ATE327853T1 - Verfahren und vorrichtung zum abgeben eines materials in einem drucker - Google Patents

Verfahren und vorrichtung zum abgeben eines materials in einem drucker

Info

Publication number
ATE327853T1
ATE327853T1 AT00908338T AT00908338T ATE327853T1 AT E327853 T1 ATE327853 T1 AT E327853T1 AT 00908338 T AT00908338 T AT 00908338T AT 00908338 T AT00908338 T AT 00908338T AT E327853 T1 ATE327853 T1 AT E327853T1
Authority
AT
Austria
Prior art keywords
substrate
frame
viscous material
printer
dispensing
Prior art date
Application number
AT00908338T
Other languages
English (en)
Inventor
Mark Rossmeisl
Gary Freeman
Robert J Balog
Original Assignee
Speedline Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedline Technologies Inc filed Critical Speedline Technologies Inc
Application granted granted Critical
Publication of ATE327853T1 publication Critical patent/ATE327853T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0692—Solder baths with intermediary means for bringing solder on workpiece, e.g. rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Coating Apparatus (AREA)
  • Fixing For Electrophotography (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AT00908338T 1999-01-21 2000-01-21 Verfahren und vorrichtung zum abgeben eines materials in einem drucker ATE327853T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/235,034 US6324973B2 (en) 1997-11-07 1999-01-21 Method and apparatus for dispensing material in a printer

Publications (1)

Publication Number Publication Date
ATE327853T1 true ATE327853T1 (de) 2006-06-15

Family

ID=22883803

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00908338T ATE327853T1 (de) 1999-01-21 2000-01-21 Verfahren und vorrichtung zum abgeben eines materials in einem drucker

Country Status (10)

Country Link
US (2) US6324973B2 (de)
EP (1) EP1144150B1 (de)
JP (1) JP2002540592A (de)
CN (1) CN1158155C (de)
AT (1) ATE327853T1 (de)
AU (1) AU2970400A (de)
CA (1) CA2359953A1 (de)
DE (1) DE60028338T2 (de)
HK (1) HK1044907A1 (de)
WO (1) WO2000043156A1 (de)

Families Citing this family (44)

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US6324973B2 (en) 1997-11-07 2001-12-04 Speedline Technologies, Inc. Method and apparatus for dispensing material in a printer
US7207498B1 (en) 2000-01-26 2007-04-24 Dl Technology, Llc Fluid dispense tips
US6511301B1 (en) 1999-11-08 2003-01-28 Jeffrey Fugere Fluid pump and cartridge
US6957783B1 (en) 1999-01-26 2005-10-25 Dl Technology Llc Dispense tip with vented outlets
US6866881B2 (en) * 1999-02-19 2005-03-15 Speedline Technologies, Inc. Dispensing system and method
US7072503B2 (en) * 1999-05-04 2006-07-04 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US6891967B2 (en) * 1999-05-04 2005-05-10 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US6892959B1 (en) 2000-01-26 2005-05-17 Dl Technology Llc System and method for control of fluid dispense pump
US6981664B1 (en) 2000-01-26 2006-01-03 Dl Technology Llc Fluid dispense tips
US6435396B1 (en) * 2000-04-10 2002-08-20 Micron Technology, Inc. Print head for ejecting liquid droplets
GB2360252B (en) 2000-03-07 2002-07-24 Matsushita Electric Industrial Co Ltd Screen printing method
US6878396B2 (en) * 2000-04-10 2005-04-12 Micron Technology, Inc. Micro C-4 semiconductor die and method for depositing connection sites thereon
US6571701B1 (en) 2001-05-04 2003-06-03 Speedline Technologies, Inc. Stirring mechanism for viscous-material printer and method of printing
US6983867B1 (en) 2002-04-29 2006-01-10 Dl Technology Llc Fluid dispense pump with drip prevention mechanism and method for controlling same
US20040045458A1 (en) * 2002-09-06 2004-03-11 Gerald Pham-Van-Diep Method and apparatus for releasing materials from stencils
EP1415805A1 (de) * 2002-10-28 2004-05-06 Hauni Maschinenbau AG Druckwerk mit Temperiereinrichtung
US20040244612A1 (en) * 2003-03-28 2004-12-09 Speedline Technologies, Inc. Method and apparatus for printing viscous material
US6955120B2 (en) * 2003-03-28 2005-10-18 Speedline Technologies, Inc. Pressure control system for printing a viscous material
US7331482B1 (en) 2003-03-28 2008-02-19 Dl Technology, Llc Dispense pump with heated pump housing and heated material reservoir
US20040238003A1 (en) * 2003-05-30 2004-12-02 Gerald Pham-Van-Diep Stencil cleaner for use in the solder paste print operation
US7013802B2 (en) * 2004-02-19 2006-03-21 Speedline Technologies, Inc. Method and apparatus for simultaneous inspection and cleaning of a stencil
KR100591693B1 (ko) * 2004-04-13 2006-06-22 주식회사 탑 엔지니어링 페이스트 도포기 및 그 제어 방법
US20050268799A1 (en) * 2004-06-02 2005-12-08 Speedline Technologies, Inc. Solder paste lateral flow and redistribution system and methods of same
US7249558B2 (en) * 2004-07-15 2007-07-31 Speedline Technologies, Inc. Solder paste dispenser for a stencil printer
JP4907253B2 (ja) * 2006-08-03 2012-03-28 シャープ株式会社 注入装置、製造装置、および半導体発光装置の製造方法
US8707559B1 (en) 2007-02-20 2014-04-29 Dl Technology, Llc Material dispense tips and methods for manufacturing the same
US7806048B2 (en) * 2007-04-13 2010-10-05 Illinois Tool Works, Inc. Method and apparatus for calibrating print head pressure and applying an accurate print pressure during production
US7987781B2 (en) * 2008-02-14 2011-08-02 Illinois Tool Works, Inc. Method and apparatus for applying an accurate print pressure during production
US8864055B2 (en) 2009-05-01 2014-10-21 Dl Technology, Llc Material dispense tips and methods for forming the same
US20110054543A1 (en) * 2009-08-31 2011-03-03 Warsaw Orthopedic, Inc. Locking mechanism
US8331844B2 (en) 2010-04-14 2012-12-11 Xerox Corporation Proof printing using recycled marking material
JP5854857B2 (ja) * 2012-01-24 2016-02-09 ヤマハ発動機株式会社 印刷装置、印刷装置の温度調整方法、および印刷装置の温度調整システム
US8939073B2 (en) * 2012-02-08 2015-01-27 Illinois Tool Works Inc. Print head for stencil printer
US9725225B1 (en) 2012-02-24 2017-08-08 Dl Technology, Llc Micro-volume dispense pump systems and methods
CN103375006B (zh) * 2012-04-11 2015-12-09 佛山市三水森诺建材有限公司 马赛克印刷胶粘剂成联工艺
CN103249262B (zh) * 2013-05-21 2015-08-12 无锡江南计算技术研究所 表面贴装互联座焊膏印刷钢网开口结构
JP6051411B2 (ja) * 2013-12-27 2016-12-27 パナソニックＩｐマネジメント株式会社 ペースト供給装置、スクリーン印刷機及びペースト供給方法
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US11746656B1 (en) 2019-05-13 2023-09-05 DL Technology, LLC. Micro-volume dispense pump systems and methods
US12370789B2 (en) * 2022-07-29 2025-07-29 Illinois Tool Works Inc. Stencil printer cover

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Also Published As

Publication number Publication date
CA2359953A1 (en) 2000-07-27
WO2000043156A1 (en) 2000-07-27
CN1339993A (zh) 2002-03-13
AU2970400A (en) 2000-08-07
US6324973B2 (en) 2001-12-04
US20010011506A1 (en) 2001-08-09
CN1158155C (zh) 2004-07-21
EP1144150A1 (de) 2001-10-17
EP1144150B1 (de) 2006-05-31
US20020007741A1 (en) 2002-01-24
US6626097B2 (en) 2003-09-30
JP2002540592A (ja) 2002-11-26
DE60028338T2 (de) 2007-05-10
HK1044907A1 (zh) 2002-11-08
DE60028338D1 (de) 2006-07-06

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