ATE366941T1 - Ic mit eingebauter karakteristikbestimmung - Google Patents

Ic mit eingebauter karakteristikbestimmung

Info

Publication number
ATE366941T1
ATE366941T1 AT04744458T AT04744458T ATE366941T1 AT E366941 T1 ATE366941 T1 AT E366941T1 AT 04744458 T AT04744458 T AT 04744458T AT 04744458 T AT04744458 T AT 04744458T AT E366941 T1 ATE366941 T1 AT E366941T1
Authority
AT
Austria
Prior art keywords
built
characterization
characteristics determination
consistent
integral
Prior art date
Application number
AT04744458T
Other languages
English (en)
Inventor
Kaam Kees Van
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE366941T1 publication Critical patent/ATE366941T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3187—Built-in tests
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31915—In-circuit Testers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AT04744458T 2003-07-09 2004-07-01 Ic mit eingebauter karakteristikbestimmung ATE366941T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03102062 2003-07-09

Publications (1)

Publication Number Publication Date
ATE366941T1 true ATE366941T1 (de) 2007-08-15

Family

ID=34042919

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04744458T ATE366941T1 (de) 2003-07-09 2004-07-01 Ic mit eingebauter karakteristikbestimmung

Country Status (9)

Country Link
US (1) US7475312B2 (de)
EP (1) EP1646883B8 (de)
JP (1) JP2007527110A (de)
KR (1) KR20060028810A (de)
CN (1) CN100592097C (de)
AT (1) ATE366941T1 (de)
DE (1) DE602004007525T2 (de)
TW (1) TW200508632A (de)
WO (1) WO2005006005A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8484524B2 (en) * 2007-08-21 2013-07-09 Qualcomm Incorporated Integrated circuit with self-test feature for validating functionality of external interfaces
US10768230B2 (en) * 2016-05-27 2020-09-08 International Business Machines Corporation Built-in device testing of integrated circuits
US10685730B1 (en) * 2018-03-20 2020-06-16 Seagate Technology Llc Circuit including efficient clocking for testing memory interface
US11879937B2 (en) 2018-10-01 2024-01-23 Volkswagen Aktiengesellschaft Method and device for monitoring the reliability of an electronic system

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7137048B2 (en) * 2001-02-02 2006-11-14 Rambus Inc. Method and apparatus for evaluating and optimizing a signaling system
JPH04212524A (ja) * 1990-12-06 1992-08-04 Matsushita Electric Ind Co Ltd 半導体集積回路
CN1032983C (zh) * 1991-01-26 1996-10-09 中国科学院广州电子技术研究所 半导体器件特性测试装置
US6466520B1 (en) * 1996-09-17 2002-10-15 Xilinx, Inc. Built-in AC self test using pulse generators
US5982189A (en) * 1997-05-14 1999-11-09 International Business Machines Corporation Built-in dynamic stress for integrated circuits
US6427217B1 (en) * 1999-04-15 2002-07-30 Agilent Technologies, Inc. System and method for scan assisted self-test of integrated circuits
DE19917884C1 (de) * 1999-04-20 2000-11-16 Siemens Ag Schaltung mit eingebautem Selbsttest
US6496947B1 (en) * 1999-10-25 2002-12-17 Lsi Logic Corporation Built-in self repair circuit with pause for data retention coverage
JP4048691B2 (ja) * 2000-04-27 2008-02-20 横河電機株式会社 Ｉｃ試験装置及びｉｃ試験方法
US6556938B1 (en) * 2000-08-29 2003-04-29 Agilent Technologies, Inc. Systems and methods for facilitating automated test equipment functionality within integrated circuits
JP4115676B2 (ja) * 2001-03-16 2008-07-09 株式会社東芝 半導体記憶装置
JP2003060049A (ja) * 2001-08-09 2003-02-28 Hitachi Ltd 半導体集積回路装置
US6889332B2 (en) * 2001-12-11 2005-05-03 Advanced Micro Devices, Inc. Variable maximum die temperature based on performance state
US6948080B2 (en) * 2002-01-09 2005-09-20 Raytheon Company System and method for minimizing upsets in digital microcircuits via ambient radiation monitoring
US7036062B2 (en) * 2002-10-02 2006-04-25 Teseda Corporation Single board DFT integrated circuit tester
US7017094B2 (en) * 2002-11-26 2006-03-21 International Business Machines Corporation Performance built-in self test system for a device and a method of use
JP2004260090A (ja) * 2003-02-27 2004-09-16 Renesas Technology Corp 半導体集積回路装置

Also Published As

Publication number Publication date
TW200508632A (en) 2005-03-01
US20060155500A1 (en) 2006-07-13
EP1646883B1 (de) 2007-07-11
EP1646883A1 (de) 2006-04-19
CN1820205A (zh) 2006-08-16
KR20060028810A (ko) 2006-04-03
EP1646883B8 (de) 2007-09-05
DE602004007525D1 (de) 2007-08-23
CN100592097C (zh) 2010-02-24
US7475312B2 (en) 2009-01-06
WO2005006005A1 (en) 2005-01-20
DE602004007525T2 (de) 2008-03-13
JP2007527110A (ja) 2007-09-20

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Legal Events

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