ATE332625T1 - Integrierte kühlung einer leiterplattenstruktur - Google Patents

Integrierte kühlung einer leiterplattenstruktur

Info

Publication number
ATE332625T1
ATE332625T1 AT02766904T AT02766904T ATE332625T1 AT E332625 T1 ATE332625 T1 AT E332625T1 AT 02766904 T AT02766904 T AT 02766904T AT 02766904 T AT02766904 T AT 02766904T AT E332625 T1 ATE332625 T1 AT E332625T1
Authority
AT
Austria
Prior art keywords
circuit board
board structure
integrated cooling
electronic components
components
Prior art date
Application number
AT02766904T
Other languages
English (en)
Inventor
Robert Bartola
James Mogel
Steven J Laureanti
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Application granted granted Critical
Publication of ATE332625T1 publication Critical patent/ATE332625T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
AT02766904T 2001-05-01 2002-04-30 Integrierte kühlung einer leiterplattenstruktur ATE332625T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/847,746 US20020163781A1 (en) 2001-05-01 2001-05-01 Integrated cooling of a printed circuit board structure

Publications (1)

Publication Number Publication Date
ATE332625T1 true ATE332625T1 (de) 2006-07-15

Family

ID=25301392

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02766904T ATE332625T1 (de) 2001-05-01 2002-04-30 Integrierte kühlung einer leiterplattenstruktur

Country Status (5)

Country Link
US (1) US20020163781A1 (de)
EP (1) EP1384396B1 (de)
AT (1) ATE332625T1 (de)
DE (1) DE60212957T2 (de)
WO (1) WO2002089539A1 (de)

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US6523998B1 (en) * 2001-01-26 2003-02-25 Ta Instruments, Inc. Thermal analysis assembly with distributed resistance and integral flange for mounting various cooling devices
US6981849B2 (en) * 2002-12-18 2006-01-03 Intel Corporation Electro-osmotic pumps and micro-channels
WO2005004257A2 (en) * 2003-06-27 2005-01-13 Ultracell Corporation Efficient micro fuel cell systems and methods
US7723208B2 (en) * 2003-09-24 2010-05-25 Intel Corporation Integrated re-combiner for electroosmotic pumps using porous frits
PL1846949T3 (pl) * 2005-01-05 2019-01-31 Philips Lighting Holding B.V. Urządzenie przewodzące cieplnie i elektrycznie
DE102005013762C5 (de) * 2005-03-22 2012-12-20 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
DE202005018284U1 (de) * 2005-04-08 2006-02-02 Rittal Gmbh & Co. Kg Kühleinheit
CN100466895C (zh) * 2005-12-15 2009-03-04 英业达股份有限公司 散热结构
US8243090B2 (en) 2007-08-08 2012-08-14 Landmark Screens, Llc Method for mapping a color specified using a smaller color gamut to a larger color gamut
US7768180B2 (en) 2007-08-08 2010-08-03 Landmark Screens, Llc Enclosure for housing a plurality of pixels of a graphical display
US9620038B2 (en) 2007-08-08 2017-04-11 Landmark Screens, Llc Method for displaying a single image for diagnostic purpose without interrupting an observer's perception of the display of a sequence of images
US9779644B2 (en) 2007-08-08 2017-10-03 Landmark Screens, Llc Method for computing drive currents for a plurality of LEDs in a pixel of a signboard to achieve a desired color at a desired luminous intensity
US9262118B2 (en) 2007-08-08 2016-02-16 Landmark Screens, Llc Graphical display comprising a plurality of modules each controlling a group of pixels corresponding to a portion of the graphical display
US9659513B2 (en) 2007-08-08 2017-05-23 Landmark Screens, Llc Method for compensating for a chromaticity shift due to ambient light in an electronic signboard
US9342266B2 (en) 2007-08-08 2016-05-17 Landmark Screens, Llc Apparatus for dynamically circumventing faults in the light emitting diodes (LEDs) of a pixel in a graphical display
US9536463B2 (en) 2007-08-08 2017-01-03 Landmark Screens, Llc Method for fault-healing in a light emitting diode (LED) based display
WO2011058436A2 (en) * 2009-11-10 2011-05-19 Dsem Holdings Sdn. Bhd. Circuit board forming diffusion bonded wall of vapor chamber
DE102011006061B4 (de) * 2011-03-24 2013-12-24 Siemens Aktiengesellschaft Endstufenmodul für eine Leistungsverstärkereinrichtung, Leistungsverstärkereinrichtung und Magnetresonanzeinrichtung
US8730673B2 (en) 2011-05-27 2014-05-20 Lockheed Martin Corporation Fluid-cooled module for integrated circuit devices
GB2512378A (en) * 2013-03-28 2014-10-01 Ibm Device and method for cooling electronic components and for supplying power to the electronic components
DE102015224469A1 (de) 2015-12-07 2017-06-08 Addcon Europe Gmbh Hochdichte Bohrlochflüssigkeiten mit niedrigen Kristallisationstemperaturen
US11602044B2 (en) 2020-07-30 2023-03-07 Toyota Motor Engineering & Manufacturing North America, Inc. Driver board assemblies and methods of forming the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019098A (en) * 1974-11-25 1977-04-19 Sundstrand Corporation Heat pipe cooling system for electronic devices
FR2578099B1 (fr) * 1985-02-26 1987-12-04 Eurofarad Substrat monolithique pour composant electronique de puissance, et procede pour sa fabrication
DE3805851A1 (de) * 1988-02-25 1989-08-31 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
WO1994029900A1 (en) * 1993-06-09 1994-12-22 Lykat Corporation Heat dissipative means for integrated circuit chip package
US5380956A (en) * 1993-07-06 1995-01-10 Sun Microsystems, Inc. Multi-chip cooling module and method
US5763951A (en) * 1996-07-22 1998-06-09 Northrop Grumman Corporation Non-mechanical magnetic pump for liquid cooling
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
DE10023736A1 (de) * 2000-05-15 2001-11-22 Harting Elektrooptische Bauteile Gmbh & Co Kg Leiterplatte sowie Verfahren zur Herstellung einer Leiterplatte
US6377457B1 (en) * 2000-09-13 2002-04-23 Intel Corporation Electronic assembly and cooling thereof

Also Published As

Publication number Publication date
EP1384396A1 (de) 2004-01-28
DE60212957D1 (de) 2006-08-17
WO2002089539A1 (en) 2002-11-07
EP1384396B1 (de) 2006-07-05
US20020163781A1 (en) 2002-11-07
DE60212957T2 (de) 2007-01-25

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