ATE357058T1 - Vorrichtung und methode zur gehäuseverwerfungs- kompensation mit einem integrierten wärmeverteiler - Google Patents

Vorrichtung und methode zur gehäuseverwerfungs- kompensation mit einem integrierten wärmeverteiler

Info

Publication number
ATE357058T1
ATE357058T1 AT02778816T AT02778816T ATE357058T1 AT E357058 T1 ATE357058 T1 AT E357058T1 AT 02778816 T AT02778816 T AT 02778816T AT 02778816 T AT02778816 T AT 02778816T AT E357058 T1 ATE357058 T1 AT E357058T1
Authority
AT
Austria
Prior art keywords
integrated heat
heat spreader
distress
compensation
housing
Prior art date
Application number
AT02778816T
Other languages
English (en)
Inventor
Thomas Fitzgerald
Carl Deppisch
Fay Hua
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE357058T1 publication Critical patent/ATE357058T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Warping, Beaming, Or Leasing (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
AT02778816T 2001-12-21 2002-11-07 Vorrichtung und methode zur gehäuseverwerfungs- kompensation mit einem integrierten wärmeverteiler ATE357058T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/023,720 US6848172B2 (en) 2001-12-21 2001-12-21 Device and method for package warp compensation in an integrated heat spreader

Publications (1)

Publication Number Publication Date
ATE357058T1 true ATE357058T1 (de) 2007-04-15

Family

ID=21816807

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02778816T ATE357058T1 (de) 2001-12-21 2002-11-07 Vorrichtung und methode zur gehäuseverwerfungs- kompensation mit einem integrierten wärmeverteiler

Country Status (8)

Country Link
US (3) US6848172B2 (de)
EP (1) EP1461831B1 (de)
CN (1) CN100397630C (de)
AT (1) ATE357058T1 (de)
AU (1) AU2002340453A1 (de)
DE (1) DE60218898T2 (de)
MY (1) MY138750A (de)
WO (1) WO2003058714A2 (de)

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KR20070006682A (ko) * 2004-03-30 2007-01-11 허니웰 인터내셔널 인코포레이티드 히트 스프레더 구조물, 집적 회로, 및 그들의 제조방법
US7205651B2 (en) * 2004-04-16 2007-04-17 St Assembly Test Services Ltd. Thermally enhanced stacked die package and fabrication method
US7161122B2 (en) * 2004-06-24 2007-01-09 Intel Corporation Assembly packaging using induction heating
US20070001291A1 (en) * 2005-06-30 2007-01-04 Infineon Technologies Ag Anti-warp heat spreader for semiconductor devices
EP1791177A1 (de) * 2005-11-29 2007-05-30 Congatec AG Halbleitereinheit mit verbesserter Wärmekopplungsanordnung
US8395254B2 (en) * 2006-03-30 2013-03-12 Stats Chippac Ltd. Integrated circuit package system with heatspreader
JP2007288054A (ja) * 2006-04-19 2007-11-01 Toyota Motor Corp パワーモジュール
US8497162B1 (en) 2006-04-21 2013-07-30 Advanced Micro Devices, Inc. Lid attach process
US8952524B2 (en) * 2006-04-28 2015-02-10 Juniper Networks, Inc. Re-workable heat sink attachment assembly
US7256067B1 (en) 2006-05-01 2007-08-14 Advanced Micro Devices, Inc. LGA fixture for indium assembly process
US7513035B2 (en) * 2006-06-07 2009-04-07 Advanced Micro Devices, Inc. Method of integrated circuit packaging
US7651938B2 (en) 2006-06-07 2010-01-26 Advanced Micro Devices, Inc. Void reduction in indium thermal interface material
US20080124840A1 (en) * 2006-07-31 2008-05-29 Su Michael Z Electrical Insulating Layer for Metallic Thermal Interface Material
US7544542B2 (en) * 2006-08-07 2009-06-09 Advanced Micro Devices, Inc. Reduction of damage to thermal interface material due to asymmetrical load
US20080128897A1 (en) * 2006-12-05 2008-06-05 Tong Wa Chao Heat spreader for a multi-chip package
US20080142954A1 (en) * 2006-12-19 2008-06-19 Chuan Hu Multi-chip package having two or more heat spreaders
US7709951B2 (en) * 2007-03-16 2010-05-04 International Business Machines Corporation Thermal pillow
US7633151B2 (en) * 2007-03-16 2009-12-15 Advanced Micro Devices, Inc. Integrated circuit package lid with a wetting film
US8297986B2 (en) * 2007-03-16 2012-10-30 Globalfoundries Inc. Integrated circuit socket
US8678271B2 (en) * 2007-06-26 2014-03-25 Globalfoundries Inc. Method for preventing void formation in a solder joint
US7737550B2 (en) * 2007-08-30 2010-06-15 International Business Machines Corporation Optimization of electronic package geometry for thermal dissipation
US8952511B2 (en) * 2007-12-18 2015-02-10 Intel Corporation Integrated circuit package having bottom-side stiffener
CN101500391B (zh) * 2008-01-29 2012-08-29 瑞鼎科技股份有限公司 散热组件、包含散热组件的芯片及芯片散热组件制备方法
US7928562B2 (en) * 2008-07-22 2011-04-19 International Business Machines Corporation Segmentation of a die stack for 3D packaging thermal management
US7733655B2 (en) * 2008-07-22 2010-06-08 International Business Machines Corporation Lid edge capping load
US9142480B2 (en) * 2008-08-15 2015-09-22 Intel Corporation Microelectronic package with high temperature thermal interface material
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US8567483B2 (en) * 2009-11-06 2013-10-29 International Business Machines Corporation Heatsink with flexible base and height-adjusted cooling fins
US8938876B2 (en) 2010-05-06 2015-01-27 Advanced Micro Devices, Inc. Method of mounting a circuit board
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FR2977975A1 (fr) * 2011-07-13 2013-01-18 St Microelectronics Grenoble 2 Boitier electronique a via thermique et procede de fabrication
US20130037931A1 (en) * 2011-08-08 2013-02-14 Leo M. Higgins, III Semiconductor package with a heat spreader and method of making
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US8425246B1 (en) 2011-12-01 2013-04-23 Advanced Micro Devices, Inc. Low profile semiconductor device socket
US20130306293A1 (en) * 2012-05-21 2013-11-21 Hamilton Sundstrand Space Systems International Extruded matching set radiators
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US10510707B2 (en) * 2013-11-11 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Thermally conductive molding compound structure for heat dissipation in semiconductor packages
US9329646B2 (en) 2014-03-20 2016-05-03 Qualcomm Incorporated Multi-layer heat dissipating apparatus for an electronic device
US20170092618A1 (en) * 2015-09-24 2017-03-30 Intel Corporation Package topside ball grid array for ultra low z-height
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Also Published As

Publication number Publication date
MY138750A (en) 2009-07-31
EP1461831A2 (de) 2004-09-29
US20050139998A1 (en) 2005-06-30
AU2002340453A1 (en) 2003-07-24
WO2003058714A3 (en) 2003-10-16
WO2003058714A2 (en) 2003-07-17
CN100397630C (zh) 2008-06-25
DE60218898T2 (de) 2008-01-17
US7102226B2 (en) 2006-09-05
US6848172B2 (en) 2005-02-01
US20030115739A1 (en) 2003-06-26
US7256058B2 (en) 2007-08-14
EP1461831B1 (de) 2007-03-14
DE60218898D1 (de) 2007-04-26
CN1620724A (zh) 2005-05-25
US20070020813A1 (en) 2007-01-25

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