ATE341926T1 - Wärmeableitende haltestruktur für elektronisches gerät - Google Patents

Wärmeableitende haltestruktur für elektronisches gerät

Info

Publication number
ATE341926T1
ATE341926T1 AT03719037T AT03719037T ATE341926T1 AT E341926 T1 ATE341926 T1 AT E341926T1 AT 03719037 T AT03719037 T AT 03719037T AT 03719037 T AT03719037 T AT 03719037T AT E341926 T1 ATE341926 T1 AT E341926T1
Authority
AT
Austria
Prior art keywords
electronic device
holder structure
heat dissipative
retaining
printed circuit
Prior art date
Application number
AT03719037T
Other languages
English (en)
Inventor
Fabrizio Boer
Mario Biserni
Original Assignee
Arthe Eng Solutions Srl
Finmeccanica Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arthe Eng Solutions Srl, Finmeccanica Spa filed Critical Arthe Eng Solutions Srl
Application granted granted Critical
Publication of ATE341926T1 publication Critical patent/ATE341926T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cable Accessories (AREA)
AT03719037T 2002-05-16 2003-05-07 Wärmeableitende haltestruktur für elektronisches gerät ATE341926T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2002TO000416A ITTO20020416A1 (it) 2002-05-16 2002-05-16 Struttura di contenimento e dissipazione termica per apparecchiature elettroniche.

Publications (1)

Publication Number Publication Date
ATE341926T1 true ATE341926T1 (de) 2006-10-15

Family

ID=27639084

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03719037T ATE341926T1 (de) 2002-05-16 2003-05-07 Wärmeableitende haltestruktur für elektronisches gerät

Country Status (8)

Country Link
US (1) US7099157B2 (de)
EP (1) EP1504637B1 (de)
CN (1) CN100431398C (de)
AT (1) ATE341926T1 (de)
AU (1) AU2003223066A1 (de)
DE (1) DE60302785T2 (de)
IT (1) ITTO20020416A1 (de)
WO (1) WO2003098987A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7843689B2 (en) * 2005-04-22 2010-11-30 Robby Jay Moore Fire resistant and water resistant enclosure for operable computer digital data storage device
KR100677620B1 (ko) * 2005-11-22 2007-02-02 삼성전자주식회사 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기
CN101018472A (zh) * 2007-02-18 2007-08-15 华为技术有限公司 一种电子设备及其装配方法
US8360390B2 (en) * 2009-01-13 2013-01-29 Enphase Energy, Inc. Method and apparatus for potting an electronic device
US8419385B2 (en) * 2009-06-15 2013-04-16 Sunonwealth Electric Machine Industry Co., Ltd. Heat-dissipating fan
JP2011176096A (ja) * 2010-02-24 2011-09-08 Mitsumi Electric Co Ltd 電子機器
DE102010016288B4 (de) 2010-04-01 2011-12-15 Jena-Optronik Gmbh Elektronische Baueinheit und Weltraumfahrzeug damit
CN102223781A (zh) * 2010-04-16 2011-10-19 华广光电股份有限公司 积层式复合导散热构造
WO2016121660A1 (ja) * 2015-01-29 2016-08-04 京セラ株式会社 回路基板および電子装置
EP3565395B1 (de) * 2016-12-28 2022-03-16 Mitsubishi Electric Corporation Stromversorgungsvorrichtung
CN109693812A (zh) * 2017-10-23 2019-04-30 中国科学院空间应用工程与技术中心 一种用于为多个空间实验设备提供实验服务的系统及方法
EP3817529B1 (de) 2018-06-27 2023-10-04 Mitsubishi Electric Corporation Stromversorgungsvorrichtung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3888691A (en) * 1972-10-06 1975-06-10 Lockheed Aircraft Corp Porous ceramic
US5420085A (en) * 1985-02-04 1995-05-30 Lanxide Technology Company, Lp Methods of making composite aluminum nitride ceramic articles having embedded filler
US5060114A (en) 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
US5307508A (en) * 1991-05-13 1994-04-26 Motorola, Inc. Shock isolation for selective call receivers
CN2135871Y (zh) * 1992-01-09 1993-06-09 王刚 大功率直流/直流变换电源器件
CA2120468A1 (en) * 1993-04-05 1994-10-06 Kenneth Alan Salisbury Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population
US5756934A (en) * 1994-10-11 1998-05-26 Loral Fairchild Corp. Flight crash survivable storage unit with aquarium container for flight recorder memory
US5932839A (en) * 1997-11-04 1999-08-03 Ren; Jane Method for dissipating heat away from a heat sensitive device using bicarbonate compositions
DE69800442T2 (de) 1998-03-23 2001-07-12 Negesat Di Boer Fabrizio & C S Schutzgehäuse für Anwendungen in der Raumfahrt
US6013592A (en) 1998-03-27 2000-01-11 Siemens Westinghouse Power Corporation High temperature insulation for ceramic matrix composites
IT1308435B1 (it) 1999-04-01 2001-12-17 Negesat Di Boer Fabrizio & C S Struttura di contenimento e dissipazione termica per equipaggiamentiin un veicolo aeronautico o spaziale
EP0992430A3 (de) * 1998-10-07 2000-09-13 Negesat Di Boer Fabrizio & C. SNC Gehäuse mit Kühlung für Einrichtungen an Bord eines Luft- oder Raumfahrzeuges
US6549409B1 (en) * 2000-08-21 2003-04-15 Vlt Corporation Power converter assembly
DE10130592C1 (de) * 2001-06-27 2002-10-24 Infineon Technologies Ag Modulbaugruppe für Speicher-Module und Verfahren zu ihrer Herstellung

Also Published As

Publication number Publication date
WO2003098987A1 (en) 2003-11-27
US7099157B2 (en) 2006-08-29
DE60302785T2 (de) 2007-03-15
CN100431398C (zh) 2008-11-05
US20060133045A1 (en) 2006-06-22
ITTO20020416A0 (it) 2002-05-16
AU2003223066A8 (en) 2003-12-02
AU2003223066A1 (en) 2003-12-02
EP1504637A1 (de) 2005-02-09
EP1504637B1 (de) 2006-10-04
CN1717966A (zh) 2006-01-04
DE60302785D1 (de) 2006-01-19
ITTO20020416A1 (it) 2003-11-17

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties