ATE328310T1 - Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum - Google Patents
Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraumInfo
- Publication number
- ATE328310T1 ATE328310T1 AT01928019T AT01928019T ATE328310T1 AT E328310 T1 ATE328310 T1 AT E328310T1 AT 01928019 T AT01928019 T AT 01928019T AT 01928019 T AT01928019 T AT 01928019T AT E328310 T1 ATE328310 T1 AT E328310T1
- Authority
- AT
- Austria
- Prior art keywords
- process chamber
- atmosphere
- speed
- pump
- primary pump
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D16/00—Control of fluid pressure
- G05D16/20—Control of fluid pressure characterised by the use of electric means
- G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
- G05D16/2066—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source
- G05D16/2073—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source with a plurality of pressure sources
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D27/00—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
- G05D27/02—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/6851—With casing, support, protector or static constructional installations
- Y10T137/6966—Static constructional installations
- Y10T137/6969—Buildings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85978—With pump
- Y10T137/86083—Vacuum pump
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85978—With pump
- Y10T137/86131—Plural
- Y10T137/86139—Serial
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Fluid Mechanics (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0005094A FR2808098B1 (fr) | 2000-04-20 | 2000-04-20 | Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE328310T1 true ATE328310T1 (de) | 2006-06-15 |
Family
ID=8849454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01928019T ATE328310T1 (de) | 2000-04-20 | 2001-04-20 | Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US6316045B1 (de) |
| EP (1) | EP1190285B1 (de) |
| JP (1) | JP2003532283A (de) |
| AT (1) | ATE328310T1 (de) |
| DE (1) | DE60120064T2 (de) |
| FR (1) | FR2808098B1 (de) |
| WO (1) | WO2001082019A1 (de) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW518639B (en) | 1999-11-18 | 2003-01-21 | Tokyo Electron Ltd | Heat treatment device, cooling treatment device and cooling treatment method |
| US6684122B1 (en) * | 2000-01-03 | 2004-01-27 | Advanced Micro Devices, Inc. | Control mechanism for matching process parameters in a multi-chamber process tool |
| FR2808098B1 (fr) * | 2000-04-20 | 2002-07-19 | Cit Alcatel | Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes |
| WO2001096972A2 (en) * | 2000-06-14 | 2001-12-20 | Applied Materials, Inc. | Methods and apparatus for maintaining a pressure within an environmentally controlled chamber |
| ATE493368T1 (de) * | 2001-03-29 | 2011-01-15 | Toyota Chuo Kenkyusho Kk | Ein verfahren zum erzeugen einer hohlen struktur aus einer silizium-struktur |
| JP2003074468A (ja) * | 2001-08-31 | 2003-03-12 | Toshiba Corp | 真空排気システム及びその監視・制御方法 |
| US6896764B2 (en) * | 2001-11-28 | 2005-05-24 | Tokyo Electron Limited | Vacuum processing apparatus and control method thereof |
| US6893506B2 (en) * | 2002-03-11 | 2005-05-17 | Micron Technology, Inc. | Atomic layer deposition apparatus and method |
| FR2839335B1 (fr) | 2002-05-02 | 2004-07-16 | Cit Alcatel | Dispositif d'integration de systeme de pompage a vide dans un faux-plancher de salle blanche d'une usine de fabrication de composants semi-conducteurs |
| FR2839331B1 (fr) * | 2002-05-02 | 2004-07-16 | Cit Alcatel | Installation de fabrication de composants semi-conducteurs a faux-plancher ventile |
| FR2840925B1 (fr) * | 2002-06-18 | 2005-04-01 | Riber | Chambre d'evaporation de materiaux sous vide a pompage differentiel |
| GB0214273D0 (en) * | 2002-06-20 | 2002-07-31 | Boc Group Plc | Apparatus for controlling the pressure in a process chamber and method of operating same |
| TW555652B (en) * | 2002-10-25 | 2003-10-01 | Ritdisplay Corp | Ink jet printing device and method |
| JP4448297B2 (ja) * | 2002-12-27 | 2010-04-07 | 株式会社荏原製作所 | 基板研磨装置及び基板研磨方法 |
| US7335277B2 (en) * | 2003-09-08 | 2008-02-26 | Hitachi High-Technologies Corporation | Vacuum processing apparatus |
| WO2005028871A1 (en) * | 2003-09-23 | 2005-03-31 | The Boc Group Plc | Cleaning method of a rotary piston vacuum pump |
| FR2880105B1 (fr) * | 2004-12-23 | 2007-04-20 | Cie Financiere Alcatel Sa | Dispositif et procede de pilotage de l'operation de deshydratation durant un traitement de lyophilisation |
| US20060240680A1 (en) * | 2005-04-25 | 2006-10-26 | Applied Materials, Inc. | Substrate processing platform allowing processing in different ambients |
| CN101389786A (zh) * | 2006-02-28 | 2009-03-18 | Nxp股份有限公司 | 处理装置和在该处理装置中处理晶片的方法 |
| KR20080104372A (ko) * | 2006-03-16 | 2008-12-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 전자 장치 제조 시스템의 압력 제어 방법 및 장치 |
| US8026113B2 (en) * | 2006-03-24 | 2011-09-27 | Tokyo Electron Limited | Method of monitoring a semiconductor processing system using a wireless sensor network |
| CN101678407A (zh) * | 2007-05-25 | 2010-03-24 | 应用材料股份有限公司 | 用于减量系统的有效操作的方法与装置 |
| JP2010528475A (ja) * | 2007-05-25 | 2010-08-19 | アプライド マテリアルズ インコーポレイテッド | 電子デバイス製造システムを組み立てる及び運転する方法及び装置 |
| US20090018688A1 (en) * | 2007-06-15 | 2009-01-15 | Applied Materials, Inc. | Methods and systems for designing and validating operation of abatement systems |
| JP4959457B2 (ja) * | 2007-07-26 | 2012-06-20 | 東京エレクトロン株式会社 | 基板搬送モジュール及び基板処理システム |
| JP2011501102A (ja) * | 2007-10-26 | 2011-01-06 | アプライド マテリアルズ インコーポレイテッド | 改良された燃料回路を使用した高性能な除害の方法及び装置 |
| US9997325B2 (en) | 2008-07-17 | 2018-06-12 | Verity Instruments, Inc. | Electron beam exciter for use in chemical analysis in processing systems |
| FR2940322B1 (fr) * | 2008-12-19 | 2011-02-11 | Alcatel Lucent | Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe |
| FR2946736A1 (fr) * | 2009-06-12 | 2010-12-17 | Alcatel Lucent | Station et procede de sechage et/ou de degazage d'un produit ou d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats |
| US8530787B2 (en) * | 2009-12-16 | 2013-09-10 | Flow Systems, Inc. | Flow tester for laser drilled holes |
| FR2955927B1 (fr) * | 2010-02-01 | 2012-04-06 | Alcatel Lucent | Dispositif et procede de pilotage d'une operation de deshydratation durant un traitement de lyophilisation |
| DE102012010522A1 (de) * | 2012-05-25 | 2013-11-28 | Hydac Fluidtechnik Gmbh | Ventil für Ventilanordnung |
| JP5304934B2 (ja) * | 2012-07-25 | 2013-10-02 | 富士通セミコンダクター株式会社 | 真空ポンプの運転方法及び半導体装置の製造方法 |
| GB2584881B (en) * | 2019-06-19 | 2022-01-05 | Edwards Vacuum Llc | Multiple vacuum chamber exhaust system and method of evacuating multiple chambers |
| US12362211B2 (en) | 2022-11-15 | 2025-07-15 | Applied Materials, Inc. | Detecting defects of semiconductor manufacturing assemblies |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4360087A (en) * | 1980-05-27 | 1982-11-23 | Mechanical Technology Incorporated | Suspension and vibration isolation system for a linear reciprocating machine |
| EP0189279B1 (de) * | 1985-01-22 | 1991-10-09 | Applied Materials, Inc. | Halbleiter-Bearbeitungseinrichtung |
| US4795497A (en) * | 1985-08-13 | 1989-01-03 | Mcconnell Christopher F | Method and system for fluid treatment of semiconductor wafers |
| US4835114A (en) * | 1986-02-19 | 1989-05-30 | Hitachi, Ltd. | Method for LPCVD of semiconductors using oil free vacuum pumps |
| US4852516A (en) * | 1986-05-19 | 1989-08-01 | Machine Technology, Inc. | Modular processing apparatus for processing semiconductor wafers |
| JPS63266813A (ja) * | 1987-04-24 | 1988-11-02 | Hitachi Ltd | 半導体装置の製造方法及びそれに使用する処理装置 |
| JP2663549B2 (ja) * | 1988-09-02 | 1997-10-15 | 株式会社日本自動車部品総合研究所 | 真空装置の圧力制御方法 |
| FR2640697B1 (fr) * | 1988-12-16 | 1993-01-08 | Cit Alcatel | Ensemble de pompage pour l'obtention de vides eleves |
| JP3105063B2 (ja) * | 1992-03-27 | 2000-10-30 | 株式会社東芝 | 薄膜評価方法 |
| KR100267617B1 (ko) * | 1993-04-23 | 2000-10-16 | 히가시 데쓰로 | 진공처리장치 및 진공처리방법 |
| JP3501524B2 (ja) * | 1994-07-01 | 2004-03-02 | 東京エレクトロン株式会社 | 処理装置の真空排気システム |
| IL117775A (en) * | 1995-04-25 | 1998-10-30 | Ebara Germany Gmbh | Inhalation system with gas exhaust cleaner and operating process for it |
| WO1997024760A1 (en) * | 1995-12-28 | 1997-07-10 | Nippon Sanso Corporation | Method and device for transferring thin plate-like substrate |
| US5758680A (en) * | 1996-03-29 | 1998-06-02 | Lam Research Corporation | Method and apparatus for pressure control in vacuum processors |
| US5971711A (en) * | 1996-05-21 | 1999-10-26 | Ebara Corporation | Vacuum pump control system |
| JPH09324268A (ja) * | 1996-06-07 | 1997-12-16 | Fujitsu Ltd | 真空処理装置 |
| KR0183912B1 (ko) * | 1996-08-08 | 1999-05-01 | 김광호 | 다중 반응 챔버에 연결된 펌핑 설비 및 이를 사용하는 방법 |
| US5718029A (en) * | 1996-11-06 | 1998-02-17 | Vanguard International Semiconductor Corporation | Pre-installation of pumping line for efficient fab expansion |
| JP2001524872A (ja) * | 1997-04-18 | 2001-12-04 | サエス・ピュア・ガス・インコーポレーテッド | インシトゥ・ゲッタ・ポンプ・システム及び方法 |
| US6312525B1 (en) * | 1997-07-11 | 2001-11-06 | Applied Materials, Inc. | Modular architecture for semiconductor wafer fabrication equipment |
| US6206970B1 (en) * | 1997-09-03 | 2001-03-27 | Micron Technology, Inc. | Semiconductor wafer processor, semiconductor processor gas filtering system and semiconductor processing methods |
| SE512787C2 (sv) * | 1997-10-03 | 2000-05-15 | Abb Ab | Metod, reglerparadigm och anordning för att vid torkning styra och övervaka processvariablerna för en processgas vilken strömmar genom en för torkningen använd kammare |
| US7077159B1 (en) * | 1998-12-23 | 2006-07-18 | Applied Materials, Inc. | Processing apparatus having integrated pumping system |
| US6517634B2 (en) * | 2000-02-28 | 2003-02-11 | Applied Materials, Inc. | Chemical vapor deposition chamber lid assembly |
| FR2808098B1 (fr) * | 2000-04-20 | 2002-07-19 | Cit Alcatel | Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes |
| US20020162938A1 (en) * | 2000-11-03 | 2002-11-07 | Applied Materials, Inc. | Facilities connection bucket for pre-facilitation of wafer fabrication equipment |
| US7063301B2 (en) * | 2000-11-03 | 2006-06-20 | Applied Materials, Inc. | Facilities connection bucket for pre-facilitation of wafer fabrication equipment |
-
2000
- 2000-04-20 FR FR0005094A patent/FR2808098B1/fr not_active Expired - Fee Related
- 2000-07-12 US US09/614,591 patent/US6316045B1/en not_active Expired - Fee Related
-
2001
- 2001-04-20 WO PCT/FR2001/001220 patent/WO2001082019A1/fr not_active Ceased
- 2001-04-20 AT AT01928019T patent/ATE328310T1/de not_active IP Right Cessation
- 2001-04-20 EP EP01928019A patent/EP1190285B1/de not_active Expired - Lifetime
- 2001-04-20 DE DE60120064T patent/DE60120064T2/de not_active Expired - Lifetime
- 2001-04-20 JP JP2001579047A patent/JP2003532283A/ja active Pending
- 2001-10-19 US US09/981,745 patent/US6649019B2/en not_active Expired - Fee Related
- 2001-10-19 US US09/981,743 patent/US7219692B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE60120064T2 (de) | 2006-12-21 |
| US20020153102A1 (en) | 2002-10-24 |
| US6649019B2 (en) | 2003-11-18 |
| WO2001082019A1 (fr) | 2001-11-01 |
| FR2808098B1 (fr) | 2002-07-19 |
| DE60120064D1 (de) | 2006-07-06 |
| US6316045B1 (en) | 2001-11-13 |
| US20020022283A1 (en) | 2002-02-21 |
| JP2003532283A (ja) | 2003-10-28 |
| US7219692B2 (en) | 2007-05-22 |
| EP1190285B1 (de) | 2006-05-31 |
| EP1190285A1 (de) | 2002-03-27 |
| FR2808098A1 (fr) | 2001-10-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |