CN1188287C - 激光打标设备和对基底进行激光打标的方法 - Google Patents
激光打标设备和对基底进行激光打标的方法 Download PDFInfo
- Publication number
- CN1188287C CN1188287C CNB00817220XA CN00817220A CN1188287C CN 1188287 C CN1188287 C CN 1188287C CN B00817220X A CNB00817220X A CN B00817220XA CN 00817220 A CN00817220 A CN 00817220A CN 1188287 C CN1188287 C CN 1188287C
- Authority
- CN
- China
- Prior art keywords
- substrate
- laser beam
- marking
- optical path
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
- B65C9/00—Details of labelling machines or apparatus
- B65C9/46—Applying date marks, code marks, or the like, to the label during labelling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
- G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
- G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Dot-Matrix Printers And Others (AREA)
- Semiconductor Lasers (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Laser Beam Printer (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Facsimile Scanning Arrangements (AREA)
- Labeling Devices (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41874399A | 1999-10-15 | 1999-10-15 | |
| US09/418,743 | 1999-10-15 | ||
| US09/608,315 | 2000-06-30 | ||
| US09/608,315 US6469729B1 (en) | 1999-10-15 | 2000-06-30 | Laser marking device and method for marking arcuate surfaces |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1409677A CN1409677A (zh) | 2003-04-09 |
| CN1188287C true CN1188287C (zh) | 2005-02-09 |
Family
ID=27024249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB00817220XA Expired - Lifetime CN1188287C (zh) | 1999-10-15 | 2000-10-13 | 激光打标设备和对基底进行激光打标的方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6469729B1 (de) |
| EP (1) | EP1226075B1 (de) |
| JP (1) | JP2003512261A (de) |
| CN (1) | CN1188287C (de) |
| AT (1) | ATE330852T1 (de) |
| AU (1) | AU774571B2 (de) |
| DE (1) | DE60028995T2 (de) |
| DK (1) | DK1226075T3 (de) |
| ES (1) | ES2269186T3 (de) |
| WO (1) | WO2001028867A1 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102514413A (zh) * | 2006-10-18 | 2012-06-27 | 蒂阿马公司 | 半透明或透明物体的热烙标记的方法和装备 |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20101247U1 (de) * | 2001-01-24 | 2001-04-05 | Sator Laser GmbH, 22525 Hamburg | Vorrichtung zum Beschriften oder Markieren von Gegenständen mittels Laserstrahl |
| US20030047695A1 (en) * | 2001-09-07 | 2003-03-13 | Preco Laser Systems, Llc | System and method for synchronizing a laser beam to a moving web |
| TWI291729B (en) | 2001-11-22 | 2007-12-21 | Semiconductor Energy Lab | A semiconductor fabricating apparatus |
| US7133737B2 (en) | 2001-11-30 | 2006-11-07 | Semiconductor Energy Laboratory Co., Ltd. | Program for controlling laser apparatus and recording medium for recording program for controlling laser apparatus and capable of being read out by computer |
| US7214573B2 (en) * | 2001-12-11 | 2007-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device that includes patterning sub-islands |
| US7135389B2 (en) * | 2001-12-20 | 2006-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Irradiation method of laser beam |
| JP4141138B2 (ja) * | 2001-12-21 | 2008-08-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| ES2246599B1 (es) * | 2002-03-26 | 2006-11-01 | Grifols, S.A. | Procedimiento y aparato para el control del envasado en condiciones asepticas. |
| JP2004200221A (ja) * | 2002-12-16 | 2004-07-15 | Toray Eng Co Ltd | レーザマーキング方法及び装置 |
| US7401874B2 (en) * | 2004-03-23 | 2008-07-22 | Khs Usa, Inc. | Coder assembly |
| JP4603838B2 (ja) * | 2004-09-13 | 2010-12-22 | 発紘電機株式会社 | レーザ印字装置、そのプログラム |
| JP5013699B2 (ja) * | 2005-10-21 | 2012-08-29 | 株式会社キーエンス | 3次元加工データ設定装置、3次元加工データ設定方法、3次元加工データ設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器並びにレーザ加工装置 |
| JP5132900B2 (ja) * | 2006-06-28 | 2013-01-30 | 株式会社キーエンス | レーザ加工条件設定装置、レーザ加工装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム |
| JP4958489B2 (ja) * | 2006-06-30 | 2012-06-20 | 株式会社キーエンス | レーザ加工装置、レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム |
| JP4795886B2 (ja) * | 2006-07-27 | 2011-10-19 | 株式会社キーエンス | レーザ加工装置、レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム |
| WO2008025016A2 (en) * | 2006-08-25 | 2008-02-28 | The Trustees Of Columbia University In The City Of New York | Systems and methods for high-throughput, minimally-invasive radiation biodosimetry |
| JP4956107B2 (ja) * | 2006-09-15 | 2012-06-20 | 株式会社キーエンス | レーザ加工データ生成装置、レーザ加工データ生成方法、コンピュータプログラム及びレーザマーキングシステム |
| FR2917877B1 (fr) * | 2007-06-22 | 2010-08-27 | Advanced Track & Trace | Procede et dispositif de marquage d'un recipient et procede et dispositif de lecture d'information sur un recipient marque |
| WO2009061766A2 (en) * | 2007-11-05 | 2009-05-14 | Baker Hughes Incorporated | Methods and apparatuses for forming cutting elements having a chamfered edge for earth-boring tools |
| US10016876B2 (en) | 2007-11-05 | 2018-07-10 | Baker Hughes, A Ge Company, Llc | Methods of forming polycrystalline compacts and earth-boring tools including polycrystalline compacts |
| JP4509174B2 (ja) * | 2007-12-27 | 2010-07-21 | 三菱電機株式会社 | レーザ加工装置およびレーザ加工制御装置 |
| ES2336987B1 (es) | 2007-12-31 | 2011-03-22 | ON-LASER SYSTEMS & APPLICATIONS, S.L. | Procedimiento y dispositivo de marcaje rotativo. |
| US20100078419A1 (en) * | 2008-09-26 | 2010-04-01 | Electro Scientific Industries, Inc | Post-lens steering of a laser beam for micro-machining applications |
| CA2774390A1 (en) * | 2009-09-28 | 2011-03-31 | Dematic Corp. | Belt drive conveyor with power tap off |
| US9561669B2 (en) * | 2010-04-30 | 2017-02-07 | Markem-Imaje Corporation | Laser marking using scalable fonts |
| CN101879664A (zh) * | 2010-06-21 | 2010-11-10 | 苏州市博海激光科技有限公司 | 聚焦光点小范围二维摆动式激光辊类表面毛化加工方法及装置 |
| EP2471669B1 (de) | 2010-12-30 | 2013-07-10 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Markierungsvorrichtung |
| EP2472842B1 (de) | 2010-12-30 | 2020-03-04 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Sensorgerät |
| DK2472268T3 (da) | 2010-12-30 | 2013-03-04 | Alltec Angewandte Laserlicht Technologie Gmbh | Markerings- eller scanningsapparat med en måleindretning til måling af hastigheden af en genstand samt fremgangsmåde til måling af hastigheden af en genstand med et sådant markerings- eller scanningsapparat |
| ES2409886T3 (es) | 2010-12-30 | 2013-06-28 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Dispositivo para marcar y/o escanear un objeto |
| DK2471666T3 (da) * | 2010-12-30 | 2012-10-01 | Alltec Angewandte Laserlicht Technologie Gmbh | Markeringsindretning og fremgangsmåde til drift af en markeringsindretning |
| ES2398134T3 (es) | 2010-12-30 | 2013-03-13 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Procedimiento para aplicar una marca sobre un objeto y aparato de marcado |
| DK2471665T3 (da) | 2010-12-30 | 2013-05-06 | Alltec Angewandte Laserlicht Technologie Gmbh | Markerings- og/eller scanningshoved, -indretning og -fremgangsmåde |
| ES2398780T3 (es) | 2010-12-30 | 2013-03-21 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Dispositivo de vigilancia y procedimiento de vigilancia de elementos de marcado de una cabeza de marcado |
| DK2472843T3 (en) | 2010-12-30 | 2019-02-25 | Alltec Angewandte Laserlicht Tech Gesellschaft Mit Beschraenkter Haftung | Method for controlling an apparatus for printing and / or scanning an object |
| EP2471658B1 (de) | 2010-12-30 | 2018-10-03 | ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung | Markierungsvorrichtung |
| US10052718B2 (en) * | 2011-02-10 | 2018-08-21 | Honda Motor Co., Ltd. | Cylindrical workpiece cutting apparatus |
| JP5166589B1 (ja) * | 2011-10-21 | 2013-03-21 | ファナック株式会社 | 加工ヘッドのアプローチ動作を制御するレーザ加工用制御装置 |
| WO2013139028A1 (zh) * | 2012-03-22 | 2013-09-26 | 深圳市杰普特电子技术有限公司 | 一种脉冲光纤激光器打标系统 |
| US9024991B2 (en) * | 2012-05-28 | 2015-05-05 | Nidec Copal Corporation | Laser marker |
| US20140115886A1 (en) * | 2012-10-26 | 2014-05-01 | Volex Plc | Method and system for marking substrate and placing components for high accuracy |
| TWI496651B (zh) * | 2013-01-15 | 2015-08-21 | Nat Univ Chung Hsing | 檢測裝置與使用其之檢測方法 |
| DE102013212652B4 (de) * | 2013-06-28 | 2016-12-15 | Continental Automotive Gmbh | Vorrichtung zum Betreiben einer Werkzeugmaschine und Werkzeugmaschine |
| CN106794564B (zh) | 2015-06-22 | 2019-02-19 | 伊雷克托科学工业股份有限公司 | 多轴工具机及其控制方法 |
| CN105057223A (zh) * | 2015-08-13 | 2015-11-18 | 苏州华拓信息技术有限公司 | 一种新型农产品分拣装置 |
| US9931714B2 (en) | 2015-09-11 | 2018-04-03 | Baker Hughes, A Ge Company, Llc | Methods and systems for removing interstitial material from superabrasive materials of cutting elements using energy beams |
| CN105856858A (zh) * | 2016-06-01 | 2016-08-17 | 河北大唐激光科技有限公司 | 一种激光打标机 |
| DE102017218814B4 (de) * | 2017-10-20 | 2019-05-29 | Hinterkopf Gmbh | Beschriftungseinrichtung und Verfahren zur Beschriftung eines Werkstücks |
| WO2019193869A1 (ja) * | 2018-04-06 | 2019-10-10 | パナソニックIpマネジメント株式会社 | 電極板、電極体及び電池 |
| US10583668B2 (en) * | 2018-08-07 | 2020-03-10 | Markem-Imaje Corporation | Symbol grouping and striping for wide field matrix laser marking |
| EP3995249B1 (de) | 2020-10-16 | 2024-04-17 | Ricoh Company, Ltd. | Musterbildungsvorrichtung für ausgangsmaterial und musterbildungsverfahren |
| JP7596849B2 (ja) * | 2021-02-25 | 2024-12-10 | 株式会社リコー | マーキング装置、及びマーキング方法 |
| CN112917004A (zh) * | 2021-03-31 | 2021-06-08 | 张振宇 | 一种多款式小批量物品用高效型激光打标方法及激光打标装置 |
| CN114054971B (zh) * | 2022-01-10 | 2022-07-12 | 武汉华工激光工程有限责任公司 | 一种自动实时gv值检测及补偿的方法和系统 |
| US12168281B2 (en) | 2022-01-11 | 2024-12-17 | Baker Hughes Oilfield Operations Llc | Polycrystalline diamond compact cutting elements, methods of forming same and earth-boring tools |
| DE102023125108A1 (de) * | 2023-09-18 | 2025-03-20 | Khs Gmbh | Vorrichtung und Verfahren zum Markieren von Verpackungen |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4829175A (en) * | 1985-12-05 | 1989-05-09 | Fuji Photo Film Co., Ltd. | Light beam scanning apparatus, method of correcting unevenness in scanning lines in light beam scanning apparatus, method of detecting deflection of rotational axis of light beam deflector and rotational axis deflection detecting device |
| JPH01237513A (ja) * | 1987-05-13 | 1989-09-22 | Dainippon Screen Mfg Co Ltd | 光ビーム偏向走査装置 |
| JPS6436817U (de) * | 1987-08-28 | 1989-03-06 | ||
| JPH0769521B2 (ja) | 1988-07-13 | 1995-07-31 | 株式会社日立製作所 | 光走査装置及び走査レンズ |
| DE68912008T2 (de) | 1988-07-15 | 1994-07-21 | Philips Nv | Optische Abtastvorrichtung. |
| JPH02174173A (ja) * | 1988-12-26 | 1990-07-05 | Sanyo Electric Co Ltd | 膜の加工方法 |
| ATE152387T1 (de) * | 1991-01-17 | 1997-05-15 | United Distillers Plc | Dynamische lasermarkierung |
| US5287125A (en) | 1991-08-05 | 1994-02-15 | Xerox Corporation | Raster output scanner with process direction spot position control |
| JPH05249811A (ja) * | 1991-11-01 | 1993-09-28 | Toyo Seikan Kaisha Ltd | 表面印刷方法 |
| US5528280A (en) | 1992-11-30 | 1996-06-18 | Kirin Beer Kabushiki Kaisha | Label printing apparatus for laser printing a heat-sensitive color developing ink layer of the label |
| JPH06281872A (ja) | 1993-01-26 | 1994-10-07 | Minolta Camera Co Ltd | 光ビーム走査光学系 |
| EP0629891B1 (de) | 1993-06-18 | 1999-01-27 | Seiko Epson Corporation | Optisches Abtastgerät |
| US5383047A (en) | 1993-06-22 | 1995-01-17 | Xerox Corporation | Ros bow compensation |
| GB2281129B (en) * | 1993-08-19 | 1997-04-09 | United Distillers Plc | Method of marking a body of glass |
| KR100302806B1 (ko) | 1993-12-03 | 2001-11-22 | 다카사키 다케미스 | 주사형레이저마크장치 |
| TW314666B (de) | 1994-05-31 | 1997-09-01 | Ibm | |
| ATE150364T1 (de) | 1994-08-24 | 1997-04-15 | Schablonentechnik Kufstein Ag | Vorrichtung zur herstellung einer druckschablone |
| JP2968228B2 (ja) * | 1997-03-27 | 1999-10-25 | 澁谷工業株式会社 | 情報書込み装置における二重書込み防止機構 |
| DE19739767C2 (de) | 1997-09-10 | 2000-07-20 | Fribosa Ag Werkzeug Und Maschi | Etikettierstation für Gegenstände, wie Flaschen, mit einer Markierungseinrichtung für die Etiketten |
-
2000
- 2000-06-30 US US09/608,315 patent/US6469729B1/en not_active Expired - Lifetime
- 2000-10-13 JP JP2001531669A patent/JP2003512261A/ja active Pending
- 2000-10-13 DK DK00968097T patent/DK1226075T3/da active
- 2000-10-13 CN CNB00817220XA patent/CN1188287C/zh not_active Expired - Lifetime
- 2000-10-13 EP EP00968097A patent/EP1226075B1/de not_active Expired - Lifetime
- 2000-10-13 AT AT00968097T patent/ATE330852T1/de not_active IP Right Cessation
- 2000-10-13 AU AU78055/00A patent/AU774571B2/en not_active Ceased
- 2000-10-13 DE DE60028995T patent/DE60028995T2/de not_active Expired - Lifetime
- 2000-10-13 ES ES00968097T patent/ES2269186T3/es not_active Expired - Lifetime
- 2000-10-13 WO PCT/GB2000/003945 patent/WO2001028867A1/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102514413A (zh) * | 2006-10-18 | 2012-06-27 | 蒂阿马公司 | 半透明或透明物体的热烙标记的方法和装备 |
| CN102514413B (zh) * | 2006-10-18 | 2015-03-25 | 蒂阿马公司 | 半透明或透明物体的热烙标记的方法和装备 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE60028995T2 (de) | 2007-02-15 |
| ATE330852T1 (de) | 2006-07-15 |
| AU7805500A (en) | 2001-04-30 |
| EP1226075A1 (de) | 2002-07-31 |
| HK1054903A1 (en) | 2003-12-19 |
| EP1226075B1 (de) | 2006-06-21 |
| JP2003512261A (ja) | 2003-04-02 |
| ES2269186T3 (es) | 2007-04-01 |
| DE60028995D1 (de) | 2006-08-03 |
| WO2001028867A1 (en) | 2001-04-26 |
| DK1226075T3 (da) | 2006-10-30 |
| CN1409677A (zh) | 2003-04-09 |
| US6469729B1 (en) | 2002-10-22 |
| AU774571B2 (en) | 2004-07-01 |
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| PB01 | Publication | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20050209 |
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