EP1122030A3 - Schleifwerkzeug - Google Patents

Schleifwerkzeug Download PDF

Info

Publication number
EP1122030A3
EP1122030A3 EP01101689A EP01101689A EP1122030A3 EP 1122030 A3 EP1122030 A3 EP 1122030A3 EP 01101689 A EP01101689 A EP 01101689A EP 01101689 A EP01101689 A EP 01101689A EP 1122030 A3 EP1122030 A3 EP 1122030A3
Authority
EP
European Patent Office
Prior art keywords
abrasive
grain
parts
ultra
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP01101689A
Other languages
English (en)
French (fr)
Other versions
EP1122030B1 (de
EP1122030A2 (de
Inventor
Tsutomu Mitsubishi Materials Corp. Takahashi
Naoki Mitsubishi Materials Corp. Shimomae
Tetsuji Mitsubishi Materials Corp. Yamashita
Hanako Mitsubishi Materials Corp. Hata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to EP04024424A priority Critical patent/EP1500469A1/de
Publication of EP1122030A2 publication Critical patent/EP1122030A2/de
Publication of EP1122030A3 publication Critical patent/EP1122030A3/de
Application granted granted Critical
Publication of EP1122030B1 publication Critical patent/EP1122030B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP01101689A 2000-02-07 2001-01-30 Schleifwerkzeug Expired - Lifetime EP1122030B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04024424A EP1500469A1 (de) 2000-02-07 2001-01-30 Schleifwerkzeug

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000029614 2000-02-07
JP2000029614A JP2001219376A (ja) 2000-02-07 2000-02-07 電着砥石

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP04024424A Division EP1500469A1 (de) 2000-02-07 2001-01-30 Schleifwerkzeug

Publications (3)

Publication Number Publication Date
EP1122030A2 EP1122030A2 (de) 2001-08-08
EP1122030A3 true EP1122030A3 (de) 2003-12-10
EP1122030B1 EP1122030B1 (de) 2006-06-28

Family

ID=18554846

Family Applications (2)

Application Number Title Priority Date Filing Date
EP04024424A Withdrawn EP1500469A1 (de) 2000-02-07 2001-01-30 Schleifwerkzeug
EP01101689A Expired - Lifetime EP1122030B1 (de) 2000-02-07 2001-01-30 Schleifwerkzeug

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP04024424A Withdrawn EP1500469A1 (de) 2000-02-07 2001-01-30 Schleifwerkzeug

Country Status (6)

Country Link
EP (2) EP1500469A1 (de)
JP (1) JP2001219376A (de)
KR (1) KR100749385B1 (de)
AT (1) ATE331591T1 (de)
DE (1) DE60121070T2 (de)
HK (1) HK1039296A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6669745B2 (en) * 2001-02-21 2003-12-30 3M Innovative Properties Company Abrasive article with optimally oriented abrasive particles and method of making the same
TWI238753B (en) * 2002-12-19 2005-09-01 Miyanaga Kk Diamond disk for grinding
JP2005015868A (ja) * 2003-06-27 2005-01-20 Yuichiro Niizaki 金属粘土素材とこの金属粘土素材で形成したブラシ毛素材、シャンク、ディスク状砥石及びバリ取り冶具
US20060276111A1 (en) * 2005-06-02 2006-12-07 Applied Materials, Inc. Conditioning element for electrochemical mechanical processing
JP4896114B2 (ja) * 2008-11-20 2012-03-14 株式会社ノリタケカンパニーリミテド 電着工具の製造方法
KR101250471B1 (ko) 2011-03-18 2013-04-24 (주)인성다이아몬드 거친면 연마디스크
CN103551999A (zh) * 2013-11-08 2014-02-05 谢泽 一种基于纤维绳生产涂附磨具的方法
CN103552002A (zh) * 2013-11-08 2014-02-05 谢泽 一种基于纤维砂绳涂附磨具的抛光轮
JPWO2015194278A1 (ja) * 2014-06-17 2017-04-20 バンドー化学株式会社 研磨パッド及び研磨パッドの製造方法
EP3319757B1 (de) * 2015-07-08 2020-09-02 3M Innovative Properties Company Systeme und verfahren zur herstellung von schleifkörpern
JP7315332B2 (ja) * 2019-01-31 2023-07-26 株式会社荏原製作所 ダミーディスクおよびダミーディスクを用いた表面高さ測定方法
CN117754474B (zh) * 2023-12-28 2026-01-13 华侨大学 基于磨粒浓度差异分布的磨料研磨盘及其制作方法
JP7763919B1 (ja) * 2024-10-31 2025-11-04 株式会社ジェイテクトグラインディングツール 研削工具及びその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06114743A (ja) * 1992-04-30 1994-04-26 Osaka Diamond Ind Co Ltd 電着砥石
JPH0919868A (ja) * 1995-07-07 1997-01-21 Asahi Daiyamondo Kogyo Kk 電着ホイール及びその製造方法
JPH1177535A (ja) * 1997-09-09 1999-03-23 Asahi Diamond Ind Co Ltd コンディショナ及びその製造方法
US5989405A (en) * 1996-06-28 1999-11-23 Asahi Diamond Industrial Co., Ltd. Process for producing a dresser
US6001008A (en) * 1998-04-22 1999-12-14 Fujimori Technology Laboratory Inc. Abrasive dresser for polishing disc of chemical-mechanical polisher
US6004196A (en) * 1998-02-27 1999-12-21 Micron Technology, Inc. Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06114743A (ja) * 1992-04-30 1994-04-26 Osaka Diamond Ind Co Ltd 電着砥石
JPH0919868A (ja) * 1995-07-07 1997-01-21 Asahi Daiyamondo Kogyo Kk 電着ホイール及びその製造方法
US5989405A (en) * 1996-06-28 1999-11-23 Asahi Diamond Industrial Co., Ltd. Process for producing a dresser
JPH1177535A (ja) * 1997-09-09 1999-03-23 Asahi Diamond Ind Co Ltd コンディショナ及びその製造方法
US6004196A (en) * 1998-02-27 1999-12-21 Micron Technology, Inc. Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
US6001008A (en) * 1998-04-22 1999-12-14 Fujimori Technology Laboratory Inc. Abrasive dresser for polishing disc of chemical-mechanical polisher

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 396 (M - 1644) 25 July 1994 (1994-07-25) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 05 30 May 1997 (1997-05-30) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 08 30 June 1999 (1999-06-30) *

Also Published As

Publication number Publication date
ATE331591T1 (de) 2006-07-15
JP2001219376A (ja) 2001-08-14
EP1122030B1 (de) 2006-06-28
EP1122030A2 (de) 2001-08-08
KR20010078363A (ko) 2001-08-20
DE60121070T2 (de) 2007-06-06
EP1500469A1 (de) 2005-01-26
HK1039296A1 (en) 2002-04-19
DE60121070D1 (de) 2006-08-10
KR100749385B1 (ko) 2007-08-14

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