ATE322743T1 - Elektronikmodul - Google Patents

Elektronikmodul

Info

Publication number
ATE322743T1
ATE322743T1 AT03010033T AT03010033T ATE322743T1 AT E322743 T1 ATE322743 T1 AT E322743T1 AT 03010033 T AT03010033 T AT 03010033T AT 03010033 T AT03010033 T AT 03010033T AT E322743 T1 ATE322743 T1 AT E322743T1
Authority
AT
Austria
Prior art keywords
substrate
contacting unit
electronics module
semiconductor
contact face
Prior art date
Application number
AT03010033T
Other languages
English (en)
Inventor
Ralf Ehler
Michael Frisch
Original Assignee
Tyco Electronics Amp Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Amp Gmbh filed Critical Tyco Electronics Amp Gmbh
Application granted granted Critical
Publication of ATE322743T1 publication Critical patent/ATE322743T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Credit Cards Or The Like (AREA)
AT03010033T 2002-05-15 2003-05-02 Elektronikmodul ATE322743T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02010787 2002-05-15

Publications (1)

Publication Number Publication Date
ATE322743T1 true ATE322743T1 (de) 2006-04-15

Family

ID=29433075

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03010033T ATE322743T1 (de) 2002-05-15 2003-05-02 Elektronikmodul

Country Status (4)

Country Link
US (1) US6930879B2 (de)
CN (1) CN100376028C (de)
AT (1) ATE322743T1 (de)
DE (1) DE60304390T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6889568B2 (en) * 2002-01-24 2005-05-10 Sensarray Corporation Process condition sensing wafer and data analysis system
US8604361B2 (en) * 2005-12-13 2013-12-10 Kla-Tencor Corporation Component package for maintaining safe operating temperature of components
DE102007036566A1 (de) * 2007-08-03 2009-02-19 Siemens Ag Federkontaktierung von elektrischen Kontaktflächen eines elektronischen Bauteils
CN103779313B (zh) * 2014-01-24 2017-02-01 嘉兴斯达微电子有限公司 一种带电极压力装置的功率半导体模块
US9620877B2 (en) 2014-06-17 2017-04-11 Semiconductor Components Industries, Llc Flexible press fit pins for semiconductor packages and related methods
US9431311B1 (en) 2015-02-19 2016-08-30 Semiconductor Components Industries, Llc Semiconductor package with elastic coupler and related methods
EP4084061A1 (de) * 2021-04-28 2022-11-02 Siemens Aktiengesellschaft Schaltungsträger sowie verfahren zum herstellen einer elektrischen verbindung mit diesem

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4607276A (en) 1984-03-08 1986-08-19 Olin Corporation Tape packages
WO1996015551A1 (en) 1994-11-15 1996-05-23 Formfactor, Inc. Mounting electronic components to a circuit board
US5688716A (en) 1994-07-07 1997-11-18 Tessera, Inc. Fan-out semiconductor chip assembly
SE9403575L (sv) * 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Benram för kapslad optokomponent
FR2734983B1 (fr) * 1995-05-29 1997-07-04 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
JPH11330283A (ja) * 1998-05-15 1999-11-30 Toshiba Corp 半導体モジュール及び大型半導体モジュール
US6378758B1 (en) 1999-01-19 2002-04-30 Tessera, Inc. Conductive leads with non-wettable surfaces
EP1209742A1 (de) 2000-11-22 2002-05-29 ABB Schweiz AG Hochleistungshalbleitermodul sowie Anwendung eines solchen Hochleistungshalbleitermoduls

Also Published As

Publication number Publication date
US20040004820A1 (en) 2004-01-08
DE60304390T2 (de) 2007-02-01
CN100376028C (zh) 2008-03-19
US6930879B2 (en) 2005-08-16
DE60304390D1 (de) 2006-05-18
CN1458688A (zh) 2003-11-26

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