ATE328310T1 - Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum - Google Patents

Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum

Info

Publication number
ATE328310T1
ATE328310T1 AT01928019T AT01928019T ATE328310T1 AT E328310 T1 ATE328310 T1 AT E328310T1 AT 01928019 T AT01928019 T AT 01928019T AT 01928019 T AT01928019 T AT 01928019T AT E328310 T1 ATE328310 T1 AT E328310T1
Authority
AT
Austria
Prior art keywords
process chamber
atmosphere
speed
pump
primary pump
Prior art date
Application number
AT01928019T
Other languages
English (en)
Inventor
Roland Bernard
Eric Chevalier
Gloria Sogan
Original Assignee
Cit Alcatel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cit Alcatel filed Critical Cit Alcatel
Application granted granted Critical
Publication of ATE328310T1 publication Critical patent/ATE328310T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2066—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source
    • G05D16/2073—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source with a plurality of pressure sources
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D27/00—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
    • G05D27/02—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/6851—With casing, support, protector or static constructional installations
    • Y10T137/6966—Static constructional installations
    • Y10T137/6969—Buildings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/86083—Vacuum pump
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y10T137/86131—Plural
    • Y10T137/86139—Serial

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Drying Of Semiconductors (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT01928019T 2000-04-20 2001-04-20 Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum ATE328310T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0005094A FR2808098B1 (fr) 2000-04-20 2000-04-20 Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes

Publications (1)

Publication Number Publication Date
ATE328310T1 true ATE328310T1 (de) 2006-06-15

Family

ID=8849454

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01928019T ATE328310T1 (de) 2000-04-20 2001-04-20 Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum

Country Status (7)

Country Link
US (3) US6316045B1 (de)
EP (1) EP1190285B1 (de)
JP (1) JP2003532283A (de)
AT (1) ATE328310T1 (de)
DE (1) DE60120064T2 (de)
FR (1) FR2808098B1 (de)
WO (1) WO2001082019A1 (de)

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FR2839331B1 (fr) 2002-05-02 2004-07-16 Cit Alcatel Installation de fabrication de composants semi-conducteurs a faux-plancher ventile
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US20060240680A1 (en) * 2005-04-25 2006-10-26 Applied Materials, Inc. Substrate processing platform allowing processing in different ambients
CN101389786A (zh) * 2006-02-28 2009-03-18 Nxp股份有限公司 处理装置和在该处理装置中处理晶片的方法
JP6034546B2 (ja) * 2006-03-16 2016-11-30 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 軽減システムの改善された操作方法及び装置
US8026113B2 (en) * 2006-03-24 2011-09-27 Tokyo Electron Limited Method of monitoring a semiconductor processing system using a wireless sensor network
KR101468606B1 (ko) * 2007-05-25 2014-12-04 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 시스템들을 조립하고 작동시키는 방법들 및 장치
EP2150360A4 (de) * 2007-05-25 2013-01-23 Applied Materials Inc Verfahren und vorrichtung für den effizienten betrieb eines reduktionssystems
US20090018688A1 (en) * 2007-06-15 2009-01-15 Applied Materials, Inc. Methods and systems for designing and validating operation of abatement systems
JP4959457B2 (ja) * 2007-07-26 2012-06-20 東京エレクトロン株式会社 基板搬送モジュール及び基板処理システム
WO2009055750A1 (en) * 2007-10-26 2009-04-30 Applied Materials, Inc. Methods and apparatus for smart abatement using an improved fuel circuit
US9997325B2 (en) 2008-07-17 2018-06-12 Verity Instruments, Inc. Electron beam exciter for use in chemical analysis in processing systems
FR2940322B1 (fr) * 2008-12-19 2011-02-11 Alcatel Lucent Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe
FR2946736A1 (fr) * 2009-06-12 2010-12-17 Alcatel Lucent Station et procede de sechage et/ou de degazage d'un produit ou d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats
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Also Published As

Publication number Publication date
US20020022283A1 (en) 2002-02-21
DE60120064T2 (de) 2006-12-21
DE60120064D1 (de) 2006-07-06
FR2808098B1 (fr) 2002-07-19
US7219692B2 (en) 2007-05-22
JP2003532283A (ja) 2003-10-28
FR2808098A1 (fr) 2001-10-26
EP1190285A1 (de) 2002-03-27
US6316045B1 (en) 2001-11-13
US6649019B2 (en) 2003-11-18
EP1190285B1 (de) 2006-05-31
US20020153102A1 (en) 2002-10-24
WO2001082019A1 (fr) 2001-11-01

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Legal Events

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