ATE345664T1 - Verfahren und vorrichtung zur kühlung eines bauteiles - Google Patents

Verfahren und vorrichtung zur kühlung eines bauteiles

Info

Publication number: ATE345664T1
Authority: AT; Austria
Prior art keywords: heat; component; electronics module; removal device; cooling
Prior art date: 2001-09-21

Application number

AT02019564T

Other languages

English (en)

Inventor

Thomas J Bertram

Henry Wong

Original Assignee

Motorola Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-09-21

Filing date

2002-09-02

Publication date

2006-12-15

2002-09-02 Application filed by Motorola Inc filed Critical Motorola Inc

2006-12-15 Application granted granted Critical

2006-12-15 Publication of ATE345664T1 publication Critical patent/ATE345664T1/de

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections

Landscapes

Cooling Or The Like Of Electrical Apparatus (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

AT02019564T 2001-09-21 2002-09-02 Verfahren und vorrichtung zur kühlung eines bauteiles ATE345664T1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US09/960,017 US6538884B1 (en)	2001-09-21	2001-09-21	Method and apparatus for removing heat from a component

Publications (1)

Publication Number	Publication Date
ATE345664T1 true ATE345664T1 (de)	2006-12-15

Family

ID=25502690

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT02019564T ATE345664T1 (de)	2001-09-21	2002-09-02	Verfahren und vorrichtung zur kühlung eines bauteiles

Country Status (6)

Country	Link
US (1)	US6538884B1 (de)
EP (1)	EP1303174B1 (de)
JP (1)	JP4206435B2 (de)
AT (1)	ATE345664T1 (de)
CA (1)	CA2399898A1 (de)
DE (1)	DE60216033T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3651677B2 (ja) *	2002-07-12	2005-05-25	株式会社東芝	発熱素子冷却装置及び電子機器
US6721182B1 (en) *	2002-10-10	2004-04-13	Harris Corporation	Circuit card module including mezzanine card heat sink and related methods
US6768642B2 (en) *	2002-12-16	2004-07-27	Lockheed Martin Corporation	VME circuit host card with triple mezzanine configuration
TW200537279A (en) *	2004-05-13	2005-11-16	Mitac Technology Corp	Heat sink module having heat conduction cover plate
US7369412B2 (en) *	2006-05-02	2008-05-06	Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.	Heat dissipation device
US7391610B2 (en)	2006-09-29	2008-06-24	Rockwell Automation Technologies, Inc.	Thermal cooling of industrial electronic module by conductive structure
US7444209B2 (en) *	2006-10-26	2008-10-28	Honeywell International Inc.	Miniature cooling device
CN101315176A (zh) *	2007-06-01	2008-12-03	富士迈半导体精密工业（上海）有限公司	具较佳散热效率的光源模组
TW200910070A (en) *	2007-08-28	2009-03-01	Inventec Corp	Heat dissipation module
US20090323286A1 (en) *	2008-06-13	2009-12-31	Evga Corporation	Apparatus for removing heat from pc circuit board devices such as graphics cards and the like
TWI476575B (zh) *	2012-05-04	2015-03-11	Inventec Corp	電子裝置及其散熱結構
US9013874B2 (en) *	2012-09-12	2015-04-21	Sk Hynix Memory Solutions Inc.	Heat dissipation device
US9497888B2 (en) *	2013-02-27	2016-11-15	International Business Machines Corporation	Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s)
JP6456891B2 (ja) *	2016-09-23	2019-01-23	レノボ・シンガポール・プライベート・リミテッド	電子機器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0231456B1 (de) *	1985-12-13	1991-06-26	Ascom Hasler AG	Verfahren und Vorrichtung zum Abführen der Verlustwärme wenigstens einer Baugruppe elektrischer Elemente
US4931904A (en)	1989-05-30	1990-06-05	Motorola, Inc.	Localized circuit card cooling device
JPH0629683A (ja) *	1992-03-31	1994-02-04	Furukawa Electric Co Ltd:The	電子機器用ヒートパイプ式放熱ユニット
US5343940A (en) *	1992-10-29	1994-09-06	Amigo Jean	Flexible heat transfer device
US5390734A (en) *	1993-05-28	1995-02-21	Lytron Incorporated	Heat sink
US5472043A (en) *	1994-03-22	1995-12-05	Aavid Laboratories, Inc.	Two-phase component cooler with radioactive initiator
US5613906A (en)	1995-07-20	1997-03-25	Elonex I.P. Holdings, Ltd.	Method and apparatus for waste heat removal from a computer enclosure
US5986887A (en)	1998-10-28	1999-11-16	Unisys Corporation	Stacked circuit board assembly adapted for heat dissipation
US6246582B1 (en) *	1998-12-30	2001-06-12	Honeywell Inc.	Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
TW448711B (en) *	1999-07-22	2001-08-01	Foxconn Prec Components Co Ltd	Heat dissipation device
US6407916B1 (en) *	2000-06-12	2002-06-18	Intel Corporation	Computer assembly for cooling high powered microprocessors
US6377459B1 (en) *	2000-08-04	2002-04-23	Sun Microsystems, Inc.	Chip cooling management

2001
- 2001-09-21 US US09/960,017 patent/US6538884B1/en not_active Expired - Lifetime
2002
- 2002-08-27 CA CA002399898A patent/CA2399898A1/en not_active Abandoned
- 2002-09-02 DE DE60216033T patent/DE60216033T2/de not_active Expired - Lifetime
- 2002-09-02 EP EP02019564A patent/EP1303174B1/de not_active Expired - Lifetime
- 2002-09-02 AT AT02019564T patent/ATE345664T1/de not_active IP Right Cessation
- 2002-09-18 JP JP2002271249A patent/JP4206435B2/ja not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CA2399898A1 (en)	2003-03-21
US6538884B1 (en)	2003-03-25
EP1303174A2 (de)	2003-04-16
DE60216033D1 (de)	2006-12-28
JP4206435B2 (ja)	2009-01-14
EP1303174A3 (de)	2005-01-12
EP1303174B1 (de)	2006-11-15
JP2003179372A (ja)	2003-06-27
US20030058616A1 (en)	2003-03-27
DE60216033T2 (de)	2007-06-21

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Legal Events

Date	Code	Title	Description
2007-05-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties