ATE362306T1 - Verfahren zur herstellung eines widerstands - Google Patents

Verfahren zur herstellung eines widerstands

Info

Publication number
ATE362306T1
ATE362306T1 AT99909448T AT99909448T ATE362306T1 AT E362306 T1 ATE362306 T1 AT E362306T1 AT 99909448 T AT99909448 T AT 99909448T AT 99909448 T AT99909448 T AT 99909448T AT E362306 T1 ATE362306 T1 AT E362306T1
Authority
AT
Austria
Prior art keywords
conductor
resistor
carrier
printed circuit
sectional area
Prior art date
Application number
AT99909448T
Other languages
English (en)
Inventor
Bo Wikstroem
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Obducat Ab filed Critical Obducat Ab
Application granted granted Critical
Publication of ATE362306T1 publication Critical patent/ATE362306T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/2416—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Weting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Details Of Resistors (AREA)
AT99909448T 1998-03-05 1999-03-05 Verfahren zur herstellung eines widerstands ATE362306T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9800707A SE511682C2 (sv) 1998-03-05 1998-03-05 Motstånd i elektriska ledare på eller i mönsterkort, substrat och halvledarbrickor

Publications (1)

Publication Number Publication Date
ATE362306T1 true ATE362306T1 (de) 2007-06-15

Family

ID=20410423

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99909448T ATE362306T1 (de) 1998-03-05 1999-03-05 Verfahren zur herstellung eines widerstands

Country Status (8)

Country Link
US (1) US6666980B1 (de)
EP (1) EP1060646B1 (de)
JP (1) JP4230108B2 (de)
AT (1) ATE362306T1 (de)
AU (1) AU2864599A (de)
DE (1) DE69936045T2 (de)
SE (1) SE511682C2 (de)
WO (1) WO1999045753A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US6921615B2 (en) 2000-07-16 2005-07-26 Board Of Regents, The University Of Texas System High-resolution overlay alignment methods for imprint lithography
EP2270592B1 (de) 2000-07-17 2015-09-02 Board of Regents, The University of Texas System Verfahren zur Bildung einer Struktur auf einem Substrat
US6954275B2 (en) 2000-08-01 2005-10-11 Boards Of Regents, The University Of Texas System Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography
JP2004523906A (ja) 2000-10-12 2004-08-05 ボード・オブ・リージエンツ，ザ・ユニバーシテイ・オブ・テキサス・システム 室温かつ低圧マイクロおよびナノ転写リソグラフィのためのテンプレート
US6964793B2 (en) 2002-05-16 2005-11-15 Board Of Regents, The University Of Texas System Method for fabricating nanoscale patterns in light curable compositions using an electric field
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US6916584B2 (en) 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US7071088B2 (en) 2002-08-23 2006-07-04 Molecular Imprints, Inc. Method for fabricating bulbous-shaped vias
US6929762B2 (en) 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes
US6871558B2 (en) 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
US7452574B2 (en) 2003-02-27 2008-11-18 Molecular Imprints, Inc. Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer
US7122079B2 (en) 2004-02-27 2006-10-17 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US7136150B2 (en) 2003-09-25 2006-11-14 Molecular Imprints, Inc. Imprint lithography template having opaque alignment marks
JP4419926B2 (ja) 2005-07-14 2010-02-24 セイコーエプソン株式会社 半導体装置
US8850980B2 (en) 2006-04-03 2014-10-07 Canon Nanotechnologies, Inc. Tessellated patterns in imprint lithography
US7547398B2 (en) 2006-04-18 2009-06-16 Molecular Imprints, Inc. Self-aligned process for fabricating imprint templates containing variously etched features
JP4826852B2 (ja) * 2009-07-09 2011-11-30 セイコーエプソン株式会社 半導体装置、電気光学装置及び電子機器
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2919433C2 (de) * 1979-05-15 1987-01-22 Robert Bosch Gmbh, 7000 Stuttgart Meßsonde zur Messung der Masse und/oder Temperatur eines strömenden Mediums
EP0163760A2 (de) * 1984-06-05 1985-12-11 Nippon Mektron, Ltd. Gedruckte Schaltung mit integriertem elektronischem Widerstand und Verfahren zu ihrer Herstellung
US5074629A (en) * 1988-10-26 1991-12-24 Stanford University Integrated variable focal length lens and its applications
US5356756A (en) * 1992-10-26 1994-10-18 The United States Of America As Represented By The Secretary Of Commerce Application of microsubstrates for materials processing
JPH08228064A (ja) * 1994-12-22 1996-09-03 Kanto Kasei Kogyo Kk プリント回路基板
EP0938597B1 (de) * 1996-09-06 2003-08-20 Obducat Aktiebolag Verfahren für das anisotrope ätzen von strukturen in leitende materialien
ES2224209T3 (es) * 1996-10-16 2005-03-01 Macdermid Incorporated Procedimiento para la fabricacion de placas de circuito impreso con resistencias metalizadas impresas.

Also Published As

Publication number Publication date
EP1060646B1 (de) 2007-05-09
JP4230108B2 (ja) 2009-02-25
SE511682C2 (sv) 1999-11-08
WO1999045753A1 (en) 1999-09-10
SE9800707L (sv) 1999-09-06
DE69936045D1 (de) 2007-06-21
EP1060646A1 (de) 2000-12-20
JP2002506293A (ja) 2002-02-26
US6666980B1 (en) 2003-12-23
SE9800707D0 (sv) 1998-03-05
DE69936045T2 (de) 2007-09-06
AU2864599A (en) 1999-09-20

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties