ATE337696T1 - Verfahren zur befestigung einer leiterplatte an einem element und führungselement - Google Patents

Verfahren zur befestigung einer leiterplatte an einem element und führungselement

Info

Publication number
ATE337696T1
ATE337696T1 AT01920047T AT01920047T ATE337696T1 AT E337696 T1 ATE337696 T1 AT E337696T1 AT 01920047 T AT01920047 T AT 01920047T AT 01920047 T AT01920047 T AT 01920047T AT E337696 T1 ATE337696 T1 AT E337696T1
Authority
AT
Austria
Prior art keywords
printed board
attaching
circuit board
guide element
guiding
Prior art date
Application number
AT01920047T
Other languages
English (en)
Inventor
Ulf Jansson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Application granted granted Critical
Publication of ATE337696T1 publication Critical patent/ATE337696T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Die Bonding (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Connection Of Plates (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
AT01920047T 2000-04-06 2001-04-05 Verfahren zur befestigung einer leiterplatte an einem element und führungselement ATE337696T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0001269A SE517944C2 (sv) 2000-04-06 2000-04-06 Förfarande och styrelement för fastsättning av ett mönsterkort på ett element

Publications (1)

Publication Number Publication Date
ATE337696T1 true ATE337696T1 (de) 2006-09-15

Family

ID=20279205

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01920047T ATE337696T1 (de) 2000-04-06 2001-04-05 Verfahren zur befestigung einer leiterplatte an einem element und führungselement

Country Status (7)

Country Link
US (1) US6655021B2 (de)
EP (1) EP1279323B1 (de)
AT (1) ATE337696T1 (de)
AU (1) AU2001246991A1 (de)
DE (1) DE60122498D1 (de)
SE (1) SE517944C2 (de)
WO (1) WO2001078477A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1320339B1 (it) * 2000-05-09 2003-11-26 Campagnolo Srl Sistema elettronico di controlo e/o alimentazione per una bicicletta,fissabile nello stesso punto di ancoraggio del gruppo porta-borraccia.
DE10328282A1 (de) * 2003-06-23 2005-01-27 Rexroth Indramat Gmbh Verbindungsstift für die Verbindung zweier Platinen
JP2008070990A (ja) * 2006-09-12 2008-03-27 Fujitsu Ltd 電子機器およびその組み立て方法
US9282655B2 (en) * 2012-12-11 2016-03-08 Delphi Technologies, Inc. Electrical distribution center
US11172580B2 (en) * 2017-07-24 2021-11-09 Rosemount Aerospace Inc. BGA component masking dam and a method of manufacturing with the BGA component masking dam
CN111770632A (zh) * 2020-07-29 2020-10-13 东莞权利得工业设计有限公司 一种便于安装的pcb板及其安装方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3387365A (en) * 1965-09-28 1968-06-11 John P. Stelmak Method of making electrical connections to a miniature electronic component
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3533155A (en) * 1967-07-06 1970-10-13 Western Electric Co Bonding with a compliant medium
US3634930A (en) * 1969-06-12 1972-01-18 Western Electric Co Methods for bonding leads and testing bond strength
US3608711A (en) * 1969-10-06 1971-09-28 Teledyne Inc Package for electronic devices and the like
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US4025716A (en) * 1975-01-30 1977-05-24 Burroughs Corporation Dual in-line package with window frame
JPS5694800A (en) * 1979-12-28 1981-07-31 Taiyo Yuden Kk Method and device for mounting electronic part
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
JPH0677469B2 (ja) 1988-12-28 1994-09-28 日本電気株式会社 多接点コネクタの案内構造
US5101550A (en) * 1989-02-10 1992-04-07 Honeywell Inc. Removable drop-through die bond frame
US4956911A (en) * 1990-05-18 1990-09-18 Ag Communication Systems Corporation Tool for repairing surface mounted components on printed circuit board
IT1242420B (it) * 1990-09-03 1994-03-04 Ri Co Srl Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili.
FR2693339B1 (fr) 1992-07-01 1994-10-07 Marelli Autronica Procédé de liaison et de fixation de composants à broches sur un circuit imprimé souple, et circuit ainsi obtenu.
DE4338656C2 (de) 1993-11-12 1995-11-16 Multiline International Europa Vorrichtung zum Ausrichten von Leiterplatten und Bildträgern
FR2741505B1 (fr) 1995-11-20 1998-02-06 Magneti Marelli France Substrat electronique comprenant un pion d'indexation mecanique
US5690504A (en) 1996-05-13 1997-11-25 Teradyne, Inc. Plastic guide pin with steel core
US5796590A (en) * 1996-11-05 1998-08-18 Micron Electronics, Inc. Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
US20010014551A1 (en) 1998-10-13 2001-08-16 Steven E. Blashewski Plug-in module with installation guide, retention feature, and handle

Also Published As

Publication number Publication date
AU2001246991A1 (en) 2001-10-23
US6655021B2 (en) 2003-12-02
SE0001269L (sv) 2001-10-07
EP1279323B1 (de) 2006-08-23
DE60122498D1 (de) 2006-10-05
EP1279323A1 (de) 2003-01-29
US20020050058A1 (en) 2002-05-02
WO2001078477A1 (en) 2001-10-18
SE0001269D0 (sv) 2000-04-06
SE517944C2 (sv) 2002-08-06

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties