ATE392012T1 - Integrierte schaltung mit mindestens einem kontakthöcker - Google Patents

Integrierte schaltung mit mindestens einem kontakthöcker

Info

Publication number
ATE392012T1
ATE392012T1 AT03758504T AT03758504T ATE392012T1 AT E392012 T1 ATE392012 T1 AT E392012T1 AT 03758504 T AT03758504 T AT 03758504T AT 03758504 T AT03758504 T AT 03758504T AT E392012 T1 ATE392012 T1 AT E392012T1
Authority
AT
Austria
Prior art keywords
contact pad
integrated circuit
mum
signal
processing circuit
Prior art date
Application number
AT03758504T
Other languages
English (en)
Inventor
Heimo Scheucher
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE392012T1 publication Critical patent/ATE392012T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
AT03758504T 2002-11-08 2003-10-31 Integrierte schaltung mit mindestens einem kontakthöcker ATE392012T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02102552 2002-11-08

Publications (1)

Publication Number Publication Date
ATE392012T1 true ATE392012T1 (de) 2008-04-15

Family

ID=32309455

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03758504T ATE392012T1 (de) 2002-11-08 2003-10-31 Integrierte schaltung mit mindestens einem kontakthöcker

Country Status (8)

Country Link
US (1) US7247943B2 (de)
EP (1) EP1563537B1 (de)
JP (1) JP2006505933A (de)
CN (1) CN100382293C (de)
AT (1) ATE392012T1 (de)
AU (1) AU2003274530A1 (de)
DE (1) DE60320299T2 (de)
WO (1) WO2004042818A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10337569B4 (de) * 2003-08-14 2008-12-11 Infineon Technologies Ag Integrierte Anschlussanordnung und Herstellungsverfahren
US20080123335A1 (en) * 2006-11-08 2008-05-29 Jong Kun Yoo Printed circuit board assembly and display having the same
DE602008003128D1 (de) 2007-07-12 2010-12-02 Nxp Bv Integrierte schaltungen auf einem wafer und verfahren zur herstellung integrierter schaltungen
US8581423B2 (en) * 2008-11-17 2013-11-12 Taiwan Semiconductor Manufacturing Company, Ltd. Double solid metal pad with reduced area
US9052304B2 (en) * 2009-03-13 2015-06-09 Terrasep, Llc Methods and apparatus for centrifugal liquid chromatography
JP5558336B2 (ja) * 2010-12-27 2014-07-23 株式会社東芝 半導体装置
US20130320522A1 (en) * 2012-05-30 2013-12-05 Taiwan Semiconductor Manufacturing Company, Ltd. Re-distribution Layer Via Structure and Method of Making Same
JP6111907B2 (ja) * 2013-07-05 2017-04-12 三菱電機株式会社 半導体装置の製造方法
CN105514085B (zh) * 2014-10-14 2018-05-04 中芯国际集成电路制造(上海)有限公司 晶圆、切割晶圆的方法及芯片
CN115132687B (zh) * 2022-09-02 2022-11-22 甬矽电子(宁波)股份有限公司 封装堆叠结构和封装堆叠方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719448A (en) * 1989-03-07 1998-02-17 Seiko Epson Corporation Bonding pad structures for semiconductor integrated circuits
US5281855A (en) * 1991-06-05 1994-01-25 Trovan Limited Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die
EP0637840A1 (de) * 1993-08-05 1995-02-08 AT&T Corp. Integrierte Schaltung mit aktiven Elementen unter den Anschlussflächen
JP3432284B2 (ja) * 1994-07-04 2003-08-04 三菱電機株式会社 半導体装置
US5821855A (en) 1997-02-28 1998-10-13 Lewis; Tommy J. Recognition responsive security system
KR100267105B1 (ko) * 1997-12-09 2000-11-01 윤종용 다층패드를구비한반도체소자및그제조방법
TW430935B (en) * 1999-03-19 2001-04-21 Ind Tech Res Inst Frame type bonding pad structure having a low parasitic capacitance

Also Published As

Publication number Publication date
EP1563537B1 (de) 2008-04-09
AU2003274530A1 (en) 2004-06-07
US20060071240A1 (en) 2006-04-06
DE60320299T2 (de) 2009-05-20
DE60320299D1 (de) 2008-05-21
CN1711638A (zh) 2005-12-21
JP2006505933A (ja) 2006-02-16
WO2004042818A1 (en) 2004-05-21
CN100382293C (zh) 2008-04-16
US7247943B2 (en) 2007-07-24
EP1563537A1 (de) 2005-08-17

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties