ATE331591T1 - Schleifwerkzeug - Google Patents

Schleifwerkzeug

Info

Publication number
ATE331591T1
ATE331591T1 AT01101689T AT01101689T ATE331591T1 AT E331591 T1 ATE331591 T1 AT E331591T1 AT 01101689 T AT01101689 T AT 01101689T AT 01101689 T AT01101689 T AT 01101689T AT E331591 T1 ATE331591 T1 AT E331591T1
Authority
AT
Austria
Prior art keywords
abrasive
grain
binder phase
layer
parts
Prior art date
Application number
AT01101689T
Other languages
English (en)
Inventor
Tsutomu Takahashi
Naoki Shimomae
Tetsuji Yamashita
Hanako Hata
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Application granted granted Critical
Publication of ATE331591T1 publication Critical patent/ATE331591T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT01101689T 2000-02-07 2001-01-30 Schleifwerkzeug ATE331591T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000029614A JP2001219376A (ja) 2000-02-07 2000-02-07 電着砥石

Publications (1)

Publication Number Publication Date
ATE331591T1 true ATE331591T1 (de) 2006-07-15

Family

ID=18554846

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01101689T ATE331591T1 (de) 2000-02-07 2001-01-30 Schleifwerkzeug

Country Status (6)

Country Link
EP (2) EP1500469A1 (de)
JP (1) JP2001219376A (de)
KR (1) KR100749385B1 (de)
AT (1) ATE331591T1 (de)
DE (1) DE60121070T2 (de)
HK (1) HK1039296A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6669745B2 (en) * 2001-02-21 2003-12-30 3M Innovative Properties Company Abrasive article with optimally oriented abrasive particles and method of making the same
TWI238753B (en) * 2002-12-19 2005-09-01 Miyanaga Kk Diamond disk for grinding
JP2005015868A (ja) * 2003-06-27 2005-01-20 Yuichiro Niizaki 金属粘土素材とこの金属粘土素材で形成したブラシ毛素材、シャンク、ディスク状砥石及びバリ取り冶具
US20060276111A1 (en) * 2005-06-02 2006-12-07 Applied Materials, Inc. Conditioning element for electrochemical mechanical processing
JP4896114B2 (ja) * 2008-11-20 2012-03-14 株式会社ノリタケカンパニーリミテド 電着工具の製造方法
KR101250471B1 (ko) 2011-03-18 2013-04-24 (주)인성다이아몬드 거친면 연마디스크
CN103551999A (zh) * 2013-11-08 2014-02-05 谢泽 一种基于纤维绳生产涂附磨具的方法
CN103552002A (zh) * 2013-11-08 2014-02-05 谢泽 一种基于纤维砂绳涂附磨具的抛光轮
JPWO2015194278A1 (ja) * 2014-06-17 2017-04-20 バンドー化学株式会社 研磨パッド及び研磨パッドの製造方法
EP3319757B1 (de) * 2015-07-08 2020-09-02 3M Innovative Properties Company Systeme und verfahren zur herstellung von schleifkörpern
JP7315332B2 (ja) * 2019-01-31 2023-07-26 株式会社荏原製作所 ダミーディスクおよびダミーディスクを用いた表面高さ測定方法
CN117754474B (zh) * 2023-12-28 2026-01-13 华侨大学 基于磨粒浓度差异分布的磨料研磨盘及其制作方法
JP7763919B1 (ja) * 2024-10-31 2025-11-04 株式会社ジェイテクトグラインディングツール 研削工具及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06114743A (ja) * 1992-04-30 1994-04-26 Osaka Diamond Ind Co Ltd 電着砥石
JP3020434B2 (ja) * 1995-07-07 2000-03-15 旭ダイヤモンド工業株式会社 電着ホイール及びその製造方法
JP2896657B2 (ja) * 1996-06-28 1999-05-31 旭ダイヤモンド工業株式会社 ドレッサ及びその製造方法
JPH1177535A (ja) * 1997-09-09 1999-03-23 Asahi Diamond Ind Co Ltd コンディショナ及びその製造方法
US6004196A (en) * 1998-02-27 1999-12-21 Micron Technology, Inc. Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
JP3295888B2 (ja) * 1998-04-22 2002-06-24 株式会社藤森技術研究所 ケミカルマシンポリッシャの研磨盤用研磨ドレッサ

Also Published As

Publication number Publication date
JP2001219376A (ja) 2001-08-14
EP1122030B1 (de) 2006-06-28
EP1122030A3 (de) 2003-12-10
EP1122030A2 (de) 2001-08-08
KR20010078363A (ko) 2001-08-20
DE60121070T2 (de) 2007-06-06
EP1500469A1 (de) 2005-01-26
HK1039296A1 (en) 2002-04-19
DE60121070D1 (de) 2006-08-10
KR100749385B1 (ko) 2007-08-14

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Legal Events

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