ATE348392T1 - Grenzflächenmaterialien und verfahren zu ihrer herstellung und benutzung - Google Patents
Grenzflächenmaterialien und verfahren zu ihrer herstellung und benutzungInfo
- Publication number
- ATE348392T1 ATE348392T1 AT02769392T AT02769392T ATE348392T1 AT E348392 T1 ATE348392 T1 AT E348392T1 AT 02769392 T AT02769392 T AT 02769392T AT 02769392 T AT02769392 T AT 02769392T AT E348392 T1 ATE348392 T1 AT E348392T1
- Authority
- AT
- Austria
- Prior art keywords
- production
- methods
- interface materials
- silver
- aluminum
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Soldering of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams or slurries
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/251—Organics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
- Y10T428/24074—Strand or strand-portions
- Y10T428/24116—Oblique to direction of web
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Conductive Materials (AREA)
- Polymerisation Methods In General (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/851,103 US6706219B2 (en) | 1999-09-17 | 2001-05-07 | Interface materials and methods of production and use thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE348392T1 true ATE348392T1 (de) | 2007-01-15 |
Family
ID=25309990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02769392T ATE348392T1 (de) | 2001-05-07 | 2002-05-07 | Grenzflächenmaterialien und verfahren zu ihrer herstellung und benutzung |
Country Status (10)
| Country | Link |
|---|---|
| US (3) | US6706219B2 (de) |
| EP (2) | EP1763040A1 (de) |
| JP (1) | JP2004533705A (de) |
| KR (1) | KR20040030561A (de) |
| CN (2) | CN101088697A (de) |
| AT (1) | ATE348392T1 (de) |
| CA (1) | CA2442034A1 (de) |
| DE (1) | DE60216749T2 (de) |
| TW (1) | TWI276116B (de) |
| WO (1) | WO2002091395A1 (de) |
Families Citing this family (70)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6706219B2 (en) * | 1999-09-17 | 2004-03-16 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| US6605238B2 (en) * | 1999-09-17 | 2003-08-12 | Honeywell International Inc. | Compliant and crosslinkable thermal interface materials |
| US6673434B2 (en) | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
| US7608324B2 (en) * | 2001-05-30 | 2009-10-27 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| US7846778B2 (en) * | 2002-02-08 | 2010-12-07 | Intel Corporation | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
| US7436058B2 (en) * | 2002-05-09 | 2008-10-14 | Intel Corporation | Reactive solder material |
| US7147367B2 (en) * | 2002-06-11 | 2006-12-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material with low melting alloy |
| US6791839B2 (en) * | 2002-06-25 | 2004-09-14 | Dow Corning Corporation | Thermal interface materials and methods for their preparation and use |
| US7416922B2 (en) | 2003-03-31 | 2008-08-26 | Intel Corporation | Heat sink with preattached thermal interface material and method of making same |
| EP1616337A2 (de) * | 2003-04-02 | 2006-01-18 | Honeywell International, Inc. | Thermische verbindungs- und grenzflächensysteme, herstellungsverfahren und verwendungen davon |
| US7014093B2 (en) | 2003-06-26 | 2006-03-21 | Intel Corporation | Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
| US7527090B2 (en) | 2003-06-30 | 2009-05-05 | Intel Corporation | Heat dissipating device with preselected designed interface for thermal interface materials |
| US20050056365A1 (en) * | 2003-09-15 | 2005-03-17 | Albert Chan | Thermal interface adhesive |
| US7109520B2 (en) * | 2003-10-10 | 2006-09-19 | E. I. Du Pont De Nemours And Company | Heat sinks |
| US20050228097A1 (en) * | 2004-03-30 | 2005-10-13 | General Electric Company | Thermally conductive compositions and methods of making thereof |
| JP2007005670A (ja) * | 2005-06-27 | 2007-01-11 | Fujitsu Ltd | 電子部品パッケージおよび接合組立体 |
| JP4634891B2 (ja) * | 2005-08-18 | 2011-02-16 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物およびその硬化物 |
| WO2007053571A2 (en) * | 2005-11-01 | 2007-05-10 | Techfilm, Llc | Thermal interface material with multiple size distribution thermally conductive fillers |
| US20070138442A1 (en) * | 2005-12-19 | 2007-06-21 | Weiser Martin W | Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof |
| TWI291480B (en) * | 2005-12-20 | 2007-12-21 | Ind Tech Res Inst | Composition for thermal interface materials |
| US20070166875A1 (en) * | 2005-12-29 | 2007-07-19 | Intel Corporation | Method of forming a microelectronic package and microelectronic package formed according to the method |
| US20070284730A1 (en) * | 2006-06-12 | 2007-12-13 | Wei Shi | Method, apparatus, and system for thin die thin thermal interface material in integrated circuit packages |
| GB2452229B (en) * | 2006-06-30 | 2010-11-17 | Asahi Kasei Emd Corp | Conductive filler |
| US20080023665A1 (en) * | 2006-07-25 | 2008-01-31 | Weiser Martin W | Thermal interconnect and interface materials, methods of production and uses thereof |
| JP5093766B2 (ja) * | 2007-01-31 | 2012-12-12 | 株式会社タムラ製作所 | 導電性ボール等搭載半導体パッケージ基板の製造方法 |
| ES2424869T3 (es) | 2007-03-21 | 2013-10-09 | Höganäs Ab (Publ) | Materiales compuestos de polímeros de metal en polvo |
| WO2008134516A2 (en) | 2007-04-27 | 2008-11-06 | Honeywell International Inc. | Novel manufacturing design and processing methods and apparatus for sputtering targets |
| US20080291634A1 (en) * | 2007-05-22 | 2008-11-27 | Weiser Martin W | Thermal interconnect and interface materials, methods of production and uses thereof |
| US8702919B2 (en) * | 2007-08-13 | 2014-04-22 | Honeywell International Inc. | Target designs and related methods for coupled target assemblies, methods of production and uses thereof |
| JP2010539706A (ja) * | 2007-09-11 | 2010-12-16 | ダウ コーニング コーポレーション | 放熱材料、該放熱材料を含む電子デバイス、ならびにそれらの調製方法および使用方法 |
| CN101803009B (zh) * | 2007-09-11 | 2012-07-04 | 陶氏康宁公司 | 组合物,包括这种组合物的热界面材料,及其制备方法和用途 |
| US20090111925A1 (en) * | 2007-10-31 | 2009-04-30 | Burnham Kikue S | Thermal interface materials, methods of production and uses thereof |
| US8124548B2 (en) * | 2007-12-21 | 2012-02-28 | Honeywell International Inc. | Low weight and high durability soft body armor composite using silicone-based topical treatments |
| WO2009131913A2 (en) * | 2008-04-21 | 2009-10-29 | Honeywell International Inc. | Thermal interconnect and interface materials, methods of production and uses thereof |
| US20100112360A1 (en) * | 2008-10-31 | 2010-05-06 | Delano Andrew D | Layered thermal interface systems methods of production and uses thereof |
| CN101807531A (zh) * | 2010-03-30 | 2010-08-18 | 上海凯虹电子有限公司 | 一种超薄芯片的封装方法以及封装体 |
| US8896986B2 (en) * | 2010-05-26 | 2014-11-25 | Kemet Electronics Corporation | Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors |
| US9748043B2 (en) | 2010-05-26 | 2017-08-29 | Kemet Electronics Corporation | Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors |
| CN101869982A (zh) * | 2010-06-26 | 2010-10-27 | 上海交通大学 | 核壳型铝锡铋无铅焊料及其制备方法 |
| CN102554486A (zh) * | 2010-12-28 | 2012-07-11 | 上海杰远环保科技有限公司 | 一种高导热焊接材料及其制造方法 |
| TWI477594B (zh) * | 2011-09-22 | 2015-03-21 | Univ Nat Yunlin Sci & Tech | Composites with high thermal conductivity |
| US9228086B2 (en) * | 2013-02-05 | 2016-01-05 | Medarray, Inc. | Siloxane based hollow fibers |
| CN103289650B (zh) * | 2013-06-09 | 2014-01-08 | 北京依米康科技发展有限公司 | 一种低熔点金属导热膏 |
| US9693481B2 (en) | 2013-06-25 | 2017-06-27 | Henkel IP & Holding GmbH | Thermally conductive dielectric interface |
| CN103394820A (zh) * | 2013-07-02 | 2013-11-20 | 天津市天联滨海复合材料有限公司 | 一种锡铋银系无铅焊料合金及其制备方法 |
| CN105899714B (zh) | 2013-12-05 | 2018-09-21 | 霍尼韦尔国际公司 | 具有经调节的pH的甲基磺酸亚锡溶液 |
| KR20160122172A (ko) | 2014-02-13 | 2016-10-21 | 허니웰 인터내셔날 인코포레이티드 | 압축성 열전도 재료 |
| PL3166999T3 (pl) | 2014-07-07 | 2023-07-03 | Honeywell International Inc. | Materiał termoprzewodzący ze zmiataczem jonów |
| JP6382228B2 (ja) * | 2014-08-29 | 2018-08-29 | 古河電気工業株式会社 | 導電性接着フィルム |
| US9536851B2 (en) * | 2014-09-05 | 2017-01-03 | Infineon Technologies Ag | Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement |
| DE102015103118A1 (de) * | 2014-10-06 | 2016-04-07 | Siltectra Gmbh | Splitting-Verfahren und Verwendung eines Materials in einem Splitting-Verfahren |
| EP3227399B1 (de) | 2014-12-05 | 2021-07-14 | Honeywell International Inc. | Hochleistungsfähige thermische zwischenmaterialien mit niedrigem wärmewiderstand |
| CN104668808A (zh) * | 2015-01-29 | 2015-06-03 | 山东浪潮华光光电子股份有限公司 | 一种高纯铟纤维复合增强焊料及其制备方法 |
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| CN104577704A (zh) * | 2015-01-29 | 2015-04-29 | 山东浪潮华光光电子股份有限公司 | 纤维网增强高纯铟复合焊料及其应用方法 |
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-
2001
- 2001-05-07 US US09/851,103 patent/US6706219B2/en not_active Expired - Lifetime
-
2002
- 2002-05-07 CN CNA2007101367198A patent/CN101088697A/zh active Pending
- 2002-05-07 CN CNB028082214A patent/CN100338690C/zh not_active Expired - Fee Related
- 2002-05-07 DE DE2002616749 patent/DE60216749T2/de not_active Expired - Fee Related
- 2002-05-07 TW TW91109451A patent/TWI276116B/zh not_active IP Right Cessation
- 2002-05-07 EP EP06019336A patent/EP1763040A1/de not_active Withdrawn
- 2002-05-07 CA CA 2442034 patent/CA2442034A1/en not_active Abandoned
- 2002-05-07 JP JP2002588564A patent/JP2004533705A/ja active Pending
- 2002-05-07 AT AT02769392T patent/ATE348392T1/de not_active IP Right Cessation
- 2002-05-07 KR KR10-2003-7012974A patent/KR20040030561A/ko not_active Abandoned
- 2002-05-07 EP EP20020769392 patent/EP1386327B1/de not_active Expired - Lifetime
- 2002-05-07 WO PCT/US2002/014613 patent/WO2002091395A1/en not_active Ceased
-
2004
- 2004-02-09 US US10/775,989 patent/US7172711B2/en not_active Expired - Fee Related
-
2007
- 2007-02-05 US US11/702,351 patent/US20080044670A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1386327A1 (de) | 2004-02-04 |
| US6706219B2 (en) | 2004-03-16 |
| US20040185273A1 (en) | 2004-09-23 |
| CN101088697A (zh) | 2007-12-19 |
| JP2004533705A (ja) | 2004-11-04 |
| EP1763040A1 (de) | 2007-03-14 |
| CN100338690C (zh) | 2007-09-19 |
| CN1552078A (zh) | 2004-12-01 |
| US20080044670A1 (en) | 2008-02-21 |
| CA2442034A1 (en) | 2002-11-14 |
| TWI276116B (en) | 2007-03-11 |
| KR20040030561A (ko) | 2004-04-09 |
| DE60216749D1 (de) | 2007-01-25 |
| EP1386327B1 (de) | 2006-12-13 |
| US20010038093A1 (en) | 2001-11-08 |
| WO2002091395A1 (en) | 2002-11-14 |
| US7172711B2 (en) | 2007-02-06 |
| DE60216749T2 (de) | 2007-10-04 |
| EP1386327A4 (de) | 2005-02-02 |
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