ATE328310T1 - Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum - Google Patents

Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum

Info

Publication number
ATE328310T1
ATE328310T1 AT01928019T AT01928019T ATE328310T1 AT E328310 T1 ATE328310 T1 AT E328310T1 AT 01928019 T AT01928019 T AT 01928019T AT 01928019 T AT01928019 T AT 01928019T AT E328310 T1 ATE328310 T1 AT E328310T1
Authority
AT
Austria
Prior art keywords
process chamber
atmosphere
speed
pump
primary pump
Prior art date
Application number
AT01928019T
Other languages
English (en)
Inventor
Roland Bernard
Eric Chevalier
Gloria Sogan
Original Assignee
Cit Alcatel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cit Alcatel filed Critical Cit Alcatel
Application granted granted Critical
Publication of ATE328310T1 publication Critical patent/ATE328310T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0402Apparatus for fluid treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00Control of fluid pressure
    • G05D16/20Control of fluid pressure characterised by the use of electric means
    • G05D16/2006Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2066Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source
    • G05D16/2073Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source with a plurality of pressure sources
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D27/00Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
    • G05D27/02Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/6851With casing, support, protector or static constructional installations
    • Y10T137/6966Static constructional installations
    • Y10T137/6969Buildings
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/8593Systems
    • Y10T137/85978With pump
    • Y10T137/86083Vacuum pump
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/8593Systems
    • Y10T137/85978With pump
    • Y10T137/86131Plural
    • Y10T137/86139Serial

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT01928019T 2000-04-20 2001-04-20 Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum ATE328310T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0005094A FR2808098B1 (fr) 2000-04-20 2000-04-20 Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes

Publications (1)

Publication Number Publication Date
ATE328310T1 true ATE328310T1 (de) 2006-06-15

Family

ID=8849454

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01928019T ATE328310T1 (de) 2000-04-20 2001-04-20 Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum

Country Status (7)

Country Link
US (3) US6316045B1 (de)
EP (1) EP1190285B1 (de)
JP (1) JP2003532283A (de)
AT (1) ATE328310T1 (de)
DE (1) DE60120064T2 (de)
FR (1) FR2808098B1 (de)
WO (1) WO2001082019A1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW518639B (en) 1999-11-18 2003-01-21 Tokyo Electron Ltd Heat treatment device, cooling treatment device and cooling treatment method
US6684122B1 (en) * 2000-01-03 2004-01-27 Advanced Micro Devices, Inc. Control mechanism for matching process parameters in a multi-chamber process tool
FR2808098B1 (fr) * 2000-04-20 2002-07-19 Cit Alcatel Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes
WO2001096972A2 (en) * 2000-06-14 2001-12-20 Applied Materials, Inc. Methods and apparatus for maintaining a pressure within an environmentally controlled chamber
ATE493368T1 (de) * 2001-03-29 2011-01-15 Toyota Chuo Kenkyusho Kk Ein verfahren zum erzeugen einer hohlen struktur aus einer silizium-struktur
JP2003074468A (ja) * 2001-08-31 2003-03-12 Toshiba Corp 真空排気システム及びその監視・制御方法
US6896764B2 (en) * 2001-11-28 2005-05-24 Tokyo Electron Limited Vacuum processing apparatus and control method thereof
US6893506B2 (en) * 2002-03-11 2005-05-17 Micron Technology, Inc. Atomic layer deposition apparatus and method
FR2839335B1 (fr) 2002-05-02 2004-07-16 Cit Alcatel Dispositif d'integration de systeme de pompage a vide dans un faux-plancher de salle blanche d'une usine de fabrication de composants semi-conducteurs
FR2839331B1 (fr) * 2002-05-02 2004-07-16 Cit Alcatel Installation de fabrication de composants semi-conducteurs a faux-plancher ventile
FR2840925B1 (fr) * 2002-06-18 2005-04-01 Riber Chambre d'evaporation de materiaux sous vide a pompage differentiel
GB0214273D0 (en) * 2002-06-20 2002-07-31 Boc Group Plc Apparatus for controlling the pressure in a process chamber and method of operating same
TW555652B (en) * 2002-10-25 2003-10-01 Ritdisplay Corp Ink jet printing device and method
JP4448297B2 (ja) * 2002-12-27 2010-04-07 株式会社荏原製作所 基板研磨装置及び基板研磨方法
US7335277B2 (en) * 2003-09-08 2008-02-26 Hitachi High-Technologies Corporation Vacuum processing apparatus
WO2005028871A1 (en) * 2003-09-23 2005-03-31 The Boc Group Plc Cleaning method of a rotary piston vacuum pump
FR2880105B1 (fr) * 2004-12-23 2007-04-20 Cie Financiere Alcatel Sa Dispositif et procede de pilotage de l'operation de deshydratation durant un traitement de lyophilisation
US20060240680A1 (en) * 2005-04-25 2006-10-26 Applied Materials, Inc. Substrate processing platform allowing processing in different ambients
CN101389786A (zh) * 2006-02-28 2009-03-18 Nxp股份有限公司 处理装置和在该处理装置中处理晶片的方法
KR20080104372A (ko) * 2006-03-16 2008-12-02 어플라이드 머티어리얼스, 인코포레이티드 전자 장치 제조 시스템의 압력 제어 방법 및 장치
US8026113B2 (en) * 2006-03-24 2011-09-27 Tokyo Electron Limited Method of monitoring a semiconductor processing system using a wireless sensor network
CN101678407A (zh) * 2007-05-25 2010-03-24 应用材料股份有限公司 用于减量系统的有效操作的方法与装置
JP2010528475A (ja) * 2007-05-25 2010-08-19 アプライド マテリアルズ インコーポレイテッド 電子デバイス製造システムを組み立てる及び運転する方法及び装置
US20090018688A1 (en) * 2007-06-15 2009-01-15 Applied Materials, Inc. Methods and systems for designing and validating operation of abatement systems
JP4959457B2 (ja) * 2007-07-26 2012-06-20 東京エレクトロン株式会社 基板搬送モジュール及び基板処理システム
JP2011501102A (ja) * 2007-10-26 2011-01-06 アプライド マテリアルズ インコーポレイテッド 改良された燃料回路を使用した高性能な除害の方法及び装置
US9997325B2 (en) 2008-07-17 2018-06-12 Verity Instruments, Inc. Electron beam exciter for use in chemical analysis in processing systems
FR2940322B1 (fr) * 2008-12-19 2011-02-11 Alcatel Lucent Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe
FR2946736A1 (fr) * 2009-06-12 2010-12-17 Alcatel Lucent Station et procede de sechage et/ou de degazage d'un produit ou d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats
US8530787B2 (en) * 2009-12-16 2013-09-10 Flow Systems, Inc. Flow tester for laser drilled holes
FR2955927B1 (fr) * 2010-02-01 2012-04-06 Alcatel Lucent Dispositif et procede de pilotage d'une operation de deshydratation durant un traitement de lyophilisation
DE102012010522A1 (de) * 2012-05-25 2013-11-28 Hydac Fluidtechnik Gmbh Ventil für Ventilanordnung
JP5304934B2 (ja) * 2012-07-25 2013-10-02 富士通セミコンダクター株式会社 真空ポンプの運転方法及び半導体装置の製造方法
GB2584881B (en) * 2019-06-19 2022-01-05 Edwards Vacuum Llc Multiple vacuum chamber exhaust system and method of evacuating multiple chambers
US12362211B2 (en) 2022-11-15 2025-07-15 Applied Materials, Inc. Detecting defects of semiconductor manufacturing assemblies

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4360087A (en) * 1980-05-27 1982-11-23 Mechanical Technology Incorporated Suspension and vibration isolation system for a linear reciprocating machine
EP0189279B1 (de) * 1985-01-22 1991-10-09 Applied Materials, Inc. Halbleiter-Bearbeitungseinrichtung
US4795497A (en) * 1985-08-13 1989-01-03 Mcconnell Christopher F Method and system for fluid treatment of semiconductor wafers
US4835114A (en) * 1986-02-19 1989-05-30 Hitachi, Ltd. Method for LPCVD of semiconductors using oil free vacuum pumps
US4852516A (en) * 1986-05-19 1989-08-01 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
JPS63266813A (ja) * 1987-04-24 1988-11-02 Hitachi Ltd 半導体装置の製造方法及びそれに使用する処理装置
JP2663549B2 (ja) * 1988-09-02 1997-10-15 株式会社日本自動車部品総合研究所 真空装置の圧力制御方法
FR2640697B1 (fr) * 1988-12-16 1993-01-08 Cit Alcatel Ensemble de pompage pour l'obtention de vides eleves
JP3105063B2 (ja) * 1992-03-27 2000-10-30 株式会社東芝 薄膜評価方法
KR100267617B1 (ko) * 1993-04-23 2000-10-16 히가시 데쓰로 진공처리장치 및 진공처리방법
JP3501524B2 (ja) * 1994-07-01 2004-03-02 東京エレクトロン株式会社 処理装置の真空排気システム
IL117775A (en) * 1995-04-25 1998-10-30 Ebara Germany Gmbh Inhalation system with gas exhaust cleaner and operating process for it
WO1997024760A1 (en) * 1995-12-28 1997-07-10 Nippon Sanso Corporation Method and device for transferring thin plate-like substrate
US5758680A (en) * 1996-03-29 1998-06-02 Lam Research Corporation Method and apparatus for pressure control in vacuum processors
US5971711A (en) * 1996-05-21 1999-10-26 Ebara Corporation Vacuum pump control system
JPH09324268A (ja) * 1996-06-07 1997-12-16 Fujitsu Ltd 真空処理装置
KR0183912B1 (ko) * 1996-08-08 1999-05-01 김광호 다중 반응 챔버에 연결된 펌핑 설비 및 이를 사용하는 방법
US5718029A (en) * 1996-11-06 1998-02-17 Vanguard International Semiconductor Corporation Pre-installation of pumping line for efficient fab expansion
JP2001524872A (ja) * 1997-04-18 2001-12-04 サエス・ピュア・ガス・インコーポレーテッド インシトゥ・ゲッタ・ポンプ・システム及び方法
US6312525B1 (en) * 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
US6206970B1 (en) * 1997-09-03 2001-03-27 Micron Technology, Inc. Semiconductor wafer processor, semiconductor processor gas filtering system and semiconductor processing methods
SE512787C2 (sv) * 1997-10-03 2000-05-15 Abb Ab Metod, reglerparadigm och anordning för att vid torkning styra och övervaka processvariablerna för en processgas vilken strömmar genom en för torkningen använd kammare
US7077159B1 (en) * 1998-12-23 2006-07-18 Applied Materials, Inc. Processing apparatus having integrated pumping system
US6517634B2 (en) * 2000-02-28 2003-02-11 Applied Materials, Inc. Chemical vapor deposition chamber lid assembly
FR2808098B1 (fr) * 2000-04-20 2002-07-19 Cit Alcatel Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes
US20020162938A1 (en) * 2000-11-03 2002-11-07 Applied Materials, Inc. Facilities connection bucket for pre-facilitation of wafer fabrication equipment
US7063301B2 (en) * 2000-11-03 2006-06-20 Applied Materials, Inc. Facilities connection bucket for pre-facilitation of wafer fabrication equipment

Also Published As

Publication number Publication date
DE60120064T2 (de) 2006-12-21
US20020153102A1 (en) 2002-10-24
US6649019B2 (en) 2003-11-18
WO2001082019A1 (fr) 2001-11-01
FR2808098B1 (fr) 2002-07-19
DE60120064D1 (de) 2006-07-06
US6316045B1 (en) 2001-11-13
US20020022283A1 (en) 2002-02-21
JP2003532283A (ja) 2003-10-28
US7219692B2 (en) 2007-05-22
EP1190285B1 (de) 2006-05-31
EP1190285A1 (de) 2002-03-27
FR2808098A1 (fr) 2001-10-26

Similar Documents

Publication Publication Date Title
DE60120064D1 (de) Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum
DE50206937D1 (de) Verfahren und vorrichtung zur messung des sauerstoffgehaltes in einem abgeschlossenen zielraum
ATE116718T1 (de) Verfahren und vorrichtung zur regelung eines verdichtersystems.
DE60208483D1 (de) Verfahren und Vorrichtung zur Kraftstoffregelung von Gasturbinen
CN203042539U (zh) 动物全烟气暴露系统
DE60207319D1 (de) Verfahren und Vorrichtung zur Brandbekämpfung in einem Flugzeugabteil, das mit dieser Vorrichtung ausgerüstet ist
ATE302636T1 (de) Verfahren und vorrichtung für atemluftproduktion
DE69705226D1 (de) Verfahren und vorrichtung zur agglomerierung von partikeln in einem gasstrom
ATE169111T1 (de) Verfahren und vorrichtung zur schnellen kontinuierlichen analyse eines gasgemisches
ATE348250T1 (de) Verfahren und vorrichtung zur behandlung eines gasstroms
CA2266061A1 (en) Isothermal flow controller for air sampler
ATE114021T1 (de) Verfahren zur vermeidung des pumpens eines turboverdichters mittels abblaseregelung.
DE50014032D1 (de) Verfahren und Vorrichtung für die Frischluftbestimmung an einer Brennkraftmaschine
ATE479488T1 (de) Verfahren und vorrichtung zur behandlung eines gasstroms
ATE397202T1 (de) Verfahren und vorrichtung zur dichtheitsprüfung einer abgasanlage
DE502005009582D1 (de) Verfahren und Vorrichtung zum Stauchkräuseln eines multifilen Fadens
EP0332931A3 (de) Verfahren zum Verschliessen von Rohrleitungen durch Einfrieren und Vorrichtung zur Durchführung des Verfahrens
ATE286202T1 (de) Vorrichtung zur reduzierung von schallemissionen und verfahren zur herstellung einer solchen vorrichtung
ATE508355T1 (de) Gasentnahme- und -analysesystem
DE60204302D1 (de) Verfahren und vorrichtung zur steuerung eines bohrlochstroms
DE69806742D1 (de) Verfahren und vorrichtung zur abtrennung eines teilstroms aus einem gasfluss
ATE347385T1 (de) Vorrichtung und verfahren zur behandlung von gerüchen eines gasstroms mit kaltplasma
DE502005003602D1 (de) Verfahren und Vorrichtung zur Bestimmung mindestens einer Verbrennungsgrösse eines Verbrennungsvorgangs
DE50207630D1 (de) Verfahren zum Trennen einer Feuerstelle von der Umgebung mittels eines Lufvorhangs und Vorrichtung zum Ausüben des Verfahrens
PL1948354T3 (pl) Układ do napowietrzania i sposób napowietrzania

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties