ATE318501T1 - Abgeschirmtes modulgehäuse für substrate - Google Patents

Abgeschirmtes modulgehäuse für substrate

Info

Publication number
ATE318501T1
ATE318501T1 AT99403159T AT99403159T ATE318501T1 AT E318501 T1 ATE318501 T1 AT E318501T1 AT 99403159 T AT99403159 T AT 99403159T AT 99403159 T AT99403159 T AT 99403159T AT E318501 T1 ATE318501 T1 AT E318501T1
Authority
AT
Austria
Prior art keywords
housing
substrate
substrates
modular housing
shielded modular
Prior art date
Application number
AT99403159T
Other languages
English (en)
Inventor
Olav Wangen
Original Assignee
Norspace As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Norspace As filed Critical Norspace As
Application granted granted Critical
Publication of ATE318501T1 publication Critical patent/ATE318501T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
AT99403159T 1998-12-23 1999-12-16 Abgeschirmtes modulgehäuse für substrate ATE318501T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NO986129A NO986129L (no) 1998-12-23 1998-12-23 Beskyttet modulært hus for substrat

Publications (1)

Publication Number Publication Date
ATE318501T1 true ATE318501T1 (de) 2006-03-15

Family

ID=19902778

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99403159T ATE318501T1 (de) 1998-12-23 1999-12-16 Abgeschirmtes modulgehäuse für substrate

Country Status (6)

Country Link
US (1) US6327156B1 (de)
EP (1) EP1014770B1 (de)
AT (1) ATE318501T1 (de)
CA (1) CA2291318C (de)
DE (1) DE69929950D1 (de)
NO (1) NO986129L (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2801124B1 (fr) * 1999-11-15 2002-02-08 Neopost Ind Module de comptabilisation securise pour machine a affranchir
US6545870B1 (en) * 2001-12-14 2003-04-08 Hewlett-Packard Development Company, L.P. Screwless retention of heatsink load to chassis
TW588897U (en) * 2002-12-27 2004-05-21 Hitron Technologies Inc Modularized mechanism housing structure
US6906266B2 (en) * 2003-03-03 2005-06-14 International Business Machines Corporation Method and structure for fastening a planar board to a chassis
JP4186732B2 (ja) * 2003-07-24 2008-11-26 株式会社村田製作所 電子機器
US20070041160A1 (en) * 2005-08-19 2007-02-22 Kehret William E Thermal management for a ruggedized electronics enclosure
CN101457783B (zh) * 2007-12-14 2011-07-27 鸿富锦精密工业（深圳）有限公司 锁固机构

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4661888A (en) * 1984-07-03 1987-04-28 Hewlett-Packard Company Removable modular housing for RF circuits
US5107404A (en) * 1989-09-14 1992-04-21 Astec International Ltd. Circuit board assembly for a cellular telephone system or the like
JP2663823B2 (ja) * 1993-01-29 1997-10-15 松下電器産業株式会社 高周波装置
US5373104A (en) * 1993-07-12 1994-12-13 Delco Electronics Corporation Control module with integral fastening/locking assembly
US5363276A (en) * 1993-09-01 1994-11-08 Ncr Corporation Apparatus for containing and supporting electronic components
JPH088573A (ja) * 1994-06-21 1996-01-12 Nec Corp シールドケース構造
US5677830A (en) * 1995-03-02 1997-10-14 Mitel Corporation Modular, stacking, expandable electronic enclosure system
US5550713A (en) * 1995-09-06 1996-08-27 Aironet Wireless Communications, Inc. Electromagnetic shielding assembly for printed circuit board
US5777844A (en) * 1996-08-30 1998-07-07 General Electric Company Electronic control with heat sink
JPH10154890A (ja) * 1996-11-22 1998-06-09 Mitsumi Electric Co Ltd 複数のシールドケースの組立構造
US5867369A (en) * 1997-07-15 1999-02-02 Sun Microsystems, Inc. Rugged computer housing
US6043981A (en) * 1997-11-13 2000-03-28 Chrysler Corporation Heat sink assembly for electrical components

Also Published As

Publication number Publication date
NO986129L (no) 2000-06-26
NO986129D0 (no) 1998-12-23
EP1014770B1 (de) 2006-02-22
EP1014770A3 (de) 2000-11-02
US6327156B1 (en) 2001-12-04
DE69929950D1 (de) 2006-04-27
EP1014770A2 (de) 2000-06-28
CA2291318A1 (en) 2000-06-23
CA2291318C (en) 2007-05-29

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties