ATE317867T1 - Imidazol-phosphorsäure-salze als beschleuniger für die härtung von einkomponentigen epoxidharzzusammensetzungen mit dicyandiamid - Google Patents

Imidazol-phosphorsäure-salze als beschleuniger für die härtung von einkomponentigen epoxidharzzusammensetzungen mit dicyandiamid

Info

Publication number
ATE317867T1
ATE317867T1 AT01125886T AT01125886T ATE317867T1 AT E317867 T1 ATE317867 T1 AT E317867T1 AT 01125886 T AT01125886 T AT 01125886T AT 01125886 T AT01125886 T AT 01125886T AT E317867 T1 ATE317867 T1 AT E317867T1
Authority
AT
Austria
Prior art keywords
dicyandiamide
epoxy resin
imidazole
accelerators
curing
Prior art date
Application number
AT01125886T
Other languages
English (en)
Inventor
Dilipkumar Nandlal Shah
William Edward Starner
Original Assignee
Air Prod & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Prod & Chem filed Critical Air Prod & Chem
Application granted granted Critical
Publication of ATE317867T1 publication Critical patent/ATE317867T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D231/00—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/10—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D231/12—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D249/00—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms
    • C07D249/02—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms not condensed with other rings
    • C07D249/08—1,2,4-Triazoles; Hydrogenated 1,2,4-triazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5093—Complexes of amines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
AT01125886T 2000-11-01 2001-10-30 Imidazol-phosphorsäure-salze als beschleuniger für die härtung von einkomponentigen epoxidharzzusammensetzungen mit dicyandiamid ATE317867T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/703,311 US6441064B1 (en) 2000-11-01 2000-11-01 Imidazole-phosphoric acid salts as accelerators for dicyandiamide in one-component epoxy compositions

Publications (1)

Publication Number Publication Date
ATE317867T1 true ATE317867T1 (de) 2006-03-15

Family

ID=24824881

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01125886T ATE317867T1 (de) 2000-11-01 2001-10-30 Imidazol-phosphorsäure-salze als beschleuniger für die härtung von einkomponentigen epoxidharzzusammensetzungen mit dicyandiamid

Country Status (6)

Country Link
US (1) US6441064B1 (de)
EP (1) EP1203782B1 (de)
JP (2) JP3509799B2 (de)
CN (1) CN1258560C (de)
AT (1) ATE317867T1 (de)
DE (1) DE60117212T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060194064A1 (en) * 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
ATE529110T1 (de) * 2002-03-05 2011-11-15 Transtech Pharma Inc Mono- und bicyclische azolderivate die die interaktion von liganden mit rage hemmen
CN1805743A (zh) * 2003-05-20 2006-07-19 特兰斯泰克制药公司 用作逆转淀粉样变性及其他与之相关疾病的rage拮抗剂
US20070102674A1 (en) * 2003-07-11 2007-05-10 Ube Industries, Ltd. Acid-base mixture and ion conductor comprising the same
WO2011025040A1 (ja) * 2009-08-31 2011-03-03 日本合成化学工業株式会社 エポキシ樹脂用硬化剤
JP5805646B2 (ja) 2009-09-30 2015-11-04 ブイティーブイ・セラピューティクス・エルエルシー アルツハイマー病の治療のための置換イミダゾール誘導体
JP6030028B2 (ja) * 2013-07-11 2016-11-24 株式会社Adeka 新規化合物、熱硬化剤及びエポキシ樹脂組成物
US9546243B2 (en) * 2013-07-17 2017-01-17 Air Products And Chemicals, Inc. Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
JP6161464B2 (ja) * 2013-08-08 2017-07-12 株式会社Adeka 一液型硬化性樹脂組成物
WO2018035007A1 (en) 2016-08-15 2018-02-22 Evonik Degussa Gmbh Anhydride epoxy curing agents having imidazole salt additives for epoxy resin systems
CN110062783A (zh) 2016-12-12 2019-07-26 赢创德固赛有限公司 新的低温酸酐环氧固化体系
CN111032724B (zh) 2017-08-22 2022-04-29 盛势达技研株式会社 固化性组合物
DE102018121012A1 (de) * 2018-08-28 2020-03-05 Alzchem Trostberg Gmbh Verfahren zur Herstellung eines Druckgasbehälters
KR102197406B1 (ko) * 2019-12-05 2020-12-31 주식회사 제일화성 친환경 바이오매스 기반의 아이소소바이드 에폭시를 활용한 고체상 에폭시 수지의 제조 방법
KR102197405B1 (ko) * 2019-12-05 2020-12-31 주식회사 제일화성 친환경 바이오매스 기반의 아이소소바이드 에폭시 원료를 이용한 고체상 에폭시 수지의 제조 방법
CN116478344A (zh) * 2022-01-17 2023-07-25 万华化学集团股份有限公司 一种水性单组份环氧乳液及其制备方法
CN120988566B (zh) * 2025-10-27 2025-12-30 广东百慕新材料技术工程有限公司 一种薄涂水性石墨烯改性苯氧浸涂涂料及其制备方法与应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3356645A (en) * 1964-04-20 1967-12-05 Shell Oil Co Process for curing epoxy resins with a salt of an imidazole and compositions thereof
NL130329C (de) 1964-04-20
US3329652A (en) 1965-02-15 1967-07-04 Shell Oil Co Process for curing polyepoxides with anhydrides and activators therefor
US3632427A (en) 1970-05-15 1972-01-04 Air Prod & Chem Epoxy resin and imidazole alkyl acid phosphate fiber treatment
US3631150A (en) 1970-05-20 1971-12-28 Dexter Corp Synergistic composition for curing polyepoxides comprising an imidazole compound and dicyandiamide
US3755253A (en) 1971-09-24 1973-08-28 Shell Oil Co Catalization of diaminodiphenylsulfone cure of polyepoxides with an imidazole compound or a salt thereof
JPS5883023A (ja) 1981-11-11 1983-05-18 Taoka Chem Co Ltd 硬化性組成物
JPS5920371A (ja) 1982-07-27 1984-02-02 Toyo Ink Mfg Co Ltd 導電性接着剤
DE3624177A1 (de) 1986-07-17 1988-01-21 Huels Chemische Werke Ag Pulverlacke, deren herstellung und verwendung
JPH0253777A (ja) 1988-08-18 1990-02-22 Shikoku Chem Corp １−ベンジルイミダゾール化合物の合成方法
CA2151834A1 (en) 1992-12-21 1994-07-07 Alliedsignal Inc. Solvent free epoxy resin compositions
US5508328A (en) * 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid

Also Published As

Publication number Publication date
CN1351092A (zh) 2002-05-29
EP1203782A1 (de) 2002-05-08
JP2002161127A (ja) 2002-06-04
DE60117212T2 (de) 2006-07-27
US6441064B1 (en) 2002-08-27
EP1203782B1 (de) 2006-02-15
DE60117212D1 (de) 2006-04-20
JP2004010618A (ja) 2004-01-15
CN1258560C (zh) 2006-06-07
JP3509799B2 (ja) 2004-03-22

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