ATE330852T1 - Laser-markierungsgerät - Google Patents

Laser-markierungsgerät

Info

Publication number
ATE330852T1
ATE330852T1 AT00968097T AT00968097T ATE330852T1 AT E330852 T1 ATE330852 T1 AT E330852T1 AT 00968097 T AT00968097 T AT 00968097T AT 00968097 T AT00968097 T AT 00968097T AT E330852 T1 ATE330852 T1 AT E330852T1
Authority
AT
Austria
Prior art keywords
scanner
optical element
motion
substrate
optical
Prior art date
Application number
AT00968097T
Other languages
English (en)
Inventor
Daniel J Ryan
Original Assignee
Videojet Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Videojet Technologies Inc filed Critical Videojet Technologies Inc
Application granted granted Critical
Publication of ATE330852T1 publication Critical patent/ATE330852T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
    • B65C9/00—Details of labelling machines or apparatus
    • B65C9/46—Applying date marks, code marks, or the like, to the label during labelling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
    • G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
    • G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Semiconductor Lasers (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laser Beam Printer (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Facsimile Scanning Arrangements (AREA)
  • Labeling Devices (AREA)
AT00968097T 1999-10-15 2000-10-13 Laser-markierungsgerät ATE330852T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41874399A 1999-10-15 1999-10-15
US09/608,315 US6469729B1 (en) 1999-10-15 2000-06-30 Laser marking device and method for marking arcuate surfaces

Publications (1)

Publication Number Publication Date
ATE330852T1 true ATE330852T1 (de) 2006-07-15

Family

ID=27024249

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00968097T ATE330852T1 (de) 1999-10-15 2000-10-13 Laser-markierungsgerät

Country Status (10)

Country Link
US (1) US6469729B1 (de)
EP (1) EP1226075B1 (de)
JP (1) JP2003512261A (de)
CN (1) CN1188287C (de)
AT (1) ATE330852T1 (de)
AU (1) AU774571B2 (de)
DE (1) DE60028995T2 (de)
DK (1) DK1226075T3 (de)
ES (1) ES2269186T3 (de)
WO (1) WO2001028867A1 (de)

Families Citing this family (57)

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US7401874B2 (en) * 2004-03-23 2008-07-22 Khs Usa, Inc. Coder assembly
JP4603838B2 (ja) * 2004-09-13 2010-12-22 発紘電機株式会社 レーザ印字装置、そのプログラム
JP5013699B2 (ja) * 2005-10-21 2012-08-29 株式会社キーエンス ３次元加工データ設定装置、３次元加工データ設定方法、３次元加工データ設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工装置
JP5132900B2 (ja) * 2006-06-28 2013-01-30 株式会社キーエンス レーザ加工条件設定装置、レーザ加工装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム
JP4958489B2 (ja) * 2006-06-30 2012-06-20 株式会社キーエンス レーザ加工装置、レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム
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FR2907370B1 (fr) * 2006-10-18 2017-11-17 Tiama Procede et installation pour le marquage a chaud d'objets translucides ou transparents
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US10016876B2 (en) 2007-11-05 2018-07-10 Baker Hughes, A Ge Company, Llc Methods of forming polycrystalline compacts and earth-boring tools including polycrystalline compacts
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ES2336987B1 (es) 2007-12-31 2011-03-22 ON-LASER SYSTEMS & APPLICATIONS, S.L. Procedimiento y dispositivo de marcaje rotativo.
US20100078419A1 (en) * 2008-09-26 2010-04-01 Electro Scientific Industries, Inc Post-lens steering of a laser beam for micro-machining applications
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US9561669B2 (en) * 2010-04-30 2017-02-07 Markem-Imaje Corporation Laser marking using scalable fonts
CN101879664A (zh) * 2010-06-21 2010-11-10 苏州市博海激光科技有限公司 聚焦光点小范围二维摆动式激光辊类表面毛化加工方法及装置
EP2471669B1 (de) 2010-12-30 2013-07-10 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Markierungsvorrichtung
EP2472842B1 (de) 2010-12-30 2020-03-04 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Sensorgerät
DK2472268T3 (da) 2010-12-30 2013-03-04 Alltec Angewandte Laserlicht Technologie Gmbh Markerings- eller scanningsapparat med en måleindretning til måling af hastigheden af en genstand samt fremgangsmåde til måling af hastigheden af en genstand med et sådant markerings- eller scanningsapparat
ES2409886T3 (es) 2010-12-30 2013-06-28 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositivo para marcar y/o escanear un objeto
DK2471666T3 (da) * 2010-12-30 2012-10-01 Alltec Angewandte Laserlicht Technologie Gmbh Markeringsindretning og fremgangsmåde til drift af en markeringsindretning
ES2398134T3 (es) 2010-12-30 2013-03-13 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Procedimiento para aplicar una marca sobre un objeto y aparato de marcado
DK2471665T3 (da) 2010-12-30 2013-05-06 Alltec Angewandte Laserlicht Technologie Gmbh Markerings- og/eller scanningshoved, -indretning og -fremgangsmåde
ES2398780T3 (es) 2010-12-30 2013-03-21 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositivo de vigilancia y procedimiento de vigilancia de elementos de marcado de una cabeza de marcado
DK2472843T3 (en) 2010-12-30 2019-02-25 Alltec Angewandte Laserlicht Tech Gesellschaft Mit Beschraenkter Haftung Method for controlling an apparatus for printing and / or scanning an object
EP2471658B1 (de) 2010-12-30 2018-10-03 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Markierungsvorrichtung
US10052718B2 (en) * 2011-02-10 2018-08-21 Honda Motor Co., Ltd. Cylindrical workpiece cutting apparatus
JP5166589B1 (ja) * 2011-10-21 2013-03-21 ファナック株式会社 加工ヘッドのアプローチ動作を制御するレーザ加工用制御装置
WO2013139028A1 (zh) * 2012-03-22 2013-09-26 深圳市杰普特电子技术有限公司 一种脉冲光纤激光器打标系统
US9024991B2 (en) * 2012-05-28 2015-05-05 Nidec Copal Corporation Laser marker
US20140115886A1 (en) * 2012-10-26 2014-05-01 Volex Plc Method and system for marking substrate and placing components for high accuracy
TWI496651B (zh) * 2013-01-15 2015-08-21 Nat Univ Chung Hsing 檢測裝置與使用其之檢測方法
DE102013212652B4 (de) * 2013-06-28 2016-12-15 Continental Automotive Gmbh Vorrichtung zum Betreiben einer Werkzeugmaschine und Werkzeugmaschine
CN106794564B (zh) 2015-06-22 2019-02-19 伊雷克托科学工业股份有限公司 多轴工具机及其控制方法
CN105057223A (zh) * 2015-08-13 2015-11-18 苏州华拓信息技术有限公司 一种新型农产品分拣装置
US9931714B2 (en) 2015-09-11 2018-04-03 Baker Hughes, A Ge Company, Llc Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams
CN105856858A (zh) * 2016-06-01 2016-08-17 河北大唐激光科技有限公司 一种激光打标机
DE102017218814B4 (de) * 2017-10-20 2019-05-29 Hinterkopf Gmbh Beschriftungseinrichtung und Verfahren zur Beschriftung eines Werkstücks
WO2019193869A1 (ja) * 2018-04-06 2019-10-10 パナソニックＩｐマネジメント株式会社 電極板、電極体及び電池
US10583668B2 (en) * 2018-08-07 2020-03-10 Markem-Imaje Corporation Symbol grouping and striping for wide field matrix laser marking
EP3995249B1 (de) 2020-10-16 2024-04-17 Ricoh Company, Ltd. Musterbildungsvorrichtung für ausgangsmaterial und musterbildungsverfahren
JP7596849B2 (ja) * 2021-02-25 2024-12-10 株式会社リコー マーキング装置、及びマーキング方法
CN112917004A (zh) * 2021-03-31 2021-06-08 张振宇 一种多款式小批量物品用高效型激光打标方法及激光打标装置
CN114054971B (zh) * 2022-01-10 2022-07-12 武汉华工激光工程有限责任公司 一种自动实时gv值检测及补偿的方法和系统
US12168281B2 (en) 2022-01-11 2024-12-17 Baker Hughes Oilfield Operations Llc Polycrystalline diamond compact cutting elements, methods of forming same and earth-boring tools
DE102023125108A1 (de) * 2023-09-18 2025-03-20 Khs Gmbh Vorrichtung und Verfahren zum Markieren von Verpackungen

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Also Published As

Publication number Publication date
DE60028995T2 (de) 2007-02-15
AU7805500A (en) 2001-04-30
EP1226075A1 (de) 2002-07-31
HK1054903A1 (en) 2003-12-19
EP1226075B1 (de) 2006-06-21
JP2003512261A (ja) 2003-04-02
ES2269186T3 (es) 2007-04-01
DE60028995D1 (de) 2006-08-03
WO2001028867A1 (en) 2001-04-26
DK1226075T3 (da) 2006-10-30
CN1409677A (zh) 2003-04-09
US6469729B1 (en) 2002-10-22
AU774571B2 (en) 2004-07-01
CN1188287C (zh) 2005-02-09

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