ATE352872T1 - Direktbefestigung eines wärmerohrs an ein chip durch mittelpunktladung - Google Patents

Direktbefestigung eines wärmerohrs an ein chip durch mittelpunktladung

Info

Publication number
ATE352872T1
ATE352872T1 AT01973599T AT01973599T ATE352872T1 AT E352872 T1 ATE352872 T1 AT E352872T1 AT 01973599 T AT01973599 T AT 01973599T AT 01973599 T AT01973599 T AT 01973599T AT E352872 T1 ATE352872 T1 AT E352872T1
Authority
AT
Austria
Prior art keywords
chip
heat pipe
center point
point charging
direct attaching
Prior art date
Application number
AT01973599T
Other languages
English (en)
Inventor
Ajit Sathe
Kristopher Frutschy
Eric Distefano
Ravi Prasher
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE352872T1 publication Critical patent/ATE352872T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Die Bonding (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Resistance Heating (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Wire Bonding (AREA)
AT01973599T 2000-09-29 2001-09-27 Direktbefestigung eines wärmerohrs an ein chip durch mittelpunktladung ATE352872T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/675,314 US6469893B1 (en) 2000-09-29 2000-09-29 Direct heatpipe attachment to die using center point loading

Publications (1)

Publication Number Publication Date
ATE352872T1 true ATE352872T1 (de) 2007-02-15

Family

ID=24709934

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01973599T ATE352872T1 (de) 2000-09-29 2001-09-27 Direktbefestigung eines wärmerohrs an ein chip durch mittelpunktladung

Country Status (8)

Country Link
US (2) US6469893B1 (de)
EP (1) EP1356512B1 (de)
CN (1) CN1531754B (de)
AT (1) ATE352872T1 (de)
AU (1) AU2001293159A1 (de)
DE (1) DE60126341T2 (de)
MY (1) MY122824A (de)
WO (1) WO2002027785A2 (de)

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AU2003286821A1 (en) 2002-11-01 2004-06-07 Cooligy, Inc. Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
DE60209423T2 (de) * 2002-11-08 2006-08-10 Agilent Technologies Inc., A Delaware Corp., Palo Alto Mikrochip-Kühlung auf Leiterplatte
US6929057B1 (en) * 2002-12-19 2005-08-16 Beutler Corporation Building heating assembly
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US20040233639A1 (en) * 2003-01-31 2004-11-25 Cooligy, Inc. Removeable heat spreader support mechanism and method of manufacturing thereof
US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
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US20050083658A1 (en) * 2003-10-21 2005-04-21 Arima Computer Corporation Heat dissipating module of an integrated circuit of a portable computer
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US7071552B2 (en) * 2004-03-29 2006-07-04 Intel Corporation IC die with directly bonded liquid cooling device
JP2005317797A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、電子機器および冷却装置
JP2005315158A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置、および電子機器
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JP4343032B2 (ja) * 2004-05-31 2009-10-14 株式会社東芝 冷却構造および投射型画像表示装置
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US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
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JP4928749B2 (ja) * 2005-06-30 2012-05-09 株式会社東芝 冷却装置
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US20070114010A1 (en) * 2005-11-09 2007-05-24 Girish Upadhya Liquid cooling for backlit displays
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
TW200805042A (en) * 2006-02-16 2008-01-16 Cooligy Inc Liquid cooling loops for server applications
US7450387B2 (en) * 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
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US20070227698A1 (en) * 2006-03-30 2007-10-04 Conway Bruce R Integrated fluid pump and radiator reservoir
US20070227709A1 (en) * 2006-03-30 2007-10-04 Girish Upadhya Multi device cooling
US7388747B2 (en) * 2006-04-07 2008-06-17 Inventec Corporation Heat plate fixing structure
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US20070256815A1 (en) * 2006-05-04 2007-11-08 Cooligy, Inc. Scalable liquid cooling system with modular radiators
US20080013278A1 (en) * 2006-06-30 2008-01-17 Fredric Landry Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles
CN101102655A (zh) * 2006-07-07 2008-01-09 富准精密工业(深圳)有限公司 散热装置
US7782622B1 (en) * 2006-10-04 2010-08-24 Nvidia Corporation Attachment apparatus for electronic boards
CN200994225Y (zh) * 2006-12-29 2007-12-19 帛汉股份有限公司 电路基板结构
JP2008251687A (ja) * 2007-03-29 2008-10-16 Toshiba Corp プリント回路板、およびこれを備えた電子機器
US20090000771A1 (en) * 2007-05-02 2009-01-01 James Horn Micro-tube/multi-port counter flow radiator design for electronic cooling applications
TW200934352A (en) 2007-08-07 2009-08-01 Cooligy Inc Internal access mechanism for a server rack
CN101377706B (zh) * 2007-08-31 2011-12-21 鸿富锦精密工业（深圳）有限公司 电脑散热器背板组合
US8520393B2 (en) * 2008-04-01 2013-08-27 Hewlett-Packard Development Company, L.P. Apparatuses and methods for dissipating heat from a computer component
US8302419B2 (en) * 2008-05-02 2012-11-06 Thermal Take Technology Co., Ltd. Computer cooling apparatus
US8159821B2 (en) * 2009-07-28 2012-04-17 Dsem Holdings Sdn. Bhd. Diffusion bonding circuit submount directly to vapor chamber
DE112009005159T5 (de) 2009-08-18 2012-06-14 Hewlett-Packard Development Company, L.P. Bauelementbefestigungssysteme und -verfahren
CN102549742A (zh) * 2009-09-30 2012-07-04 日本电气株式会社 电子部件的冷却构造、电子仪器
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
DE202010014108U1 (de) * 2010-10-08 2010-12-02 Congatec Ag Wärmeverteiler mit mechanisch gesichertem Wärmekopplungselement
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CN102655730A (zh) * 2011-03-04 2012-09-05 鸿富锦精密工业（深圳）有限公司 散热装置
US20120267078A1 (en) * 2011-04-20 2012-10-25 Chun-Ming Wu Heat dissipation mechanism
CN103702544A (zh) * 2012-09-27 2014-04-02 英业达科技有限公司 电子装置及其导热件
US9379037B2 (en) * 2014-03-14 2016-06-28 Apple Inc. Thermal module accounting for increased board/die size in a portable computer
US10359818B2 (en) 2015-08-17 2019-07-23 Microsoft Technology Licensing, Llc Device faraday cage
US10772190B2 (en) * 2017-09-29 2020-09-08 Apple Inc. Heat-removal assemblies with opposing springs
TWI745774B (zh) * 2019-11-01 2021-11-11 宏碁股份有限公司 分離式熱交換模組與複合式薄層導熱結構
CN115702492A (zh) 2020-03-04 2023-02-14 传输现象科技有限责任公司 顺应性热管理装置、系统及其制造方法
WO2025160390A1 (en) * 2024-01-26 2025-07-31 MTS IP Holdings Ltd Method to transfer heat from small form factor pluggable connector to remote heat sink

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Also Published As

Publication number Publication date
EP1356512B1 (de) 2007-01-24
CN1531754A (zh) 2004-09-22
US6469893B1 (en) 2002-10-22
US20020051341A1 (en) 2002-05-02
WO2002027785A2 (en) 2002-04-04
WO2002027785A3 (en) 2003-08-14
EP1356512A2 (de) 2003-10-29
AU2001293159A1 (en) 2002-04-08
DE60126341D1 (de) 2007-03-15
US6625022B2 (en) 2003-09-23
MY122824A (en) 2006-05-31
HK1058104A1 (en) 2004-04-30
DE60126341T2 (de) 2007-11-15
CN1531754B (zh) 2010-05-26

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