ATE353450T1 - Photolithographie mit mehrstufigem substrat - Google Patents

Photolithographie mit mehrstufigem substrat

Info

Publication number
ATE353450T1
ATE353450T1 AT02102074T AT02102074T ATE353450T1 AT E353450 T1 ATE353450 T1 AT E353450T1 AT 02102074 T AT02102074 T AT 02102074T AT 02102074 T AT02102074 T AT 02102074T AT E353450 T1 ATE353450 T1 AT E353450T1
Authority
AT
Austria
Prior art keywords
region
pattern area
expose
pattern
photolithography
Prior art date
Application number
AT02102074T
Other languages
English (en)
Inventor
Brian Martin
John Perring
John Shannon
Original Assignee
X Fab Semiconductor Foundries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by X Fab Semiconductor Foundries filed Critical X Fab Semiconductor Foundries
Application granted granted Critical
Publication of ATE353450T1 publication Critical patent/ATE353450T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/203—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Optical Integrated Circuits (AREA)
  • Magnetic Heads (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Communication System (AREA)
AT02102074T 2001-09-01 2002-07-30 Photolithographie mit mehrstufigem substrat ATE353450T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0121217A GB2379284A (en) 2001-09-01 2001-09-01 Multiple level photolithography

Publications (1)

Publication Number Publication Date
ATE353450T1 true ATE353450T1 (de) 2007-02-15

Family

ID=9921363

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02102074T ATE353450T1 (de) 2001-09-01 2002-07-30 Photolithographie mit mehrstufigem substrat

Country Status (6)

Country Link
US (2) US6949330B2 (de)
EP (1) EP1288721B1 (de)
AT (1) ATE353450T1 (de)
DE (1) DE60218002T2 (de)
DK (1) DK1288721T3 (de)
GB (1) GB2379284A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2379284A (en) * 2001-09-01 2003-03-05 Zarlink Semiconductor Ltd Multiple level photolithography
US20050130075A1 (en) * 2003-12-12 2005-06-16 Mohammed Shaarawi Method for making fluid emitter orifice
US7259106B2 (en) * 2004-09-10 2007-08-21 Versatilis Llc Method of making a microelectronic and/or optoelectronic circuitry sheet
US7915171B2 (en) * 2008-04-29 2011-03-29 Intel Corporation Double patterning techniques and structures
US8057964B2 (en) * 2008-10-31 2011-11-15 Altera Corporation Photolithographic reticles with electrostatic discharge protection structures
CN111162007B (zh) * 2018-11-08 2022-04-12 中芯国际集成电路制造(上海)有限公司 半导体器件及其制造方法

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Also Published As

Publication number Publication date
DE60218002T2 (de) 2007-11-15
EP1288721A3 (de) 2003-09-17
DE60218002D1 (de) 2007-03-22
DK1288721T3 (da) 2007-06-04
US7349070B2 (en) 2008-03-25
US20060050255A1 (en) 2006-03-09
GB0121217D0 (en) 2001-10-24
EP1288721B1 (de) 2007-02-07
US6949330B2 (en) 2005-09-27
EP1288721A2 (de) 2003-03-05
GB2379284A (en) 2003-03-05
US20030044734A1 (en) 2003-03-06

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