ATE340761T1 - Hermetische in-situ-gehäusungsmethode von mikrosystemen - Google Patents

Hermetische in-situ-gehäusungsmethode von mikrosystemen

Info

Publication number
ATE340761T1
ATE340761T1 AT99125008T AT99125008T ATE340761T1 AT E340761 T1 ATE340761 T1 AT E340761T1 AT 99125008 T AT99125008 T AT 99125008T AT 99125008 T AT99125008 T AT 99125008T AT E340761 T1 ATE340761 T1 AT E340761T1
Authority
AT
Austria
Prior art keywords
layer
microsystem
metal
metal layer
adhesion
Prior art date
Application number
AT99125008T
Other languages
English (en)
Inventor
Francois Gueissaz
Original Assignee
Asulab Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asulab Sa filed Critical Asulab Sa
Application granted granted Critical
Publication of ATE340761T1 publication Critical patent/ATE340761T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Electroplating Methods And Accessories (AREA)
AT99125008T 1999-12-15 1999-12-15 Hermetische in-situ-gehäusungsmethode von mikrosystemen ATE340761T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP99125008A EP1108677B1 (de) 1999-12-15 1999-12-15 Hermetische In-Situ-Gehäusungsmethode von Mikrosystemen

Publications (1)

Publication Number Publication Date
ATE340761T1 true ATE340761T1 (de) 2006-10-15

Family

ID=8239618

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99125008T ATE340761T1 (de) 1999-12-15 1999-12-15 Hermetische in-situ-gehäusungsmethode von mikrosystemen

Country Status (7)

Country Link
US (1) US6454160B2 (de)
EP (1) EP1108677B1 (de)
JP (1) JP4777510B2 (de)
KR (1) KR100658264B1 (de)
CN (1) CN1262468C (de)
AT (1) ATE340761T1 (de)
DE (1) DE69933380T2 (de)

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Also Published As

Publication number Publication date
EP1108677A1 (de) 2001-06-20
JP4777510B2 (ja) 2011-09-21
DE69933380D1 (de) 2006-11-09
CN1262468C (zh) 2006-07-05
KR20010077941A (ko) 2001-08-20
US20010004085A1 (en) 2001-06-21
EP1108677B1 (de) 2006-09-27
CN1305944A (zh) 2001-08-01
DE69933380T2 (de) 2007-08-02
US6454160B2 (en) 2002-09-24
KR100658264B1 (ko) 2006-12-14
JP2001237334A (ja) 2001-08-31

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