ATE337629T1 - Aktives intelligentes antennengruppensystem und zugehöriges herstellungsverfahren - Google Patents

Aktives intelligentes antennengruppensystem und zugehöriges herstellungsverfahren

Info

Publication number
ATE337629T1
ATE337629T1 AT04005722T AT04005722T ATE337629T1 AT E337629 T1 ATE337629 T1 AT E337629T1 AT 04005722 T AT04005722 T AT 04005722T AT 04005722 T AT04005722 T AT 04005722T AT E337629 T1 ATE337629 T1 AT E337629T1
Authority
AT
Austria
Prior art keywords
antenna
intelligent antenna
associated manufacturing
active intelligent
arrange system
Prior art date
Application number
AT04005722T
Other languages
English (en)
Inventor
Jae Yeong Park
Original Assignee
Lg Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Electronics Inc filed Critical Lg Electronics Inc
Application granted granted Critical
Publication of ATE337629T1 publication Critical patent/ATE337629T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
AT04005722T 2003-03-14 2004-03-10 Aktives intelligentes antennengruppensystem und zugehöriges herstellungsverfahren ATE337629T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030016185A KR100548244B1 (ko) 2003-03-14 2003-03-14 저가형 능동 스마트 안테나 시스템 및 그 제조 방법

Publications (1)

Publication Number Publication Date
ATE337629T1 true ATE337629T1 (de) 2006-09-15

Family

ID=32768652

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04005722T ATE337629T1 (de) 2003-03-14 2004-03-10 Aktives intelligentes antennengruppensystem und zugehöriges herstellungsverfahren

Country Status (7)

Country Link
US (1) US7365683B2 (de)
EP (1) EP1458053B1 (de)
JP (1) JP2004282752A (de)
KR (1) KR100548244B1 (de)
CN (1) CN1531139A (de)
AT (1) ATE337629T1 (de)
DE (1) DE602004002007T2 (de)

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EP1976354A4 (de) * 2006-01-20 2012-08-01 Fujitsu Ltd Chipkomponenten-anbringstruktur, chipkomponenten-anbringverfahren und elektronische einrichtung
CN101496224B (zh) * 2006-07-28 2012-12-12 株式会社村田制作所 天线装置和无线通信设备
US8138588B2 (en) * 2006-12-21 2012-03-20 Texas Instruments Incorporated Package stiffener and a packaged device using the same
US7728771B2 (en) * 2007-07-03 2010-06-01 Northrop Grumman Systems Corporation Dual band quadpack transmit/receive module
WO2009052683A1 (en) * 2007-10-25 2009-04-30 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Electronic circuit package
US20090115051A1 (en) * 2007-11-01 2009-05-07 Lap-Wai Lydia Leung Electronic Circuit Package
US20090189269A1 (en) * 2008-01-24 2009-07-30 Lap-Wai Lydia Leung Electronic Circuit Package
JP5417622B2 (ja) * 2009-08-19 2014-02-19 独立行政法人 宇宙航空研究開発機構 アナログ・デジタル積層型可変移相器
JP2012009828A (ja) * 2010-05-26 2012-01-12 Jtekt Corp 多層回路基板
CN103155064A (zh) * 2010-07-28 2013-06-12 诺基亚公司 远程通信装置及其相关方法
JP5647023B2 (ja) * 2011-01-31 2014-12-24 株式会社ヨコオ 地上放送波受信用アンテナ装置及びその構成部品
USD695277S1 (en) * 2011-04-25 2013-12-10 ChamTech Technologies, Incorporated Antenna
USD652410S1 (en) * 2011-04-25 2012-01-17 ChamTech Technologies, Incorporated Antenna
CN105321937A (zh) * 2014-06-25 2016-02-10 常州欧密格光电科技有限公司 超小超薄高光效侧射型高亮白光多晶led元件
US9667467B2 (en) * 2015-08-25 2017-05-30 The Boeing Company Gain distribution in compact high gain phased array antenna systems and methods
US10256538B2 (en) 2015-08-25 2019-04-09 The Boeing Company Integrated true time delay for broad bandwidth time control systems and methods
CN105186125A (zh) * 2015-08-28 2015-12-23 上海无线电设备研究所 一种星载裸芯片微带天线及其制造方法
EP3586401A4 (de) * 2017-02-24 2020-12-09 AMI Research & Development, LLC Volumetrische schlitzleitungsantenne
CN107958897A (zh) * 2017-11-28 2018-04-24 上海旦迪通信技术有限公司 一种北斗lna集成模块及其制备方法
US12575422B2 (en) 2018-10-16 2026-03-10 Texas Instruments Incorporated Semiconductor package with antenna
WO2021056171A1 (zh) * 2019-09-24 2021-04-01 上海旦迪通信技术有限公司 基于ltcc技术的gnss射频前端模块及其制备方法
CN110943299B (zh) * 2019-11-29 2021-01-08 北京京东方传感技术有限公司 移相器和相控阵天线
CN112103637B (zh) * 2020-08-30 2022-09-02 西南电子技术研究所（中国电子科技集团公司第十研究所） 模块化星载Ka频段有源相控阵天线系统

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Also Published As

Publication number Publication date
CN1531139A (zh) 2004-09-22
EP1458053A1 (de) 2004-09-15
DE602004002007T2 (de) 2006-12-07
KR100548244B1 (ko) 2006-02-02
EP1458053B1 (de) 2006-08-23
DE602004002007D1 (de) 2006-10-05
JP2004282752A (ja) 2004-10-07
US7365683B2 (en) 2008-04-29
KR20040081638A (ko) 2004-09-22
US20040178959A1 (en) 2004-09-16

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