ATE369724T1 - Wärmeableiteinsatz, schaltung mit einem solchen einsatz und verfahren zur herstellung - Google Patents

Wärmeableiteinsatz, schaltung mit einem solchen einsatz und verfahren zur herstellung

Info

Publication number
ATE369724T1
ATE369724T1 AT03425697T AT03425697T ATE369724T1 AT E369724 T1 ATE369724 T1 AT E369724T1 AT 03425697 T AT03425697 T AT 03425697T AT 03425697 T AT03425697 T AT 03425697T AT E369724 T1 ATE369724 T1 AT E369724T1
Authority
AT
Austria
Prior art keywords
insert
board
power component
heat dissipation
electronic power
Prior art date
Application number
AT03425697T
Other languages
English (en)
Inventor
Simone Matini
Original Assignee
Power One Italy Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Power One Italy Spa filed Critical Power One Italy Spa
Application granted granted Critical
Publication of ATE369724T1 publication Critical patent/ATE369724T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
AT03425697T 2003-10-29 2003-10-29 Wärmeableiteinsatz, schaltung mit einem solchen einsatz und verfahren zur herstellung ATE369724T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03425697A EP1528847B1 (de) 2003-10-29 2003-10-29 Wärmeableiteinsatz, Schaltung mit einem solchen Einsatz und Verfahren zur Herstellung

Publications (1)

Publication Number Publication Date
ATE369724T1 true ATE369724T1 (de) 2007-08-15

Family

ID=34400633

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03425697T ATE369724T1 (de) 2003-10-29 2003-10-29 Wärmeableiteinsatz, schaltung mit einem solchen einsatz und verfahren zur herstellung

Country Status (3)

Country Link
EP (1) EP1528847B1 (de)
AT (1) ATE369724T1 (de)
DE (1) DE60315469T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006109206A2 (en) * 2005-04-12 2006-10-19 Nxp B.V. Electronic circuit module comprising a heat producing component
DE102007037297A1 (de) * 2007-08-07 2009-02-19 Continental Automotive Gmbh Schaltungsträgeraufbau mit verbesserter Wärmeableitung
CN102014600B (zh) * 2010-12-21 2012-08-22 摩比天线技术（深圳）有限公司 一种散热结构及其制作方法、具有散热结构的电子设备
DE112012004593B4 (de) * 2011-11-02 2020-10-01 Fuji Electric Co., Ltd. Leistungswandler
FR2999863B1 (fr) * 2012-12-14 2019-05-17 Valeo Systemes Thermiques Circuit imprime comportant un insert caloporteur
JP6711098B2 (ja) * 2016-04-15 2020-06-17 オムロン株式会社 半導体装置の放熱構造
CN108200719A (zh) * 2018-02-28 2018-06-22 浙江联宜电机有限公司 驱动器功率器件散热结构
DE102018215338B3 (de) 2018-09-10 2020-01-16 Dürkopp Adler AG Kühlvorrichtung für mindestens ein auf einer Leiterplatte montiertes Bauelement
DE102019129586A1 (de) * 2019-11-04 2021-05-06 Hanon Systems Verbindungselement zum Verbinden einer Leiterplatte mit einem Kühlkörper und Verfahren zur Herstellung der Verbindung
US11558957B2 (en) 2020-06-12 2023-01-17 Raytheon Company Shape memory thermal capacitor and methods for same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014904A (en) * 1990-01-16 1991-05-14 Cray Research, Inc. Board-mounted thermal path connector and cold plate
DE19516547A1 (de) * 1995-05-05 1996-11-14 Bosch Gmbh Robert Leiterplatte mit elektrisch leitender Schicht und Verfahren zur Herstellung einer Leiterplatte
DE20301773U1 (de) * 2003-02-05 2003-04-17 Leopold Kostal GmbH & Co. KG, 58507 Lüdenscheid Elektrische Einrichtung

Also Published As

Publication number Publication date
DE60315469D1 (de) 2007-09-20
DE60315469T2 (de) 2008-04-24
EP1528847A1 (de) 2005-05-04
EP1528847B1 (de) 2007-08-08

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Legal Events

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