriques, et installations thermo-electriques comportant de tels echangeurs |
| US4470263A (en) * | 1980-10-14 | 1984-09-11 | Kurt Lehovec | Peltier-cooled garment |
| US4476685A (en) * | 1981-05-11 | 1984-10-16 | Extracorporeal Medical Specialties, Inc. | Apparatus for heating or cooling fluids |
| US4748495A (en) | 1985-08-08 | 1988-05-31 | Dypax Systems Corporation | High density multi-chip interconnection and cooling package |
| US5028988A (en) * | 1989-12-27 | 1991-07-02 | Ncr Corporation | Method and apparatus for low temperature integrated circuit chip testing and operation |
| US5006924A (en) * | 1989-12-29 | 1991-04-09 | International Business Machines Corporation | Heat sink for utilization with high density integrated circuit substrates |
| US5032897A (en) * | 1990-02-28 | 1991-07-16 | International Business Machines Corp. | Integrated thermoelectric cooling |
| US5046552A (en) * | 1990-07-20 | 1991-09-10 | Minnesota Mining And Manufacturing | Flow-through heat transfer apparatus with movable thermal via |
| US5031689A (en) | 1990-07-31 | 1991-07-16 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flexible thermal apparatus for mounting of thermoelectric cooler |
| US5205348A (en) * | 1991-05-31 | 1993-04-27 | Minnesota Mining And Manufacturing Company | Semi-rigid heat transfer devices |
| EP0516875B1 (de) * | 1991-06-06 | 1995-08-23 | International Business Machines Corporation | Elektronischer Packungsmodul |
| US5584183A (en) * | 1994-02-18 | 1996-12-17 | Solid State Cooling Systems | Thermoelectric heat exchanger |
| JP3951315B2 (ja) * | 1995-05-26 | 2007-08-01 | 松下電工株式会社 | ペルチェモジュール |
| US5918469A (en) * | 1996-01-11 | 1999-07-06 | Silicon Thermal, Inc. | Cooling system and method of cooling electronic devices |
| US6333849B1 (en) * | 1996-07-01 | 2001-12-25 | Compaq Computer Corporation | Apparatus for liquid cooling of specific computer components |
| JP3238114B2 (ja) * | 1997-12-25 | 2001-12-10 | 株式会社エコ・トゥエンティーワン | 熱電変換装置 |
| US6119462A (en) | 1998-03-23 | 2000-09-19 | Oasis Corporation | Water cooler with improved thermoelectric chiller system |
| JP3025966B1 (ja) * | 1999-03-18 | 2000-03-27 | 龍夫 紺谷 | 電子温調装置 |
-
2002
- 2002-04-24 AT AT02733589T patent/ATE309618T1/de not_active IP Right Cessation
- 2002-04-24 WO PCT/NL2002/000268 patent/WO2002086980A1/en not_active Ceased
- 2002-04-24 EP EP02733589A patent/EP1384271B1/de not_active Expired - Lifetime
- 2002-04-24 US US10/475,717 patent/US7096676B2/en not_active Expired - Fee Related
- 2002-04-24 CN CN02812563.0A patent/CN1228864C/zh not_active Expired - Fee Related
- 2002-04-24 ES ES02733589T patent/ES2253535T3/es not_active Expired - Lifetime
- 2002-04-24 JP JP2002584395A patent/JP2004524506A/ja not_active Withdrawn
- 2002-04-24 DE DE60207230T patent/DE60207230T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE60207230D1 (de) | 2005-12-15 |
| EP1384271B1 (de) | 2005-11-09 |
| ES2253535T3 (es) | 2006-06-01 |
| EP1384271A1 (de) | 2004-01-28 |
| CN1518776A (zh) | 2004-08-04 |
| JP2004524506A (ja) | 2004-08-12 |
| WO2002086980A1 (en) | 2002-10-31 |
| DE60207230T2 (de) | 2006-07-13 |
| US7096676B2 (en) | 2006-08-29 |
| CN1228864C (zh) | 2005-11-23 |
| US20040177623A1 (en) | 2004-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE309618T1 (de) | Elektronisches kühlgerät | |
| WO2003100865A3 (en) | Microwave field effect transistor structure | |
| WO2004070791A3 (en) | Bi-directional power switch | |
| TW200511577A (en) | Vertical compound semiconductor field effect transistor structure | |
| WO2004038804A3 (en) | Semiconductor device having a u-shaped gate structure | |
| SE0500865L (sv) | Halvledaranordning av kiselkarbid | |
| TW200501264A (en) | Nonplanar device with stress incorporation layer and method of fabrication | |
| EP1168435A3 (de) | Halbleiterbauelement und dessen Herstellungsverfahren | |
| TW200732803A (en) | Liquid crystal display device | |
| WO2006002405A3 (en) | Oled display having thermally conductive material | |
| DE50014007D1 (de) | Niederohmiges vdmos-halbleiterbauelement | |
| DE50300025D1 (de) | Druckkontaktiertes Leistungshalbleiterrelais | |
| KR920015577A (ko) | 반도체장치 | |
| TW200614512A (en) | Semiconductor device and method for manufacturing the same | |
| WO2003003452A3 (en) | Field-effect transistor and method of making the same | |
| TW200737550A (en) | Semiconductor device and its manufacturing method, and display device and electronic appliance | |
| RU99111593A (ru) | Полупроводниковое устройство | |
| EP2672518A3 (de) | Halbleitervorrichtung mit Heteroübergang | |
| JP2005536056A5 (de) | ||
| JP2007141916A5 (de) | ||
| ATE445869T1 (de) | Montage eines sensorglases in einem gehäuse | |
| TW200514262A (en) | Semiconductor device | |
| TW200742486A (en) | Electroluminescent device and electroluminescent device unit | |
| KR960019766A (ko) | 에스오아이(soi) 기판상의 모스페트(mosfet) | |
| ATE392012T1 (de) | Integrierte schaltung mit mindestens einem kontakthöcker |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |