DK1450404T3 - Indretning i trykkontakt med et effekthalvledermodul - Google Patents
Indretning i trykkontakt med et effekthalvledermodulInfo
- Publication number
- DK1450404T3 DK1450404T3 DK04000281.8T DK04000281T DK1450404T3 DK 1450404 T3 DK1450404 T3 DK 1450404T3 DK 04000281 T DK04000281 T DK 04000281T DK 1450404 T3 DK1450404 T3 DK 1450404T3
- Authority
- DK
- Denmark
- Prior art keywords
- power semiconductor
- pressure switch
- semiconductor module
- circuit board
- connection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Die Bonding (AREA)
- Measuring Fluid Pressure (AREA)
- Emergency Protection Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10306643A DE10306643B4 (de) | 2003-02-18 | 2003-02-18 | Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK1450404T3 true DK1450404T3 (da) | 2011-05-23 |
Family
ID=32731025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK04000281.8T DK1450404T3 (da) | 2003-02-18 | 2004-01-09 | Indretning i trykkontakt med et effekthalvledermodul |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6979204B2 (da) |
| EP (1) | EP1450404B1 (da) |
| JP (1) | JP4359518B2 (da) |
| AT (1) | ATE500612T1 (da) |
| DE (2) | DE10306643B4 (da) |
| DK (1) | DK1450404T3 (da) |
| ES (1) | ES2360216T3 (da) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10340297B4 (de) * | 2003-09-02 | 2006-07-20 | Semikron Elektronik Gmbh & Co. Kg | Verbindugsanordnung zur Verbindung von aktiven und passiven elektrischen und elektronischen Bauelementen |
| DE10358843B3 (de) | 2003-12-16 | 2005-03-24 | Semikron Elektronik Gmbh | Verpackungsbehältnis für Leistungshalbleitermodule |
| JP4154325B2 (ja) * | 2003-12-19 | 2008-09-24 | 株式会社日立産機システム | 電気回路モジュール |
| DE102005017849B4 (de) * | 2005-04-18 | 2012-11-08 | Siemens Ag | Elektronisches Bauteil |
| DE102005055608B3 (de) * | 2005-11-22 | 2007-05-10 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit zueinander parallel geschalteten Kondensatoren |
| DE102006021412B3 (de) * | 2006-05-09 | 2007-11-15 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
| DE102006025453B4 (de) | 2006-05-31 | 2009-12-24 | Infineon Technologies Ag | Halbleiterschaltungsanordnung |
| DE102006052620B4 (de) * | 2006-11-08 | 2009-07-09 | Semikron Elektronik Gmbh & Co. Kg | Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist. |
| DE102006058692A1 (de) * | 2006-12-13 | 2008-06-26 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Kontaktfedern |
| DE102007006212B4 (de) * | 2007-02-08 | 2012-09-13 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Kontaktfedern |
| DE102007010883A1 (de) * | 2007-03-06 | 2008-09-18 | Infineon Technologies Ag | Leistungshalbleiteranordnung und Verfahren zu dessen Herstellung |
| DE102007024160B4 (de) * | 2007-05-24 | 2011-12-01 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
| US9373563B2 (en) * | 2007-07-20 | 2016-06-21 | Infineon Technologies Ag | Semiconductor assembly having a housing |
| DE102007045281B4 (de) | 2007-09-21 | 2010-02-25 | Semikron Elektronik Gmbh & Co. Kg | Leistungsmodul |
| DE102007054709B4 (de) * | 2007-11-16 | 2014-11-13 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit einem Substrat und mit einer Druckeinrichtung |
| DE102007062163B4 (de) * | 2007-12-21 | 2009-08-13 | Semikron Elektronik Gmbh & Co. Kg | Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul |
| DE102008005547B4 (de) * | 2008-01-23 | 2013-08-29 | Infineon Technologies Ag | Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul |
| DE102008018793B3 (de) * | 2008-04-15 | 2009-11-12 | Semikron Elektronik Gmbh & Co. Kg | Anordnung in Druckkontaktausführung mit einem Leistungshalbleitermodul |
| DE102008034068B4 (de) * | 2008-07-22 | 2019-07-18 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
| DE102008045615C5 (de) | 2008-09-03 | 2018-01-04 | Infineon Technologies Ag | Verfahren zur Herstellung eines Leistungshalbleitermoduls |
| DE102008057832B4 (de) * | 2008-11-19 | 2010-07-01 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit vorgespannter Hilfskontaktfeder |
| DE102009002993B4 (de) * | 2009-05-11 | 2012-10-04 | Infineon Technologies Ag | Leistungshalbleitermodul mit beabstandeten Schaltungsträgern |
| DE102009026558B3 (de) | 2009-05-28 | 2010-12-02 | Infineon Technologies Ag | Leistungshalbleitermodul mit beweglich gelagerten Schaltungsträgern und Verfahren zur Herstellung eines solchen Leistungshalbleitermoduls |
| DE112011105612B4 (de) * | 2011-09-13 | 2014-12-31 | Toyota Jidosha Kabushiki Kaisha | Halbleitermodul |
| JP2013243264A (ja) * | 2012-05-21 | 2013-12-05 | Yaskawa Electric Corp | 電子部品取付モジュールおよび電力変換装置 |
| EP2814055B1 (en) | 2012-07-18 | 2020-12-30 | Fuji Electric Co., Ltd. | Semiconductor device and semiconductor device fabrication method |
| US10231340B2 (en) * | 2016-05-26 | 2019-03-12 | Semiconductor Components Industries, Llc | Single reflow power pin connections |
| DE102016112779B4 (de) * | 2016-07-12 | 2022-02-24 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitereinrichtung und Verfahren zur Herstellung einer Leistungshalbleitereinrichtung |
| US11444002B2 (en) * | 2020-07-29 | 2022-09-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5653379A (en) * | 1989-12-18 | 1997-08-05 | Texas Instruments Incorporated | Clad metal substrate |
| DE4211759C2 (de) * | 1992-04-08 | 1997-04-03 | Schroff Gmbh | Lüftereinschub |
| US5259781A (en) * | 1992-11-18 | 1993-11-09 | International Business Machines Corporation | Electrical connector alignment and actuation assembly |
| KR200163045Y1 (ko) | 1994-10-31 | 2000-01-15 | 전주범 | 테이프레코더의 릴테이블 급제동장치(device for breaking a reel table for a tape recorder) |
| DE19630173C2 (de) * | 1996-07-26 | 2001-02-08 | Semikron Elektronik Gmbh | Leistungsmodul mit Halbleiterbauelementen |
| US5793618A (en) * | 1996-11-26 | 1998-08-11 | International Business Machines Corporation | Module mounting assembly |
| DE19847029A1 (de) * | 1998-10-13 | 2000-04-27 | Semikron Elektronik Gmbh | Umrichter mit niederinduktivem Kondensator im Zwischenkreis |
| DE29819349U1 (de) * | 1998-10-30 | 1999-12-09 | Siemens AG, 80333 München | Halbleiter-Schaltungsanordnung, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung |
| DE19903875C2 (de) * | 1999-02-01 | 2001-11-29 | Semikron Elektronik Gmbh | Leistungshalbleiterschaltungsanordnung, insbesondere Stromumrichter, in Druckkontaktierung |
| DE19924993C2 (de) * | 1999-05-31 | 2002-10-10 | Tyco Electronics Logistics Ag | Intelligentes Leistungsmodul in Sandwich-Bauweise |
| JP3395739B2 (ja) * | 1999-11-16 | 2003-04-14 | 日本電気株式会社 | 薄膜トランジスタアレイ基板及びその製造方法 |
| US6454587B1 (en) * | 2000-10-27 | 2002-09-24 | Hewlett-Packard Company | Assembly for mounting a bus termination device to a printed circuit board (PCB) |
-
2003
- 2003-02-18 DE DE10306643A patent/DE10306643B4/de not_active Expired - Lifetime
-
2004
- 2004-01-09 DK DK04000281.8T patent/DK1450404T3/da active
- 2004-01-09 EP EP04000281A patent/EP1450404B1/de not_active Expired - Lifetime
- 2004-01-09 AT AT04000281T patent/ATE500612T1/de active
- 2004-01-09 ES ES04000281T patent/ES2360216T3/es not_active Expired - Lifetime
- 2004-01-09 DE DE502004012242T patent/DE502004012242D1/de not_active Expired - Lifetime
- 2004-02-13 JP JP2004036835A patent/JP4359518B2/ja not_active Expired - Lifetime
- 2004-02-18 US US10/780,981 patent/US6979204B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE10306643B4 (de) | 2005-08-25 |
| EP1450404A2 (de) | 2004-08-25 |
| US20040242031A1 (en) | 2004-12-02 |
| DE10306643A1 (de) | 2004-08-26 |
| JP2004253798A (ja) | 2004-09-09 |
| JP4359518B2 (ja) | 2009-11-04 |
| DE502004012242D1 (de) | 2011-04-14 |
| US6979204B2 (en) | 2005-12-27 |
| ES2360216T3 (es) | 2011-06-01 |
| ATE500612T1 (de) | 2011-03-15 |
| EP1450404B1 (de) | 2011-03-02 |
| EP1450404A3 (de) | 2004-09-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DK1450404T3 (da) | Indretning i trykkontakt med et effekthalvledermodul | |
| DK1255299T3 (da) | Effekthalvledermodul med trykkontaktering | |
| ATE416478T1 (de) | Leistungshalbleitermodul | |
| ATE555640T1 (de) | Anordnung in schraub-druckkontakierung mit einem leistungshalbleitermodul | |
| FI20030493A0 (fi) | Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli | |
| DE60319535D1 (de) | Ronischen vorrichtung an ein kleidungsstück | |
| ATE545954T1 (de) | Anordnung in druckkontaktierung mit einem leistungshalbleitermodul | |
| TW200707595A (en) | Electronic device | |
| TW200629434A (en) | Module structure having an embedded chip | |
| TW200512894A (en) | Intermediate chip module, semiconductor device, circuit board, and electronic device | |
| TW200520005A (en) | Plasma display | |
| ATE313834T1 (de) | Chipkarte mit display | |
| MY143173A (en) | Compact power semiconductor module having a connecting device | |
| DK1772900T3 (da) | Fabrikationsfremgangsmåde for en indretning med effekthalvlederkomponenter omfattende et tryksintringstrin | |
| ATE270004T1 (de) | Druckkontaktiertes leistungshalbleiterrelais | |
| ATE362198T1 (de) | Kühleinrichtung für halbleiter auf leiterplatte | |
| TW200644202A (en) | Method of manufacturing flexible circuit substrate | |
| FR2851374B1 (fr) | Boitier-semi-conducteur a puce de circuits integres portee par les pattes de connexion electrique | |
| WO2006005327A3 (de) | Verfahren und vorrichtung zur wechselseitigen kontaktierung von zwei wafern | |
| DK1775769T3 (da) | Effekthalvledermodul | |
| NO20020321D0 (no) | LED-signaler | |
| MX2007003615A (es) | Circuito integrado y metodo de fabricacion. | |
| ATE357741T1 (de) | Leistungshalbleitermodul mit sensorikbauteil | |
| ATE322743T1 (de) | Elektronikmodul | |
| TW200717378A (en) | Plasma display device |