ATE345582T1 - Integrierte arrays von modulatoren und lasern auf einer elektronischen schaltung - Google Patents

Integrierte arrays von modulatoren und lasern auf einer elektronischen schaltung

Info

Publication number
ATE345582T1
ATE345582T1 AT02749717T AT02749717T ATE345582T1 AT E345582 T1 ATE345582 T1 AT E345582T1 AT 02749717 T AT02749717 T AT 02749717T AT 02749717 T AT02749717 T AT 02749717T AT E345582 T1 ATE345582 T1 AT E345582T1
Authority
AT
Austria
Prior art keywords
lasers
modulators
electronic circuit
array
integrated arrays
Prior art date
Application number
AT02749717T
Other languages
English (en)
Inventor
John Trezza
Original Assignee
Xanoptix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/896,665 external-priority patent/US20030015572A1/en
Priority claimed from US09/896,189 external-priority patent/US6620642B2/en
Priority claimed from US09/897,160 external-priority patent/US6724794B2/en
Priority claimed from US09/897,158 external-priority patent/US6753197B2/en
Priority claimed from US09/896,983 external-priority patent/US6790691B2/en
Application filed by Xanoptix Inc filed Critical Xanoptix Inc
Application granted granted Critical
Publication of ATE345582T1 publication Critical patent/ATE345582T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0421—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
    • H01S5/0422—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers with n- and p-contacts on the same side of the active layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
    • H01S5/04257—Electrodes, e.g. characterised by the structure characterised by the configuration having positive and negative electrodes on the same side of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0245—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising use of blind vias during the manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
    • H01S5/0207—Substrates having a special shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • H10H20/8142—Bodies having reflecting means, e.g. semiconductor Bragg reflectors forming resonant cavity structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7432—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Head (AREA)
  • Mechanical Optical Scanning Systems (AREA)
AT02749717T 2001-06-29 2002-06-28 Integrierte arrays von modulatoren und lasern auf einer elektronischen schaltung ATE345582T1 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US09/896,665 US20030015572A1 (en) 2001-06-29 2001-06-29 Successive integration of multiple devices process and product
US09/896,189 US6620642B2 (en) 2001-06-29 2001-06-29 Opto-electronic device integration
US09/897,160 US6724794B2 (en) 2001-06-29 2001-06-29 Opto-electronic device integration
US09/897,158 US6753197B2 (en) 2001-06-29 2001-06-29 Opto-electronic device integration
US09/896,983 US6790691B2 (en) 2001-06-29 2001-06-29 Opto-electronic device integration
US36603202P 2002-03-19 2002-03-19
US36599802P 2002-03-19 2002-03-19
US10/180,610 US6633421B2 (en) 2001-06-29 2002-06-26 Integrated arrays of modulators and lasers on electronics

Publications (1)

Publication Number Publication Date
ATE345582T1 true ATE345582T1 (de) 2006-12-15

Family

ID=27575092

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02749717T ATE345582T1 (de) 2001-06-29 2002-06-28 Integrierte arrays von modulatoren und lasern auf einer elektronischen schaltung

Country Status (5)

Country Link
US (2) US6633421B2 (de)
EP (1) EP1417712B1 (de)
AT (1) ATE345582T1 (de)
DE (1) DE60216119T2 (de)
WO (1) WO2003003465A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7038288B2 (en) * 2002-09-25 2006-05-02 Microsemi Corporation Front side illuminated photodiode with backside bump
US7274882B2 (en) * 2002-10-30 2007-09-25 Finisar Corporation Method and apparatus for monitoring the power level of two or more optical transmitters
US7269197B2 (en) * 2005-09-21 2007-09-11 Agere Systems Inc. Controlling overspray coating in semiconductor devices
US7623560B2 (en) * 2007-09-27 2009-11-24 Ostendo Technologies, Inc. Quantum photonic imagers and methods of fabrication thereof
WO2009096837A1 (en) * 2008-01-30 2009-08-06 Telefonaktiebolaget L M Ericsson (Publ) Measurement bandwidth configuration method
WO2009143462A2 (en) * 2008-05-22 2009-11-26 Vi Systems Gmbh Method for attaching optical components onto silicon-based integrated circuits
DE102008035901A1 (de) * 2008-07-31 2010-02-18 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Bauelementen und optoelektronisches Bauelement
JP5657292B2 (ja) * 2010-07-12 2015-01-21 Dmg森精機株式会社 変位検出装置
US8615028B1 (en) * 2010-10-12 2013-12-24 Hrl Laboratories, Llc Vertically integrated optical phased array with pseudo-random array architecture
US8946052B2 (en) * 2012-09-26 2015-02-03 Sandia Corporation Processes for multi-layer devices utilizing layer transfer
US11271367B1 (en) * 2014-12-05 2022-03-08 Ii-Vi Delaware, Inc. Method to form a self-aligned evaporated metal contact in a deep hole and VCSEL with such contact
US11264780B2 (en) * 2018-01-26 2022-03-01 Oepic Semiconductors, Inc. Flip chip backside emitting VCSEL package

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5363463A (en) 1982-08-06 1994-11-08 Kleinerman Marcos Y Remote sensing of physical variables with fiber optic systems
US4533833A (en) 1982-08-19 1985-08-06 At&T Bell Laboratories Optically coupled integrated circuit array
US5991479A (en) 1984-05-14 1999-11-23 Kleinerman; Marcos Y. Distributed fiber optic sensors and systems
JPH0831617B2 (ja) 1990-04-18 1996-03-27 三菱電機株式会社 太陽電池及びその製造方法
US5266794A (en) 1992-01-21 1993-11-30 Bandgap Technology Corporation Vertical-cavity surface emitting laser optical interconnect technology
US5299222A (en) 1992-03-11 1994-03-29 Lightwave Electronics Multiple diode laser stack for pumping a solid-state laser
US5269453A (en) 1992-04-02 1993-12-14 Motorola, Inc. Low temperature method for forming solder bump interconnections to a plated circuit trace
DE4211899C2 (de) 1992-04-09 1998-07-16 Daimler Benz Aerospace Ag Mikrosystem-Laseranordnung und Mikrosystem-Laser
US6048751A (en) 1993-06-25 2000-04-11 Lucent Technologies Inc. Process for manufacture of composite semiconductor devices
US5385632A (en) 1993-06-25 1995-01-31 At&T Laboratories Method for manufacturing integrated semiconductor devices
JPH0738205A (ja) 1993-07-20 1995-02-07 Mitsubishi Electric Corp 面発光レーザダイオードアレイ及びその駆動方法，光検出素子，光検出素子アレイ，空間光接続システム，並びに波長多重光通信システム
US5488504A (en) * 1993-08-20 1996-01-30 Martin Marietta Corp. Hybridized asymmetric fabry-perot quantum well light modulator
US5729038A (en) 1995-12-15 1998-03-17 Harris Corporation Silicon-glass bonded wafers
US6680792B2 (en) * 1994-05-05 2004-01-20 Iridigm Display Corporation Interferometric modulation of radiation
US5636052A (en) * 1994-07-29 1997-06-03 Lucent Technologies Inc. Direct view display based on a micromechanical modulation
US5511085A (en) 1994-09-02 1996-04-23 Light Solutions Corporation Passively stabilized intracavity doubling laser
US5544268A (en) 1994-09-09 1996-08-06 Deacon Research Display panel with electrically-controlled waveguide-routing
US5477933A (en) 1994-10-24 1995-12-26 At&T Corp. Electronic device interconnection techniques
US5814889A (en) 1995-06-05 1998-09-29 Harris Corporation Intergrated circuit with coaxial isolation and method
US5568574A (en) * 1995-06-12 1996-10-22 University Of Southern California Modulator-based photonic chip-to-chip interconnections for dense three-dimensional multichip module integration
JPH0964334A (ja) * 1995-08-28 1997-03-07 Toshiba Corp 発光素子と外部変調器の集積素子
EP0854768A1 (de) 1995-10-06 1998-07-29 Brown University Research Foundation Weichlotzusammensetzungen und - verfahren
US5793789A (en) 1996-08-20 1998-08-11 Lucent Technologies Inc. Detector for photonic integrated transceivers
US5715270A (en) 1996-09-27 1998-02-03 Mcdonnell Douglas Corporation High efficiency, high power direct diode laser systems and methods therefor
EP1959506A2 (de) 1997-01-31 2008-08-20 Matsushita Electric Industrial Co., Ltd. Herstellungsverfahren für eine lichtemittierende Halbleitervorrichtung
US20020141011A1 (en) * 1997-02-11 2002-10-03 Green Alan E. Optical free space signalling system
JPH10247747A (ja) 1997-03-05 1998-09-14 Toshiba Corp 半導体発光素子およびその製造方法
JPH10335383A (ja) * 1997-05-28 1998-12-18 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US6070321A (en) 1997-07-09 2000-06-06 International Business Machines Corporation Solder disc connection
US6022760A (en) * 1997-07-30 2000-02-08 Motorola, Inc. Integrated electro-optical package and method of fabrication
US6005262A (en) 1997-08-20 1999-12-21 Lucent Technologies Inc. Flip-chip bonded VCSEL CMOS circuit with silicon monitor detector
JPH11166935A (ja) 1997-09-25 1999-06-22 Canon Inc 光検出または照射用の光プローブと該プローブを備えた近視野光学顕微鏡、及該光プローブの製造方法とその製造に用いる基板
US5946130A (en) 1997-10-03 1999-08-31 Mcdonnell Douglas Corporation Optical fiber amplifier network having a coherently combined output and high-power laser amplifier containing same
JP3662402B2 (ja) * 1997-11-07 2005-06-22 三菱電機株式会社 光半導体モジュール
US6158644A (en) 1998-04-30 2000-12-12 International Business Machines Corporation Method for enhancing fatigue life of ball grid arrays
US6136623A (en) 1998-05-06 2000-10-24 Xerox Corporation Multiple wavelength laser arrays by flip-chip bonding
US6343171B1 (en) 1998-10-09 2002-01-29 Fujitsu Limited Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making
GB9903880D0 (en) 1999-02-19 1999-04-14 Univ Southampton Optical device
DE10006290C1 (de) 2000-02-14 2001-05-31 Webasto Vehicle Sys Int Gmbh Umwandelbares Fahrzeugdach
JP3677429B2 (ja) 2000-03-09 2005-08-03 Ｎｅｃエレクトロニクス株式会社 フリップチップ型半導体装置の製造方法
CA2463278C (en) * 2001-10-09 2013-04-02 Infinera Corporation Transmitter photonic integrated circuits (txpic) and optical transport networks employing txpics

Also Published As

Publication number Publication date
EP1417712A1 (de) 2004-05-12
US20030039282A1 (en) 2003-02-27
US6633421B2 (en) 2003-10-14
DE60216119D1 (de) 2006-12-28
EP1417712B1 (de) 2006-11-15
WO2003003465A1 (en) 2003-01-09
US20040066808A1 (en) 2004-04-08
US7092424B2 (en) 2006-08-15
DE60216119T2 (de) 2007-09-06
EP1417712A4 (de) 2005-03-23

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