ATE358265T1 - Verfahren zur herstellung einer porösen metallwärmesenke - Google Patents

Verfahren zur herstellung einer porösen metallwärmesenke

Info

Publication number
ATE358265T1
ATE358265T1 AT01126385T AT01126385T ATE358265T1 AT E358265 T1 ATE358265 T1 AT E358265T1 AT 01126385 T AT01126385 T AT 01126385T AT 01126385 T AT01126385 T AT 01126385T AT E358265 T1 ATE358265 T1 AT E358265T1
Authority
AT
Austria
Prior art keywords
balls
heat sink
heat
fluid
metal
Prior art date
Application number
AT01126385T
Other languages
English (en)
Inventor
Craig Joseph
Kelly W Arnold
Seiji Kamada
Original Assignee
Bae Sys Land & Armaments Lp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bae Sys Land & Armaments Lp filed Critical Bae Sys Land & Armaments Lp
Application granted granted Critical
Publication of ATE358265T1 publication Critical patent/ATE358265T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Catalysts (AREA)
AT01126385T 2000-11-07 2001-11-07 Verfahren zur herstellung einer porösen metallwärmesenke ATE358265T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/708,183 US6347452B1 (en) 2000-11-07 2000-11-07 Method of manufacturing a porous metal heat sink

Publications (1)

Publication Number Publication Date
ATE358265T1 true ATE358265T1 (de) 2007-04-15

Family

ID=24844720

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01126385T ATE358265T1 (de) 2000-11-07 2001-11-07 Verfahren zur herstellung einer porösen metallwärmesenke

Country Status (4)

Country Link
US (1) US6347452B1 (de)
EP (1) EP1207366B8 (de)
AT (1) ATE358265T1 (de)
DE (1) DE60127509D1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030218057A1 (en) * 2000-11-07 2003-11-27 Craig Joseph Electrical bus with associated porous metal heat sink and method of manufacturing same
MXPA05003045A (es) * 2002-09-20 2005-05-27 Colgate Palmolive Co Cepillo de dientes electrico.
CN105583635B (zh) * 2016-03-23 2017-10-20 华南理工大学 一种高密高齿cpu散热器的自动化生产线

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3873805A (en) * 1961-12-26 1975-03-25 Inoue K Method of making a heat exchanger
US3732919A (en) * 1970-07-01 1973-05-15 J Wilson Heat exchanger
US3973718A (en) * 1973-06-06 1976-08-10 Deschamps Laboratories, Inc. Method of manufacturing a heat exchanger core
US4730665A (en) * 1983-07-14 1988-03-15 Technology Enterprises Company Apparatus for cooling high-density integrated circuit packages
US4884169A (en) * 1989-01-23 1989-11-28 Technology Enterprises Company Bubble generation in condensation wells for cooling high density integrated circuit chips
US6286212B1 (en) * 1996-05-29 2001-09-11 Manford L. Eaton Thermally conductive material and method of using the same

Also Published As

Publication number Publication date
EP1207366B8 (de) 2007-08-29
US6347452B1 (en) 2002-02-19
EP1207366A3 (de) 2004-08-25
EP1207366B1 (de) 2007-03-28
EP1207366A2 (de) 2002-05-22
DE60127509D1 (de) 2007-05-10

Similar Documents

Publication Publication Date Title
US5345106A (en) Electronic circuit component with heat sink mounted on a lead frame
DE4017697C2 (de) Elektronisches Bauelement, Verfahren zu dessen Herstellung und Verwendung
US5930601A (en) Heat assembly and method of transferring heat
US20100001395A1 (en) Semiconductor chip assembly with post/base heat spreader and vertical signal routing
US20110260200A1 (en) Method of fabricating non-metal led substrate and non-metal led substrate and method of fabricating led device using the non-metal led substrate and led device with the non-metal led substrate
US20110024785A1 (en) Light Emitting Diode Device
JP2004115337A (ja) アルミニウム−セラミックス接合体
JP4014549B2 (ja) ヒートシンク及びその製造方法
US10347601B1 (en) Power electronics assemblies with metal inverse opal bonding, electrical contact and cooling layers, and vehicles incorporating the same
JP4344764B2 (ja) 表面実装形電子部品の実装方法
ATE358265T1 (de) Verfahren zur herstellung einer porösen metallwärmesenke
KR20140034781A (ko) Ａｌ 냉각체를 포함하는 세라믹 인쇄 회로 보드
KR20050002601A (ko) 반도체 패키지용 리드 프레임
KR101735439B1 (ko) 히팅싱크패드가 삽입된 방열인쇄회로기판의 제조방법
KR100946755B1 (ko) 브레이징 접합층을 포함하는 열 확산기 및 이의 제조방법
JP2008227184A (ja) 金属ベース回路基板
CN221805505U (zh) 半导体封装结构
CN111933585A (zh) 一种高导热微波tr组件封装外壳及其加工方法
JPH0578956B2 (de)
KR970023906A (ko) Pcb 기판 형성방법 및 그를 이용한 bga 반도체 패키지 구조
JPH04230063A (ja) 多層ヒートシンク
JPH10284821A (ja) プリント配線板
CN211125633U (zh) 芯片表面连接系统及功率模块系统
JPS58151039A (ja) 混成集積回路基板
CN118019205A (zh) 用于提高功率放大器散热的垫片、制作方法及电子器件

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1207366

Country of ref document: EP