ATE320702T1 - Verfahren und system zur inspektion eines bauteils mit anschlüssen und zum erfassen der korrekten bestückungsposition - Google Patents

Verfahren und system zur inspektion eines bauteils mit anschlüssen und zum erfassen der korrekten bestückungsposition

Info

Publication number
ATE320702T1
ATE320702T1 AT00936922T AT00936922T ATE320702T1 AT E320702 T1 ATE320702 T1 AT E320702T1 AT 00936922 T AT00936922 T AT 00936922T AT 00936922 T AT00936922 T AT 00936922T AT E320702 T1 ATE320702 T1 AT E320702T1
Authority
AT
Austria
Prior art keywords
component
leads
illuminating beam
light
sensitive detector
Prior art date
Application number
AT00936922T
Other languages
English (en)
Inventor
Joseph Morris
Original Assignee
Pmj Automec Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pmj Automec Oy filed Critical Pmj Automec Oy
Application granted granted Critical
Publication of ATE320702T1 publication Critical patent/ATE320702T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2433—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures for measuring outlines by shadow casting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AT00936922T 1999-06-10 2000-06-12 Verfahren und system zur inspektion eines bauteils mit anschlüssen und zum erfassen der korrekten bestückungsposition ATE320702T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/329,541 US6222629B1 (en) 1999-06-10 1999-06-10 Procedure and system for inspecting a component with leads to determine its fitness for assembly

Publications (1)

Publication Number Publication Date
ATE320702T1 true ATE320702T1 (de) 2006-04-15

Family

ID=23285888

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00936922T ATE320702T1 (de) 1999-06-10 2000-06-12 Verfahren und system zur inspektion eines bauteils mit anschlüssen und zum erfassen der korrekten bestückungsposition

Country Status (6)

Country Link
US (1) US6222629B1 (de)
EP (1) EP1106043B9 (de)
AT (1) ATE320702T1 (de)
AU (1) AU5224100A (de)
DE (1) DE60026701D1 (de)
WO (1) WO2000078116A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002046713A2 (en) * 2000-12-08 2002-06-13 Cyberoptics Corporation Automated system with improved height sensing
JP4872854B2 (ja) * 2007-08-28 2012-02-08 パナソニック株式会社 部品実装装置
JP4998148B2 (ja) * 2007-08-28 2012-08-15 パナソニック株式会社 部品実装装置
WO2009028713A1 (en) * 2007-08-28 2009-03-05 Panasonic Corporation Component placement apparatus
KR101292570B1 (ko) * 2008-12-31 2013-08-12 엘지디스플레이 주식회사 액정표시장치의 변형 검사시스템
JP6404359B2 (ja) * 2014-10-03 2018-10-10 株式会社Ｆｕｊｉ 部品装着システムおよび部品装着装置の異常停止診断方法
CN107852860B (zh) * 2015-07-23 2020-07-31 株式会社富士 元件安装机
JP6154456B2 (ja) * 2015-12-24 2017-06-28 Juki株式会社 電子部品実装方法及び電子部品実装装置
JP6829946B2 (ja) * 2016-04-28 2021-02-17 川崎重工業株式会社 部品検査装置および方法
US10802475B2 (en) * 2018-07-16 2020-10-13 Elite Robotics Positioner for a robotic workcell

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5278634A (en) * 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system
US5309223A (en) * 1991-06-25 1994-05-03 Cyberoptics Corporation Laser-based semiconductor lead measurement system
US5805722A (en) 1993-11-22 1998-09-08 Cognex Corporation Method and apparatus for locating, inspecting, and placing large leaded devices
US5559727A (en) * 1994-02-24 1996-09-24 Quad Systems Corporation Apparatus and method for determining the position of a component prior to placement
EP0897657B1 (de) * 1996-04-23 2002-02-27 Matsushita Electric Industrial Co., Ltd. Elektronische bauteile bestückungsvorrichtung
JP3296968B2 (ja) * 1996-04-26 2002-07-02 ヤマハ発動機株式会社 基準位置決定方法

Also Published As

Publication number Publication date
WO2000078116A1 (en) 2000-12-21
AU5224100A (en) 2001-01-02
EP1106043A1 (de) 2001-06-13
DE60026701D1 (de) 2006-05-11
EP1106043B1 (de) 2006-03-15
US6222629B1 (en) 2001-04-24
EP1106043B9 (de) 2006-06-28

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Legal Events

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