ATE406085T1 - Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat - Google Patents

Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat

Info

Publication number
ATE406085T1
ATE406085T1 AT01950142T AT01950142T ATE406085T1 AT E406085 T1 ATE406085 T1 AT E406085T1 AT 01950142 T AT01950142 T AT 01950142T AT 01950142 T AT01950142 T AT 01950142T AT E406085 T1 ATE406085 T1 AT E406085T1
Authority
AT
Austria
Prior art keywords
substrate
viscous medium
jetting
add
applying
Prior art date
Application number
AT01950142T
Other languages
English (en)
Inventor
William Holm
Nils Jacobsson
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Application granted granted Critical
Publication of ATE406085T1 publication Critical patent/ATE406085T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
  • Ink Jet (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
AT01950142T 2000-07-11 2001-07-06 Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat ATE406085T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0002619A SE518640C2 (sv) 2000-07-11 2000-07-11 Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning

Publications (1)

Publication Number Publication Date
ATE406085T1 true ATE406085T1 (de) 2008-09-15

Family

ID=20280455

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01950142T ATE406085T1 (de) 2000-07-11 2001-07-06 Verfahren, vorrichtung und verwendung des auftragens eines viskosen mediums auf ein substrat

Country Status (8)

Country Link
US (2) US7757391B2 (de)
EP (1) EP1314342B1 (de)
JP (1) JP5198709B2 (de)
AT (1) ATE406085T1 (de)
AU (1) AU2001271170A1 (de)
DE (1) DE60135467D1 (de)
SE (1) SE518640C2 (de)
WO (1) WO2002005608A1 (de)

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SE518642C2 (sv) 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
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JP2009515677A (ja) 2005-11-14 2009-04-16 マイデータ オートメーション アクチボラグ 噴射装置と空気流量測定用の流量センサを使用することにより噴射装置の性能を改善する方法
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US7823762B2 (en) * 2006-09-28 2010-11-02 Ibiden Co., Ltd. Manufacturing method and manufacturing apparatus of printed wiring board
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US9398697B2 (en) 2013-03-13 2016-07-19 Mycronic AB Methods and devices for jetting viscous medium on workpiece
CN105453716B (zh) * 2013-08-07 2019-06-07 株式会社富士 电子元件安装机及转印确认方法
JP2015109397A (ja) * 2013-12-06 2015-06-11 パナソニックＩｐマネジメント株式会社 電子部品実装方法及び電子部品実装システム
JP6155468B2 (ja) * 2013-12-06 2017-07-05 パナソニックＩｐマネジメント株式会社 電子部品実装方法及び電子部品実装システム
DE102014202170A1 (de) * 2014-02-06 2015-08-20 Ekra Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Bedrucken von Substraten
KR20170092529A (ko) * 2014-09-09 2017-08-11 마이크로닉 아베 솔더 페이스트 플럭스를 도포하기 위한 방법 및 디바이스
KR20160060590A (ko) * 2014-11-20 2016-05-30 주식회사 고영테크놀러지 검사 장치 및 이를 갖는 부품 실장 시스템
DE102016116201B4 (de) * 2016-08-31 2018-06-21 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum Auftragen von Pastenmaterial auf ein Substrat und zum ergänzenden Auftragen von Pastenmaterial auf ein Pastendepot des Substrats, Steuergerät, Computerprogrammprodukt und Siebdrucker
US11544836B2 (en) * 2021-03-18 2023-01-03 Inventec (Pudong) Technology Corporation Grid clustering-based system for locating an abnormal area of solder paste printing and method thereof

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Also Published As

Publication number Publication date
EP1314342A1 (de) 2003-05-28
AU2001271170A1 (en) 2002-01-21
WO2002005608A1 (en) 2002-01-17
SE518640C2 (sv) 2002-11-05
US20020015780A1 (en) 2002-02-07
SE0002619L (sv) 2002-03-08
JP5198709B2 (ja) 2013-05-15
JP2004502539A (ja) 2004-01-29
US7757391B2 (en) 2010-07-20
SE0002619D0 (sv) 2000-07-11
EP1314342B1 (de) 2008-08-20
DE60135467D1 (de) 2008-10-02
US20070137558A1 (en) 2007-06-21
US7600548B2 (en) 2009-10-13

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